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Patent Searching and Data


Matches 651 - 700 out of 21,932

Document Document Title
WO/2013/164929A1
Provided is a laminated high frequency module wherein a Q value of a built-in inductor is not deteriorated even the high frequency module is reduced in size. A plurality of layers constituting the intermediate layer of a laminated body (...  
WO/2013/165699A1
This disclosure provides implementations of inductors, transformers, and related processes. In one aspect, a device includes a substrate having first and second surfaces. A first inducting arrangement includes a first set of vias, a seco...  
WO/2013/157161A1
Provided is an inductor array chip that is not prone to structural defects during firing, and is easily manufactured in a stable manner. The inductance array chip (40) is provided with a magnetic layered laminate (41), and a plurality of...  
WO/2013/156397A1
The invention relates to a soft magnetic core in which the permeabilities that occur differ in at least two different positions of the core.  
WO/2013/152981A1
The invention relates to a common mode inductor device (10). The inductor device is comprising a magnetic core (11) forming a continuous loop, a first winding (21) wound around the magnetic core (11) and a second winding (22) wound aroun...  
WO/2013/150784A1
Provided is a coil unit with which the proximity effect between lines is suppressed and resistance loss is inhibited, with which magnetic flux directivity is improved and coil inductance is increased, and with which coil Q value is incre...  
WO/2013/150103A1
The invention relates to a damping element (1) for damping common-mode electromagnetic interference, made from a core (2) having a passage (3), via which the core (2) can be applied to a module of a control device (20), and having a magn...  
WO/2013/151065A1
[Problem] To provide: an inductor capable of maintaining a greater inductance value (Q factor; sharpness of resonance) than according to conventional inductors, and obtain a greater inductance value (L) (Q factor; sharpness of resonance)...  
WO/2013/149995A1
An inductor layout (200, 300, 400) comprising a first inductor (210, 310, 410) and a second inductor (220, 320, 420). The first and second inductors (210, 310, 410; 220, 320, 420) are electrically and magnetically independent inductors c...  
WO/2013/147786A1
Semiconductor die packaged with air core inductors (ACIs) and magnetic core inductors (MCIs), or with multiple MCIs, are described. In a first example, a semiconductor package includes a semiconductor die, one or more air core inductors ...  
WO/2013/146568A1
Provided is a highly reliable electronic component having no peeling or cracking of any of the insulating layers and comprising a helical coil having excellent coil characteristics. In comparison to conventional configurations in which c...  
WO/2013/136936A1
In the present invention, the electrodes of input/output terminals (P1-P4) are formed at the bottom surface of a bottommost layer (0). First linear conductors (L1a-L1n) and second linear conductors (L2a-L2n) are formed at substrate layer...  
WO/2013/128702A1
Provided is a laminated inductor having excellent properties. A laminated inductor (100) is provided with a laminate body comprising laminated magnetic-body layers (101-108). The magnetic-body layers (102-107) have loop-shaped conductive...  
WO/2013/126308A1
A method for fabricating an electric coil on a circuit board comprising fabricating on the circuit board a first coil layer comprising a coil trace and a plurality of vias distributed along the length of the coil trace, and overlaying a ...  
WO/2013/125169A1
Provided is a choke coil capable of applying an optimal magnetic bias even for increased amounts of current and capable of achieving a reduction in size and weight and a lower cost. This choke coil is provided with a coil (6) and a core ...  
WO/2013/126308A8
A method for fabricating an electric coil on a circuit board comprising fabricating on the circuit board a first coil layer comprising a coil trace and a plurality of vias distributed along the length of the coil trace, and overlaying a ...  
WO/2013/117393A1
The invention relates to an electronic component in the form of a multi-layered induction component or a chip bead having a rectangular-shaped body that has two long and two short side faces which are opposite each other. The two long si...  
WO/2013/115064A1
Provided are: a ferritic magnetic body material that has a high Q in a high-frequency band, and can be favorably used for example as an inductor-core-configuring material used in a VHF-H band or the like; and a wound coil component provi...  
WO/2013/110726A1
The invention relates to a band attenuation/elimination filter for the electromagnetic emissions of a DC motor with brushes, comprising at least a first capacitive electrical impedance element (C1) and a second capacitive electrical impe...  
WO/2013/108651A1
Provided is an interrupt device for RF signal with a novel configuration which has a function capable of reliably cutting off an RF signal in the prescribed frequency range after an RF signal having an RF power value greater than or equa...  
WO/2013/108862A1
Provided is a coil component having a high inductance value and increased coil-pattern connection reliability, and also able to ensure high common-mode attenuation when constituting a common mode choke coil. This coil component is provid...  
WO/2013/104757A1
The invention relates to an inductive energy transfer device having at least one primary coil (P1) which generates a magnetic alternating field parallel to a longitudinally extending holding apparatus (5). At least one secondary coil (S1...  
WO/2013/105397A1
Provided is a technology that enables an impact of a radiated noise from an RFIC, which is an electronic component for handling a high-frequency signal, on other electronic component to be reduced, and a module to be made smaller. Becaus...  
WO/2013/103044A1
Provided is an electronic component having a structure in which the positional relationship between an external electrode and a coil is unlikely to be displaced from a predetermined positional relationship and in which arbitrary electric...  
WO/2013/101131A1
A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on...  
