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WO/2003/102277A1 |
A surface treatment copper foil that can satisfactorily ensure an adhesive strength with a low dielectric substrate for use in the constructing of a printed wiring board for high-frequency use and that can minimize transmission loss. In ...
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WO/2003/103025A2 |
The present invention provides a wafer carrier that includes a plurality of concentric sealing members that provide a seal, with the outer seal independently movable to allow cleaning of a peripheral backside of the wafer to occur while ...
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WO/2003/099490A1 |
The invention relates to a method for the galvanic coating of a continuous casting mould (2), according to which the inner surfaces (4) of said continuous casting mould (2) that delimit a mould cavity (3) are coated with a coating materi...
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WO/2003/100138A1 |
The copper laminate is produced by rolling a copper ingot down to a thickness equal or higher than 105 m, and then electroplating the rolled copper sheet with copper. The composite lamellar material, intended in particular for printed ci...
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WO/2003/095714A1 |
A process for producing a high temperature heat resisting carrier foil clad electrolytic copper foil from which detachment of a carrier foil is easy even after press working at 200ºC or higher. In particular, for example, a process for ...
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WO/2003/093524A2 |
A method and apparatus for providing a uniform current density across an immersed surface of a substrate during an immersion process. The method includes the steps of determining a time varying area of an immersed portion of the substrat...
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WO/2003/092911A1 |
The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are essentially free of compressive stress or are predominantly in a predetermined crystal ...
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WO/2003/094246A1 |
The invention concerns a method for making thin-film CIGS which consists in: electrochemically depositing on a substrate a layer of stoichiometry close to CuInSe2; then rapidly annealing said layer from a light source with pulses of suff...
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WO/2003/090965A1 |
A polishing method capable of energizing a polished object to the end of polishing with a stable current density distribution and allowing to use the other equipment such as conventional plating equipment and washing equipment and to per...
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WO/2003/092344A1 |
A flexible circuit printable board (1) can be favorably produced by a process composed of steps of forming in a polyimide film (4) having a metal coat (2, 3) on each surface side a via hole (6) penetrating at least one metal coat (3) and...
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WO/2003/089679A1 |
Process of masking cooling holes (4) of a gas turbine component (1) with an external surface (6), comprising a cavity (2) and a plurality of cooling holes (4) before coating the gas turbine component (1), comprising the steps of first ap...
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WO/2003/087436A1 |
In one aspect of the present invention, exemplary apparatus and methods are provided for electropolishing and/or electroplating processes for semiconductor wafers. One exemplary apparatus includes a cleaning module having an edge clean a...
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WO/2003/088316A2 |
In one aspect of the present invention, an exemplary method is provided for electroplating a conductive film on a wafer. The method includes electroplating a metal film on a semiconductor structure having recessed regions and non-recesse...
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WO/2003/087437A1 |
The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into ...
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WO/2003/085713A1 |
Embodiments of the invention may generally provide a method for plating a homogenous copper tin alloy onto a semiconductor substrate. The method generally includes providing a plating solution to a plating cell, wherein the plating solut...
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WO/2003/083185A1 |
To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plating printed circuit boards are proposed which provide measures for reducing an electric voltage...
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WO/2003/083184A1 |
The invention relates to a finishing installation comprising a container system (12) for receiving an electrolyte, in addition to a method for finishing elongated, metallic winding material (64), by means of a container system (12) consi...
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WO/2003/083182A2 |
The present invention provides a composition and method for void−free plating of a metal into high aspect ratio features. The plating process is carried out in a plating solution containing metal at a molar concentration of between abo...
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WO/2003/078698A1 |
The invention relates to an electrolytic copper plating method using a phosphorus−containing copper anode, characterized in that the phosphorus−containing copper anode used has a crystal grain size of 1,500 µm to 20,000 µm. A metho...
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WO/2003/076134A1 |
Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces.One embodiment of an electrochemical processing apparatus (100) in accordance with the invention comprises a workpiece holder (120) configure...
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WO2003006718B1 |
An Electro-chemical deposition method and apparatus that encapsulates a substrate's edge to prevent deposition thereon is generally provided. In one embodiment, the apparatus includes a contact ring, one or more electrical contact pads d...
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WO/2003/072853A2 |
A method and apparatus (100) for manually and automatically processing microelectronic workpieces (114). The apparatus can include a tool having a plurality of processing stations (150), all of which are manually accessible to a user, an...
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WO/2003/071007A1 |
Various embodiments of the invention present techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion (ELEX?TM¿) process. Preferred embodiments perform the extrusion processes via depositions throu...
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WO/2003/071008A2 |
Various embodiments of the invention present techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion (ELEXTM) process. Preferred embodiments perform the extrusion processes via depositions through ...
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WO/2003/071001A1 |
A solution for use in connection with the deposition of one or more metals on electroplatable substrates. This solution includes water; a metal ion; and a complexing agent. The complexing agent is advantageously an organic compound havin...
