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WO/2003/087436A1 |
In one aspect of the present invention, exemplary apparatus and methods are provided for electropolishing and/or electroplating processes for semiconductor wafers. One exemplary apparatus includes a cleaning module having an edge clean a...
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WO/2003/088316A2 |
In one aspect of the present invention, an exemplary method is provided for electroplating a conductive film on a wafer. The method includes electroplating a metal film on a semiconductor structure having recessed regions and non-recesse...
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WO/2003/087437A1 |
The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into ...
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WO/2003/085713A1 |
Embodiments of the invention may generally provide a method for plating a homogenous copper tin alloy onto a semiconductor substrate. The method generally includes providing a plating solution to a plating cell, wherein the plating solut...
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WO/2003/083185A1 |
To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plating printed circuit boards are proposed which provide measures for reducing an electric voltage...
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WO/2003/083184A1 |
The invention relates to a finishing installation comprising a container system (12) for receiving an electrolyte, in addition to a method for finishing elongated, metallic winding material (64), by means of a container system (12) consi...
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WO/2003/083182A2 |
The present invention provides a composition and method for void−free plating of a metal into high aspect ratio features. The plating process is carried out in a plating solution containing metal at a molar concentration of between abo...
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WO/2003/078698A1 |
The invention relates to an electrolytic copper plating method using a phosphorus−containing copper anode, characterized in that the phosphorus−containing copper anode used has a crystal grain size of 1,500 µm to 20,000 µm. A metho...
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WO/2003/076134A1 |
Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces.One embodiment of an electrochemical processing apparatus (100) in accordance with the invention comprises a workpiece holder (120) configure...
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WO2003006718B1 |
An Electro-chemical deposition method and apparatus that encapsulates a substrate's edge to prevent deposition thereon is generally provided. In one embodiment, the apparatus includes a contact ring, one or more electrical contact pads d...
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WO/2003/072853A2 |
A method and apparatus (100) for manually and automatically processing microelectronic workpieces (114). The apparatus can include a tool having a plurality of processing stations (150), all of which are manually accessible to a user, an...
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WO/2003/071007A1 |
Various embodiments of the invention present techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion (ELEX?TM¿) process. Preferred embodiments perform the extrusion processes via depositions throu...
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WO/2003/071008A2 |
Various embodiments of the invention present techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion (ELEXTM) process. Preferred embodiments perform the extrusion processes via depositions through ...
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WO/2003/071001A1 |
A solution for use in connection with the deposition of one or more metals on electroplatable substrates. This solution includes water; a metal ion; and a complexing agent. The complexing agent is advantageously an organic compound havin...
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WO/2003/071009A1 |
The invention relates to a method for electrically contacting a plane product in continuous electrolytic installations. The invention especially relates to the electrochemical treatment of printed circuit boards and conductive foils. Sai...
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WO/2003/068434A1 |
A method of producing metal hydride misch−metal composite powders comprising providing to a rotary flow−through electrodeposition apparatus a powder whose particles comprise one or more lanthanide alloy metals selected from the group...
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WO/2003/066263A1 |
The invention relates to a method for obtaining a determined flow resistance of a flow channel (1), especially an opening in a component (2), said method comprising the following steps: a liquid (3) flows through the flow channel (1); a ...
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WO/2003/065423A2 |
An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, and alloys/combinations thereof, into sub-micron features formed on a substrat...
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WO/2003/060959A2 |
The present invention is directed to a process for producing structures containing metallized features for use in microelectric workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the meta...
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WO/2003/060198A1 |
A tubular member (12) having an internal and/or external metal thread (18, 20) at one end thereof, at least part of the thread (18, 20) being coated with an alloy of copper and tin, said alloy containing 5 wt% to 95 wt% copper. The tubul...
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WO/2003/060203A1 |
The invention relates to a metal strip made from a layer composite for epitaxial coating and a method for production thereof. The aim of the invention is to produce such a high-strength metal strip and a corresponding production method. ...
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WO/2003/058696A1 |
A current concentration caused by an additive (especially, a brightener) remaining/depositing at a high density at a grain boundary triple-point and in a wiring groove portion in a copper-plating film surface layer is eliminated to restr...
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WO/2003/058655A1 |
Introduction of a liquefied gas solution for deposition of a material on a semiconductor substrate. The substrate can have a trench etched thereinto with the solution including ions of the material to be deposited in the trench. The subs...
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WO/2003/056609A2 |
The present invention provides for a method of electroplating a wafer surface comprising introducing a plating liquid to the wafer surface in a chamber and rotating the wafer about an axis of rotation passing through the surface to be pl...
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WO/2003/056058A1 |
This invention relates to a method of producing a composite electroconductive material by electroconducted treating an insulated substrate, in which applying a metal coat on the substrate by vacuum ion supttering under Ar, wherein the co...
