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WO/2017/011339A1 |
Interconnection meter socket adapters are provided. An interconnection meter socket adapter comprises a housing enclosing a set of electrical connections. The interconnection meter socket adapter may be configured to be coupled to a stan...
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WO/2017/007200A2 |
A test socket manufacturing method comprises the steps of: preparing a PCB, which is provided with a bonding pad; bonding a conductive wire on the bonding pad; mounting a space, which exposes the bonding pad, on the upper surface of the ...
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WO/2016/195251A1 |
The present invention relates to a rubber socket for a semiconductor test that can be manufactured with a low cost and can prevent an electric shock from being applied to a semiconductor package in a process of testing the semiconductor ...
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WO/2016/176469A1 |
Multiple pin probes and methods for controlling such multiple pin probes to support parallel measurements are disclosed. The method may include: establishing electrical contact between a multiple pin probe and a subject of measurement; s...
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WO/2016/155937A1 |
The invention relates to a method for producing a contact spacing converter (4) (space transformer) which has electrical contacts (9) that form electrical paths (10) and in which a first contact spacing of the contacts (9) is converted i...
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WO/2016/107859A1 |
It is described a manufacturing method of contact probes (10) for a testing head (18) comprising the steps of: providing a substrate (11) made of a conductive material; and - defining at least one contact probe (10) by laser cutting the ...
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WO/2016/107756A1 |
It is described a manufacturing method of a semi-finished product (15) comprising a plurality of contact probes (10) for a testing head of electronic devices, the method comprising the steps of: - providing a substrate (11) made of a con...
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WO/2016/068541A1 |
The present invention relates to an electrical connector for electrically connecting a device to be tested with a testing device, and a manufacturing method therefor, wherein the electrical connector improves high-current characteristics...
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WO/2016/045614A1 |
Provided are a single-chip differential free layer push-pull magnetic field sensor bridge and preparation method, the magnetic field sensor bridge comprising: a substrate (4), a staggered soft magnetic flux concentrator array (11, 12), a...
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WO/2015/156653A1 |
The present invention relates to a method for manufacturing a test sheet, the test sheet being arranged between a terminal of a device to be tested and a pad of a test device so as to electrically connect the terminal and the pad to each...
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WO/2015/153063A1 |
This disclosure provides for an electrical probe, which can include a shell extending along a longitudinal axis and defining an internal cavity with an opening at a first end, where the shell can include a neck portion defined by a hollo...
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WO/2015/144073A1 |
A single-chip three-axis magnetic field sensor and a preparation method therefor. The sensor comprises an X-axis sensor (3), a Y-axis sensor (4) and a Z-axis sensor (5) which are integratedly arranged on the same substrate (1), wherein t...
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WO/2015/006625A2 |
The test system provides an array of test probes having a cross beam. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. The probes ar...
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WO/2014/101984A1 |
The present invention relates to a measuring tip comprising a base body, at least two measuring conductors that are connected to the base body, and at least two connecting conductors, a first connecting conductor being electrically condu...
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WO/2014/060105A1 |
The invention relates to a measurement device in which voltage and/or a current sensor in a casted measurement device housing, wherein the sensor component is connected with a externally ending output connector by a signal wire, and with...
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WO/2013/192322A2 |
A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). The elastomer is pre...
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WO/2013/192374A2 |
A disassociated split sensor coil manufactured from hemi-toroidal cores. The cores each include a surface channel extending from end to end, with wire sections being wound about core to form helical sensor coils electrically connected to...
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WO/2013/159584A1 |
A micro-mechanical magnetic field sensor and a preparation method thereof relate to the field of micro-electro-mechanical systems. The preparation method comprises: manufacturing a metal coil (40) and pads (310, 311, 5) on a device struc...
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WO/2013/131651A1 |
The present invention relates to a device for measuring electronic components having a plurality of conductors applied to a dielectric cable carrier, which conductors are each connected both to a contact finger and to a connection contac...
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WO/2013/016382A2 |
A system for measuring current includes a current monitoring system comprises a current sensor configured to sense a first current passing through a conductor and a voltage conversion device coupled to the current sensor and configured t...
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WO/2012/086979A1 |
The present invention relates to a method for manufacturing a 4-point probe holder using a single crystal, and to a single crystal 4-point probe holder manufactured by same comprising a substrate, and the 4-point probe holder which is co...
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WO/2011/129557A2 |
The present invention provides a probe sheet. The probe sheet comprises: a first wiring region having a plurality of first wiring sets arranged thereon, with each wiring set being composed of a preset number of wires, the first wiring re...
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WO/2011/034280A2 |
The present invention relates to a superconducting quantum interference device (SQUID) sensor and to a method for manufacturing same. The SQUID sensor of the present invention comprises a wound detection coil for detecting a fine magneti...
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WO/2011/019160A2 |
The present invention relates to a probe to be used in a semiconductor test or a flat panel display device test, and to a method for manufacturing same. The probe comprises: a plurality of probe beams which are equidistantly spaced apart...
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WO/2011/015659A1 |
The invention concerns a base part for a medication delivery device. The base part is during use fastened to a patient's skin and connected to a cannula part which cannula part is positioned at least partly subcutaneous. The base part is...
