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WO/2001/077418A1 |
The present invention relates to a method for electrodepositing rare-earth (RE) and transition metal (TM) alloys from aqueous solutions. The method comprises preparation of an aqueous plating bath containing Re-chlorides, Tm-chloride, am...
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WO/2001/077025A1 |
The invention concerns a novel palladium sulphate and ethylenediamine complex salt containing 31 to 41 wt. % of palladium and wherein the mol ratio [SO¿4?]:[Pd] ranges between 0.9 and 1.15 and the ratio [ethylenediamine]:[Pd] ranges bet...
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WO/2001/075193A1 |
A method for electroplating of tantalum, characterized in that it comprises using an electrolytic bath comprising a molten salt comprising tantalum pentachloride, an alkylimidazolium chloride and a fluoride of an alkali metal or an alkal...
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WO/2001/073167A1 |
The invention concerns a process for the deposition of a silver-tin alloy from an acidic, cyanide-free electrolyte, containing silver ions, tin ions as well as a complexing agent. In order to provide a process which, despite the great di...
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WO/2001/066830A2 |
The invention relates to a method for applying a metal layer to surfaces of light metals. Iron of an aqueous deposition bath that contains Fe(II)-compounds is electrolytically deposited on the surfaces by means of dimensionally stable an...
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WO/2001/063016A1 |
A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release l...
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WO/2001/059185A2 |
The invention relates in general to a method of electroplating substrates where at least a portion of the substrate is coated with a solution containing a film forming amine and sufficient acid to produce a pH of less than 6.5. The acid ...
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WO/2001/058643A1 |
A modified plating solution that can be used to electroplate a high quality conductive material that can be effectively polished and planarized includes (1) a solvent, (2) an ionic species of the conductive material to be deposited, (3) ...
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WO/2001/056343A1 |
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...
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WO/2001/056344A1 |
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...
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WO/2001/056342A1 |
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...
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WO/2001/056345A1 |
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...
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WO/2001/053569A1 |
In embedding fine via holes or trenches of the wiring (LSI) pattern formed on a semiconductor wafer, a copper electroplating is carried out by using a copper electroplating solution containing an azole or a silane coupling agent, or a co...
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WO/2001/051681A2 |
The invention relates to an object with a coated surface, said coating is either made from a metal, or from a metal coating with a conversion layer, whereby the surface contains a visibly fluorescent or phosphorescent material. The coate...
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WO/2001/051688A2 |
An electrolyte for use in electrolytic platinum plating that results in reduced Cl, S, or P contaminant production. The bath comprises 0.01 to 320 g/lit of platinum in the form of the platinum salt dinitrodiammine platinum, [Pt(NH¿3?)¿...
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WO/2001/048272A1 |
An electrolytic copper foil, characterized in that 20 % or more of crystals in the lustrous face side thereof have twin structure; a method for manufacturing the electrolytic copper foil by an electrolysis process comprising preparing a ...
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WO/2001/048273A1 |
The invention relates to a bath for electrochemically depositing highly lustrous white rhodium layers and to a whitening agent for the same. Compounds of formula IR - SO¿m?-H (I), wherein m is a number 3 or 4 and R is a straight-chained...
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WO/2001/048267A1 |
A sliding member having a laminated hard Cr plating layer comprising a plurality of hard Cr plating layers laminated on the sliding surface thereof, wherein the individual hard Cr plating layer has fine cracks formed on the surface there...
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WO/2001/038609A1 |
The present invention relates to a method of producing a gold-copper-gallium (AuCuGa) alloy coating by electrodeposition on a substrate (2), using an aqueous electrolytic bath. The method is characterized in that the aqueous electrolytic...
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WO/2001/036696A1 |
The invention relates to a galvanically deposited lead, tin and copper-based bearing alloy, especially for producing sliding layers for sliding bearings and to a galvanic bath comprising lead, tin and copper. The invention also relates t...
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WO/2001/031093A1 |
An electroplating formulation and process is provided for electroplating an iron layer onto an aluminum or aluminum alloy substrate. The method entails immersing an iron-containing anode and an aluminum containing cathode in an electropl...
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WO/2001/027354A1 |
An electrolytic gold plating liquid which employs either gold compound of a gold salt or a gold complex as a gold source and contains a buffer, an organic gloss agent and a conductive salt, wherein a non-cyan electrolytic gold plating li...
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WO/2001/027355A1 |
The invention relates to a method for producing an electrolytically coated cold rolled strip, preferably for use in the production of battery sheaths. The cold rolled strip is provided with a cobalt or a cobalt alloy layer by an electrol...
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WO/2001/023090A1 |
The invention relates to a catalytically active nickel- and/or cobalt containing layer, a method for the production of said layer in addition to the use of a catalytically active nickel- and/or cobalt-containing layer.
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WO/2001/024239A1 |
The acid copper sulfate solutions used for electroplating copper circuitry in trenches and vias in IC dielectric material in the Damascene process are replaced with a type of plating system based on the use of highly complexing anions (e...
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WO/2001/023645A1 |
An electrodeposition method for the production of multilayer structures comprising substrates provided with layers of thin metal films of Co and Au by means of applying a current between two electrodes having a potential therebetween, im...