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WO/2003/053621A2 |
The invention concerns an electrode wire comprising an unalloyed copper core (16) coated with a diffused zinc alloy coating layer (17), whereof the thickness (E) is more than 10 % of the wire diameter. The coating layer (17) is optionall...
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WO/2003/050328A1 |
Problem: It has been desired to form a plurality of combinations of plating films continuously on a single transfer rail and to form a plating film having a high quality and a uniform thickness on the surfaces of a lead frame and leads. ...
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WO/2003/048864A1 |
A mask forming method capable of reducing production costs. A mask forming method for forming a mask on the surface of a member to be treated so as to form a desired pattern using a liquid pattern material, comprising the first step (S15...
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WO/2003/048423A1 |
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblY (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the wo...
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WO/2003/048427A2 |
The invention relates to a method for applying electro-deposited metal coatings (3) upon aluminium or aluminium alloy components (1). According to said method, the surface (4) of the component is cleaned in an appropriate solution, in pa...
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WO/2003/048429A1 |
An copper electroplating method for performing copper electroplating by using an anode formed of pure copper in which the grain size of the pure copper anode is not greater than 10 µm, or not smaller than 60 µm, or pure copper non−re...
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WO2002016059B1 |
Tubular needles have a reduced inner diameter tip portion (12) that increases back pressure behind the tip portion (11). This constricted tip portion promotes improved atomization, particularly when the liquid passes through the needle a...
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WO/2003/044247A1 |
According to the invention, silicon nanoparticles are applied to a substrate using an electrochemical plating process, analogous to metal plating. An electrolysis tank of an aqueous or non-aqueous solution, such as alcohol, ether, or oth...
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WO/2003/044246A1 |
The invention includes anodes for electroplating baths. The anodes have a purity of at least 99.9%, and comprise one or more of silver, gold, nickel, chromium, copper or various solder compositions. The anodes can, for example, comprise ...
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WO/2003/042433A1 |
In one aspect of the present invention, an exemplary apparatus and method are provided for electropolishing a conductive film on a wafer (1004). An apparatus includes a wafer chuck (1002) for holding a wafer, an actuator (1000) for rotat...
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WO/2003/041126A2 |
The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution...
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WO/2003/038149A1 |
A surface−treated copper foil, which has a heat resistance treatment layer and an olefin type silane coupling agent layer being provided in this order on at least one surface of the copper foil. A rust preventive layer may be provided ...
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WO/2003/038158A2 |
The invention relates to an electroplating device (10) for electrodepositing an electroconductive layer onto a substrate (12). Said device comprises an electrolyte bath (14) in which an anode device (30) and at least one contacting unit ...
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WO/2003/036693A2 |
Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.
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WO/2003/035943A1 |
An electrolytic copper plating method characterized by carrying out electrolytic copper plating by using phosphorus−containing copper as an anode, wherein the crystal particle size of the phosphorus−containing copper anode is 10−15...
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WO/2003/036710A1 |
A bonding wire having a core material containing copper as a primary component and, formed thereon, a coating layer, characterized in that the coating layer comprises an oxidation−resistant metal having a melting point higher than that...
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WO/2003/034478A2 |
An apparatus and method for securing and electrically contacting a substrate on a non-production surface of the substrate. The apparatus includes a substrate holder assembly (500) having a substrate engaging surface formed thereon, the s...
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WO/2003/033765A1 |
There is provided a plating apparatus which can keep a plating solution always in its optimal condition while minimizing the amount of plating solution used, and which can easily form a uniform plated film on the plating surface of a wor...
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WO/2003/033774A1 |
A submerged transfer plating device for plating sheet−like rectangular products (W) while the products are transferred in plating fluid (A), comprising a plating fluid jetting device for jetting plating fluid toward the sheet−like re...
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WO/2003/033772A1 |
The invention relates to a method for the production of metallically conductive surface areas on light metal alloys by coating with a layer containing Sn and by subsequent laser bombardment. Optionally, the layer can be lacquered prior t...
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WO/2003/033773A1 |
An improved plating method in which non-plated vias or through holes (68a-68d) are temporarily metalized for use as busses during selective noble metal plating and subsequently de-metalized to prevent shorting together of the nobly plate...
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WO/2003/033770A2 |
The present invention includes an electrolytic plating system with an elecrolytic plating bath, means for positioning the printed circuit boards in the bath, and means to alternately generate a laminar flow of electrolyte on each side of...
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WO/2003/030584A2 |
An improved implantable hearing aid apparatus and related method of manufacture are disclosed. The inventive apparatus and method utilize electrodeposition techniques to yield enhanced sealing of implanted componentry. In one embodiment ...
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WO/2003/030186A2 |
The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passibe circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copp...
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WO/2003/028048A2 |
The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece surface. The system includes a workpiec...
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