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WO/2003/025258A1 |
The aim of the invention is to produce a composite material layer with several method steps and combines the advantageous material properties of the applied materials. Said aim is achieved, by the application of the method steps of elect...
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WO/2003/025255A2 |
The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper (40), that preferential...
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WO/2003/025259A1 |
The invention relates to electroplating. In particular, the invention relates to an improved anode for electroplating metals onto substrates, and to a method of electroplating metals onto substrates utilizing the anode. The anode has a s...
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WO2002077327B1 |
The present invention includes a mask plate design that includes at least one or a plurality of channels portions on a surface of the mask plate, into which electrolyte solution will accumulate when the mask plate surface is disposed on ...
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WO/2003/025368A1 |
A ferrous cylinder liner (14) for use in diesel engines (10) having exhaust gas recirculation (EGR) is protected from corrosive attack from the EGR environment by first final machining the inner running surface of the liner (14) and ther...
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WO/2003/024594A2 |
Methods of forming a nano-supported catalyst on a substrate and at least one carbon nanotube on the substrate are comprised of configuring a substrate with an electrode (102), immersing the substrate with the electrode into a solvent con...
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WO2002070144A9 |
An improved method and plating system (100) comprising a plurality of non-electrically conductive shields (130) forming an elongated upper channel (122) and an elongated lower channel (121); a plating solution sparger comprising a series...
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WO2002031218B1 |
The invention encompasses a method of forming a container-shaped physical vapor deposition target. A conductive material (56) is provided in a container-shape. The container-shape comprises an interior region and an exterior region, and ...
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WO/2003/023848A2 |
Apparatus and method for treating a surface of a substrate for electrolytic or electroless plating of metals in integrated circuit manufacturing. In one embodiment the method includes forming a barrier layer (16) on a substrate. A metalâ...
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WO/2003/021008A1 |
A tin electroplating solution, characterized in that it has a pH of 1.5 to 6.0 and comprises the following components: (1) 5 to 60 g&sol L of a tin(II) ion, (2) a complexing agent, (3) a surfactant and (4) 0.01 to 0.5 g&sol L of a bismut...
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WO/2003/018874A2 |
A processing chamber comprising a reaction vessel having an electro−reaction cell (420) including a virtual electrode (430) unit, an electrode assembly (414) disposed relative to the electro−reaction cell to be in fluid communication...
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WO/2003/018878A2 |
In order to even out the electrolytic treatment of workpieces 9 made of electrically non-conductive material and having a very thin base metallising 6, 8, a device is employed in a manner according to the invention comprising means for b...
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WO/2003/019641A1 |
A semiconductor structure for providing metal interconnections (140) and a method for electropolishing a metal layer on a semiconductor structure. A semiconductor structure includes a dielectric layer (151) with recessed areas (151r) and...
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WO/2003/018881A1 |
The invention concerns a device for deposition of a layer (30) along a specific pattern (20) on the upper surface (18) of a metal strip (16), of the type comprising an upper mask (12) unwinding with the strip (16). The invention is chara...
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WO/2003/016182A1 |
A belt apparatus 10 is provided for holding strips of lead frames 38 during treatment. It comprises a belt 12 and attached clips 14. The clips 14 are attached to the belt 12 at only one end. Their free ends, being the clamping ends 36, a...
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WO/2003/015870A2 |
A radiolabeled implantable device includes a base, a first layer including Cu and a radioactive isotope on the base, and a second layer including Sn on the first layer. Preferably, the base is formed of stainless steel and the radioactiv...
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WO/2003/014426A1 |
A method for producing electroconductive particles wherein a plating layer is formed on the surface of particles to be plated by the use of a barrel plating device which has a rotary barrel in the plating vessel thereof, characterized in...
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WO/2003/015483A1 |
A copper foil excellent in selective (resistance circuit layer or copper layer) etching property required when producing a printed wiring board, and also excellent in UL heat resistance. A printed wiring board−use copper foil (1), whic...
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WO/2003/014425A1 |
A composite for use if forming a multi-layer printed circuit board, comprised of an INVAR sheet (12) having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper (72) on at least one side thereof. The copper ha...
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WO/2003/012174A1 |
An electrolytic process for depositing copper on a steel wire in which said wire travels through an acidic electrolytic bath of an aqueous solution of Cu?2+¿ ions in the form of a salt of an acid, a direct electric current passing throu...
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WO/2003/012175A2 |
The invention relates to a method for selectively electroplating a strip-shaped, metal support material (10) in a continuous process, especially a strip of support material with prepunched contact elements. The inventive method is charac...
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WO/2003/012845A1 |
Annealing is performed after forming a seed film by a physical vapor deposition (PVD) method in order to satisfactorily form a seed film and a wiring metal thin film that constitute a dual damascene structure in a semiconductor device, a...
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WO/2003/010359A1 |
Fluid flow processing equipment, wherein plating solution (17) at the portion other than near a fluid level is prevented from flowing by a first partition plate (15) having a lower end fitted to the bottom part of a plating bath (11) and...
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WO/2003/010364A2 |
A method for depositing a metal on a substrate is provided. The metal is deposited by sequentially applying a electrodeposition pulse followed by an electrodissolution pulse to the substrate. After each electrodissolution pulse an before...
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WO/2003/010368A1 |
Apparatus for securing a substrate in an electrochemical deposition system are provided. In one aspect, an apparatus is provided for securing a substrate in an electrochemical deposition system having a contact ring for contacting a plat...