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WO/2001/021294A2 |
A process for depositing a metal structure, such as copper interconnects, on a surface of a workpiece (10), such as a semiconductor wafer, the workpiece surface defining a plurality of recessed microstructures (14). The surface of the wo...
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WO/2001/019606A1 |
This invention relates to a treated copper foil, comprising: a copper foil with a layer of zinc oxide adhered to the base surface of at least one side of said copper foil, said layer of zinc oxide having a thickness of about 3 Å to abou...
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WO/2001/020647A2 |
This invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is ...
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WO/2001/016402A1 |
A peelable electrolytic copper foil with carrier foil having a carrier foil (5), a bonding interface layer (8) formed on a surface thereof, and an electrolytic layer (5) formed by deposition on the interface layer, characterized in that ...
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WO/2001/016403A1 |
The invention relates to a novel galvanizing solution for the galvanic deposition of copper. Hydroxylamine sulfate or hydroxylamine hydrochloride are utilized as addition reagents and added to the galvanizing solution during the galvanic...
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WO/2001/014135A1 |
Electrolytic copper foil with carrier foil, which can easily form in a printed circuit board through holes (PTH) by a laser method, interstitial via holes (IVH) and blind via holes (BVH), and which is obtained by forming an organic surfa...
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WO/2001/012880A2 |
The invention relates to a method for the production of a self-supporting copper foil, which, due to its structure, presents low shear resistance, and can be embossed to have sharp edges. The copper foil is electrodeposited onto a cathod...
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WO/2001/011098A2 |
Method and system for controllable deposit of copper onto an exposed surface of a workpiece, such as a semiconductor surface. A seed thickness of copper is optionally deposited onto the exposed surface, preferably using oxygen-free liqui...
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WO/2001/011113A1 |
A black ruthenium plating solution, characterized as containing, as effective components in the solution, ruthenium sulfate, sulfamic acid, a thio compound and a sacrificial oxidizing agent being added for preventing the decomposition of...
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WO/2001/011932A1 |
An electroplating solution for fabricating a multilayer printed board in such a way that the top face of a via hole is generally flush with the top face of a conductor circuit in the same layer. The electroplating solution used for fabri...
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WO/2001/002627A1 |
A method and an aqueous electroplating solution for plating tarnish-resistant bluish-white antimony or antimony alloys containing at least one other metal from an aqueous acidic solution having a pH below about 6.0 at a temperature from ...
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WO/2001/002623A1 |
The invention relates to a method for the fabrication of products to improve the working characteristics of a product. Said method is characterized in that the basic treatment of an aqueous suspension of an ultradispersed diamondlike car...
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WO/2001/000425A1 |
The present invention relates to an article manufacturing method that involves preparing a preform and subsequently applying a coating on the surface thereof from an electrolyte suspension. Before applying the coating, the method involve...
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WO/2000/078514A1 |
A feed wheel (24) for use in a wood working machine (10), in which the feed wheel is rotated while in driving engagement with a wood piece to drive the wood piece past a wood working element. The feed wheel is preferably driveable in one...
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WO/2000/079030A1 |
The invention relates to a bath system for galvanic deposition of metals containing at least one metal, especially in the form of a precious metal and/or precious metal alloy in the form of a water-soluble salt, at least one water-solubl...
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WO/2000/079031A1 |
The invention relates to an acid bath for galvanic deposition of shining gold and gold alloy layers and to a brightener therefor, using compounds of formula (I): R - SO¿m?-H, wherein m represents 3 or 4 and R represents a straight or br...
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WO/2000/076621A1 |
Materials and methods for making and using magnetically enhanced composite materials are provided. Surfaces coated with compositions can be used to improve fuel cells, material separators, and other applications. A variety of devices can...
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WO/2000/073540A1 |
The invention relates inter alia to a method for producing a cyanide-free solution of a gold compound that is suitable for galvanic gold baths. Said method comprises the following steps: a) reacting a cysteine and/or a cysteinate with a ...
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WO/2000/068464A2 |
There is disclosed an electroplating bath for depositing zinc/manganese alloys on a substrate characterized in that it comprises an aqueous bath free or substantially free of ammonium halide and of fluoroborate which is made up from 10-1...
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WO/2000/068465A1 |
Disclosed is a technique for manufacturing an Ni-Fe alloy thin foil using an electrodeposition-based plating process of a single step without requiring processes such as melting, casting, forging, and rolling processes. A manufacturing a...
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WO/2000/068149A1 |
The specification describes novel rhodium sulfate complex solutions which have a minimum of metal to metal complexing and are mostly complexed through the sulfate groups. Use of these solutions as electrolytes for plating rhodium results...
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WO/2000/066812A1 |
The invention relates to an electroplating bath for coating cast parts, in particular, to the use of a polyethylenimine and of N-benzyl-nicotinate-betaine in the alkaline bath.
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WO/2000/063465A1 |
This invention is to provide environmentally functional active carbon and its method of manufacturing having improved adsorption capability against disease-source bacteria and microbes with prominent anti-bacterial and sterilizing effect...
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WO/2000/061498A2 |
A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make e...
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