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WO/2003/071009A1 |
The invention relates to a method for electrically contacting a plane product in continuous electrolytic installations. The invention especially relates to the electrochemical treatment of printed circuit boards and conductive foils. Sai...
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WO/2003/068434A1 |
A method of producing metal hydride misch−metal composite powders comprising providing to a rotary flow−through electrodeposition apparatus a powder whose particles comprise one or more lanthanide alloy metals selected from the group...
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WO/2003/066263A1 |
The invention relates to a method for obtaining a determined flow resistance of a flow channel (1), especially an opening in a component (2), said method comprising the following steps: a liquid (3) flows through the flow channel (1); a ...
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WO/2003/065423A2 |
An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, and alloys/combinations thereof, into sub-micron features formed on a substrat...
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WO/2003/060959A2 |
The present invention is directed to a process for producing structures containing metallized features for use in microelectric workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the meta...
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WO/2003/060198A1 |
A tubular member (12) having an internal and/or external metal thread (18, 20) at one end thereof, at least part of the thread (18, 20) being coated with an alloy of copper and tin, said alloy containing 5 wt% to 95 wt% copper. The tubul...
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WO/2003/060203A1 |
The invention relates to a metal strip made from a layer composite for epitaxial coating and a method for production thereof. The aim of the invention is to produce such a high-strength metal strip and a corresponding production method. ...
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WO/2003/058696A1 |
A current concentration caused by an additive (especially, a brightener) remaining/depositing at a high density at a grain boundary triple-point and in a wiring groove portion in a copper-plating film surface layer is eliminated to restr...
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WO/2003/058655A1 |
Introduction of a liquefied gas solution for deposition of a material on a semiconductor substrate. The substrate can have a trench etched thereinto with the solution including ions of the material to be deposited in the trench. The subs...
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WO/2003/056609A2 |
The present invention provides for a method of electroplating a wafer surface comprising introducing a plating liquid to the wafer surface in a chamber and rotating the wafer about an axis of rotation passing through the surface to be pl...
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WO/2003/056058A1 |
This invention relates to a method of producing a composite electroconductive material by electroconducted treating an insulated substrate, in which applying a metal coat on the substrate by vacuum ion supttering under Ar, wherein the co...
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WO/2003/053621A2 |
The invention concerns an electrode wire comprising an unalloyed copper core (16) coated with a diffused zinc alloy coating layer (17), whereof the thickness (E) is more than 10 % of the wire diameter. The coating layer (17) is optionall...
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WO/2003/050328A1 |
Problem: It has been desired to form a plurality of combinations of plating films continuously on a single transfer rail and to form a plating film having a high quality and a uniform thickness on the surfaces of a lead frame and leads. ...
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WO/2003/048864A1 |
A mask forming method capable of reducing production costs. A mask forming method for forming a mask on the surface of a member to be treated so as to form a desired pattern using a liquid pattern material, comprising the first step (S15...
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WO/2003/048423A1 |
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblY (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the wo...
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WO/2003/048427A2 |
The invention relates to a method for applying electro-deposited metal coatings (3) upon aluminium or aluminium alloy components (1). According to said method, the surface (4) of the component is cleaned in an appropriate solution, in pa...
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WO/2003/048429A1 |
An copper electroplating method for performing copper electroplating by using an anode formed of pure copper in which the grain size of the pure copper anode is not greater than 10 µm, or not smaller than 60 µm, or pure copper non−re...
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WO2002016059B1 |
Tubular needles have a reduced inner diameter tip portion (12) that increases back pressure behind the tip portion (11). This constricted tip portion promotes improved atomization, particularly when the liquid passes through the needle a...
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WO/2003/044247A1 |
According to the invention, silicon nanoparticles are applied to a substrate using an electrochemical plating process, analogous to metal plating. An electrolysis tank of an aqueous or non-aqueous solution, such as alcohol, ether, or oth...
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WO/2003/044246A1 |
The invention includes anodes for electroplating baths. The anodes have a purity of at least 99.9%, and comprise one or more of silver, gold, nickel, chromium, copper or various solder compositions. The anodes can, for example, comprise ...
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WO/2003/042433A1 |
In one aspect of the present invention, an exemplary apparatus and method are provided for electropolishing a conductive film on a wafer (1004). An apparatus includes a wafer chuck (1002) for holding a wafer, an actuator (1000) for rotat...
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WO/2003/041126A2 |
The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution...
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WO/2003/038149A1 |
A surface−treated copper foil, which has a heat resistance treatment layer and an olefin type silane coupling agent layer being provided in this order on at least one surface of the copper foil. A rust preventive layer may be provided ...
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WO/2003/038158A2 |
The invention relates to an electroplating device (10) for electrodepositing an electroconductive layer onto a substrate (12). Said device comprises an electrolyte bath (14) in which an anode device (30) and at least one contacting unit ...
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WO/2003/036693A2 |
Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.
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