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WO/2010/077744A1 |
A system is provided for cleaning of probe contacts. The system includes a base plate comprising three mounting means for receiving each an adjustable attachment means, and means for connecting the base plate to a probe machine; and a cl...
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WO/2010/043196A1 |
The invention relates to a device for positioning and contacting test contacts (20) on a contact carrier for producing a test contact arrangement, comprising at least one contact head having at least one transmission channel (24) for tra...
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WO/2010/023344A1 |
The invention describes an ultrasonic device that is useful for the emission of acoustic waves in air in the ultrasonic range, which comprises, amongst other elements, a resonant cavity (5) with one or more apertures (7) for generating s...
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WO/2010/000689A1 |
An embodiment of the invention refers to a method for manufacturing a sensor device (5) suitable for measuring an electric field (E). In the method, a nanotube (35) capable of oscillating is disposed between a primary electrode (20) and ...
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WO/2009/105222A2 |
An interposer (2) with a conductive housing (18) is disclosed. Conductive members (10) pass through insulators (14) positioned in openings in the conductive housing. The conductive housing may be grounded, providing a closely spaced grou...
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WO/2008/127242A1 |
Provided is a dual arcuate blade probe tip (100) for probing a node, such as a node hole (1800), on a circuit. The probe has a shaft (104) made from an electrically conductive material, concentric to a longitudinal probe axis (102), and ...
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WO/2008/127241A1 |
Provided is a pronged fork probe tip (100) for probing a node, such as a through-hole node (1900), on a circuit. The probe tip (100) has a shaft (104) made from an electrically conductive material, concentric to a longitudinal probe axis...
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WO/2008/008232A2 |
A probe having a conductive body and a contacting tip that is terminated by one or more blunt skates for engaging a conductive pad of a device under test (DUT) for performing electrical' testing. The contacting tip has a certain width an...
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WO/2007/100713A2 |
An approach is provided for fabricating cantilever probes. The approach generally includes using various techniques to secure a cantilever probe in a manner to allow a tip to be created on the cantilever probe. For example, embodiments o...
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WO/2007/100761A2 |
The use of a superconducting resonator with continuous-wave (CW) excitation allows low-noise quadrupole resonance (QR) detection without the need for a lock-in amplifier. This allows detection times to be greatly reduced. Hence, for the ...
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WO/2007/098291A2 |
A method for fabricating beams for a probe card includes dividing a large beam panel (106) into smaller sub-panels (108) before attaching the beams to corresponding posts on a substrate. Each sub-panel may have a sufficient number of bea...
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WO/2007/098290A2 |
An approach is provided for fabricating probe elements for probe card assemblies. Embodiments of the invention include using a reusable substrate, a reusable substrate with layered probe elements and a reusable substrate with a passive l...
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WO/2007/092592A2 |
A method and apparatus for performing automated alignment of probes of a probe card is provided. The desired horizontal location (500) for a probe is compared with the actual horizontal position (502) for the probe to determine (504) a h...
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WO/2007/092594A2 |
An approach for fabricating cantilever probes for a probe card assembly includes forming posts (108) on conductive traces (106) on a substrate (100). A beam panel (150) having beam elements (152) formed therein is aligned to the substrat...
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WO/2007/092593A2 |
A method for repairing a probe on a probe card is provided. A plurality of beams (222', 224' ) is formed on a beam panel (250"). The plurality of beams includes a replacement beam. After identifying a damaged beam on the probe card, the ...
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WO/2007/078493A1 |
A probe card assembly (300) has a probe contactor substrate (310) having a plurality of probe contactor tips (395) thereon and a probe card wiring board (330) with an interposer (340) disposed between the two. Support posts (320) contact...
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WO/2007/016599A1 |
A cleaning device for use in a semiconductor processing. The device comprises a substrate supporter for supporting a substrate to be cleaned, a scrub pad mounting plate, and a chuck coupling to the substrate supporter and the scrub pad m...
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WO/2007/015713A1 |
The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The leng...
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WO/2006/026346A1 |
A probe (10) for a probe card assembly is provided. The probe includes a beam element (12) having a tip end portion. The probe also includes a tip structure (18) on the tip end portion of the beam element. The tip structure includes a pl...
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WO/2006/023380A1 |
A probe has a cantilever arm coupled to a base via an anchor. A surface of the arm facing the base or a surface of the base facing the arm has steps with contact points that contact the base when the arm is depressed. Alternatively, the ...
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WO/2006/014894A2 |
A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circu...
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WO/2006/014635A1 |
A probe card assembly is provided. The probe card assembly includes a substrate and a plurality of probes bonded to a surface of the substrate. The probe card assembly also includes a reinforcing layer provided on the surface of the subs...
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WO/2005/124371A1 |
A method for providing alignment of a probe relative to a supporting substrate, comprises the steps of providing the supporting substrate defining a planar surface and an edge, the substrate further defining a first crystal plane, provid...
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WO/2005/122240A1 |
Disclosed herein are a silicon wafer for probe bonding and a probe bonding method using the same.The silicon wafer for probe bonding is improved in structure to facilitate probe bonding on a probe substrate. The probe bonding method invo...
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WO2005043594B1 |
A method of manufacturing a probe test head for testing of semiconductor integrated circuits includes: defining shapes of a plurality of probes (81) as one or more masks (73); a step for fabricating the plurality of probes using the mask...
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