WO/2013/099297A1
The purpose of the present invention is to provide a laminate inductor which uses a soft magnetic alloy as the magnetic material, has a high magnetic permeability, and which is highly reliable and has reduced conduction failures. This la...  
WO/2013/101294A1
A toroidal magnet includes a toroidal surface geometry to define placement of windings for an electromagnet, and an interior space of the toroidal surface adapted to pass a beam of ions on a specified curved path defined by the toroidal ...  
WO/2013/101102A1
Techniques are disclosed for enhancing performance of integrated or on-chip inductors by implementing a schema of conductive metal dummies in the design thereof. In some cases, a metal dummy schema may be disposed in a layer proximate an...  
WO/2013/099540A1
First annular conductors (L1a, L1b, L1c, L1d) are helically formed from the bottom layer to the top layer, and first annular conductors (L1e, L1f, L1g, L1h) are helically formed from the top layer to the bottom layer. In addition, second...  
WO/2013/095326A1
Multi-pair differential lines printed circuit board common mode filters are generally described. In one embodiment, the apparatus includes a multi-layer printed circuit board, a first signal line and a second signal line forming a first ...  
WO/2013/073408A1
An inductor is provided with a magnetic core and a coil. The magnetic core has a winding having a wound coil, and a peripheral part. The magnetic core is formed from two or more preforms pressure molded with the coil having been wound ar...  
WO/2013/073314A1
To improve the degrees of freedom in the set-up of the antenna coil and to enable forming a hot spot at the desired location, an antenna device (4a) is provided with a main coil antenna (15) and a sub-coil antenna (16) connected to the m...  
WO/2013/074298A1
A spiral inductor (300) is formed on a semiconductor substrate (102). One or more insulating layers (104, 303) are disposed on a first surface of the semiconductor substrate. A spiral structure (106) is formed of a first conductive mater...  
WO/2013/070371A1
A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrifici...  
WO/2013/064516A1
The invention essentially relates to an EMC filtering device (1), characterized in that said filtering device comprises a printed circuit (5) comprising at least two parallel layers (25, 26) of a high-permittivity material, which are pos...  
WO/2013/065716A1
The purpose of the present invention is, in a common mode choke coil, to reduce loss in normal mode signals and enhance the ability to remove common mode noise in the high-frequency bands. A common mode choke coil is provided with a prim...  
WO/2013/058144A1
Provided is a built-in coil-type composite electronic component that can be provided at a low price and the insulation reliability of which can be effectively improved, and that has an electrostatic protection function. A composite elect...  
WO/2013/054587A1
Provided are: an electronic component wherein the occurrence of lamination deviation of coil conductors can be suppressed; and a method for producing the electronic component. A coil conductor (18a) and a coil conductor (18b) face each o...  
WO/2013/054736A1
The provided electronic component can reduce dependency of the inductance upon the frequency of a high-frequency signal. A stacked body (12) is constituted by stacking an insulator layer (16) comprising magnetic material, and an insulato...  
WO/2013/047596A1
Provided is a resin composition in which a decrease in magnetic permeability is suppressed even when the temperature rises. This resin composition comprises a hardening resin and an inorganic filler dispersed in the hardening resin, the ...  
WO/2013/049465A1
A noise-suppressing electrocardiograph (ECG) adapter having a first end, a second end, and a noise-suppression element is presented, together with an ECG noise-suppressing system and related methods. In an embodiment, the noise-suppressi...  
WO/2013/038752A1
Provided are an inductor element and a method of manufacturing same whereby it is possible to implement an open magnetic circuit while carrying out an inter-layer connection with a via hole. Sandwiching a magnetic ferrite layer (13) with...  
WO/2013/038671A1
A common mode noise filter comprising: a first insulation layer; a first coil conductor arranged on the upper surface of the first insulation layer; a second coil conductor arranged on the lower surface of the first insulation layer; a s...  
WO/2013/034661A1
The invention relates to a sensor for detecting current flowing in a conductive wire, in which: a printed circuit board comprises a through-hole (5) passing from one side of it to the other along a vertical axis in order to receive the c...  
WO/2013/035515A1
A laminated coil component is provided with a prime field formed by laminating a plurality of insulator layers and a coil section formed with a plurality of coil conductors inside said prime field. The prime field comprises a coil sectio...  
WO/2013/035933A1
The present invention pertains to a transformer. A transformer using a symmetrical printing pattern, according to one embodiment of the present invention, includes: a board, a plurality of first printing lines which is printed on the boa...  
WO/2013/035516A1
In a laminated coil component (1), the particle diameter of coil conductors (4, 5) after sintering, is 10μm to 22μm. By setting the particle diameter of the coil conductors (4, 5) after sintering to be 10μm or greater, the surface rou...  
WO/2013/031680A1
An inductance element (4) is provided with a magnetic metallic substrate (2), a first gap layer (24) arranged on the surface of the magnetic metallic substrate (2), and a first magnetic-flux-generating layer (26) arranged on the first ga...  
WO/2013/031842A1
A coil conductor (4) and a via electrode (9) arranged separated from the coil conductor (4) are embedded in a magnetic layer (1). The magnetic layer (1) is sandwiched between a pair of non-magnetic layers (2, 3). The coil conductor (4) a...  
WO/2013/031873A1
 A primary coil is formed by the series connection of a first coil element (L1a), a second coil element (L1b) and a fifth coil element (L1c), and a secondary coil is formed by the series connection of a third coil element (L2a), a four...  

Matches 651 - 700 out of 21,932