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WO/2003/010365A1 |
A baffling plate (7) having an opening is interposed between a semiconductor substrate (a to−be−plated substrate) (4) and an anode (5). The periphery of the opening is shorter than the edge of the semiconductor substrate (4) by a pre...
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WO/2003/009361A2 |
The present invention relates to a method for forming a planar conductive surface on a wafer. In one aspect, the present invention uses a no-contact process with electrochemical deposition, followed by a contact process with electrochemi...
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WO/2003/008660A1 |
This invention relates to a method of depositing a tantalum film in which $g(a)-Ta dominates and to methods of electroplating copper using such films. The films have a thickness of less than 300 nm and are formed by depositing a seed lay...
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WO/2003/008671A1 |
A peelable composite foil comprises a metallic carrier foil; a first barrier layer on one side of the metallic carrier foil; a second metallic layer on the first barrier layer, the second metallic layer comprising a combination of a meta...
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WO2002088592A9 |
Impregnation of water and oil into a coating film can be positively shut off, the coating film can be brought into closer contact, and corrosion resistance and chemical resistance can be significantly increased. A plating layer (4) is fo...
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WO/2003/009343A2 |
A plating apparatus for plating a substrate comprises a processing section (12) defined in a clean room, processing units (5, 6) disposed within the processing section (12) for processing the substrate, a plating section (14) defined in ...
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WO/2003/006193A1 |
The invention relates to a continuous casting roll for casting molten baths, especially steel molten baths. Said casting roll comprises a roll barrel (2) consisting of a metallic material, to which a layer (4) of metallic material is app...
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WO/2003/005430A2 |
A method for a controlling a plating process layer (160) on a wafer in accordance with a recipe; measuring a thickness of the process layer (160); and determining at least one plating parameter of the recipe for subsequently formed proce...
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WO/2003/002786A1 |
An electroplating method and a printed wiring board manufacturing method in which a conductive layer (114) is formed directly on a wiring pattern (110A) inclduing first electrodes (111), a wiring (112), and second electrodes (113)&semi a...
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WO/2003/001250A1 |
In a method for achieving a required mirror surface on an aluminium workpiece (1), four different production steps (A, B, C, D) are used. In a first production step, an initial surface (1a) is produced by the aluminium workpiece undergoi...
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WO/2003/000937A2 |
The invention relates to a method for heat-treating a cold-rolled strip with an Ni and/or Co surface coating and incorporated non-metal elements C and/or S, and optionally adding Fe, In, Pd, Au and/or Bi, said cold-rolled strip having a ...
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WO/2002/103165A1 |
A method for forming an abrasion−resistant layer for a moving blade, characterized in that it comprises a step of forming a first plating layer on a base material (11), a step of applying a nickel plating having alloy particles compris...
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WO/2002/103085A1 |
The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is ...
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WO/2002/103457A1 |
The invention relates to data carriers marking by means of protective holograms using a hologram property to modify the spatial position and the colour of a restored image when the orientation of said hologram is modified in relation to ...
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WO/2002/103782A2 |
A damascene process for introducing copper into metallization layers in microelectronic structures includes a step of forming an enhancement layer (24) of a metal alloy, such as a copper alloy or Co−W−P, over the barrier layer (16), ...
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WO/2002/103086A1 |
A connector wire (1) which is used as a connector material of a component of an electric or electronic device, and a manufacturing method thereof. The connector wire (1) has a lower plating layer comprising two layers, i.e., a nickel pla...
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WO/2002/100136A1 |
A composite copper foil having a copper or copper alloy support body, characterized by comprising a nickel layer covered with oxide film between the copper or copper alloy support body and a very thin copper foil on the support body side...
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WO/2002/098194A1 |
A copper plated circuit layer−carrying copper clad laminated sheet capable of providing the aspect ratio of a circuit shape which is obtained when the laminated sheet is worked into a fine−pitch−circuit−provided printed wiring bo...
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WO/2002/097165A2 |
An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel (204). The reaction vessel includes: an outer container (220) having an outer wall (222); a fist outlet configured to introduce a p...
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WO/2002/092242A1 |
One form of the present invention is a method for mask-less selective deposition made up of the steps of contacting a first portion of a substrate with a chemical agent that binds to the substrate to affect the susceptibility of the port...
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WO/2002/090816A1 |
A multi−layer coated tube (1) connected through a flare nut (10) and capable of assuring sufficient corrosion resistance and chemical resistance to oil and water since the flare nut can be used without working, for example, contracting...
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WO/2002/090624A2 |
A process and apparatus for cleaning an electrically conductive surface by arranging for the surface to form the surface of a cathode of an electrolytic cell in which the anode is maintained at a DC voltage in excess of 30v and an electr...
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WO/2002/088431A1 |
An anode assembly (9) by which a solution can be supplied to a surface of a semiconductor substrate includes a housing defining an internal housing volume into which the solution can flow. A closure is provided for the internal housing v...
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WO/2002/086961A1 |
In electropolishing a metal layer on a semiconductor wafer, a dielectric layer (100) is formed on the semiconductor wafer (not shown). The dielectric layer (100) is formed with a recessed (102) area and a non-recessed (103) area. A plura...
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WO/2002/083968A2 |
An article is coated with a multi-layer coating having a stainless steel color (Figure 3). The coating comprises an electroplated layer or layers on the article surface, a refractory metal or refractory metal alloy strike layer on the el...
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