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WO/2024/007535A1 |
Provided in the present invention are a fluorine-containing resin copper-clad laminate and a multi-layer circuit board. The fluorine-containing resin copper-clad laminate comprises copper foil, one or a combination of at least one prepre...
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WO/2024/007536A1 |
The present invention provides a non-woven fabric prepreg, a metal-foil-clad plate and a printed circuit board. The non-woven fabric prepreg comprises a fluorine-containing resin binder non-woven fabric and a fluorine-containing resin co...
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WO/2024/007686A1 |
A circuit board assembly and an electronic device. The circuit board assembly comprises a first circuit board (11), a second device (45), and a second circuit board (12); the first circuit board has a first surface (111) and a second sur...
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WO/2024/009886A1 |
According to the present invention, an insulating layer has first and second main surfaces. A conductor layer is provided on the first main surface. A metal thin film is provided on the second main surface and has a third main surface fa...
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WO/2024/009831A1 |
One aspect of the present invention is a resin composition containing: an imide compound (A) having, within a molecule, a structure represented by formula (1); and a radical polymerizable compound (B). In formula (1), X1 represents a tet...
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WO/2024/008999A1 |
An integrated optically functional multilayer structure (100, 200, 300, 400, 500, 600, 700, 800, 900, 1100, 1300, 1400, 1500), comprising: a flexible, optionally 3D-formable and thermoplastic, substrate film (102, 102a) arranged with a c...
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WO/2024/010021A1 |
The present invention improves thermal conductivity. This invention is provided with a base body including: a first surface; and a second surface located on the opposite side as the first surface. The base body has at least one recess pr...
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WO/2024/010022A1 |
The present invention improves heat conductivity. The present invention comprises: a base body having a first surface, a second surface located on the opposite side of the first surface, at least one first recess that opens in the first ...
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WO/2024/009597A1 |
This outdoor unit for an air-conditioning device (1) comprises: a casing (30) having formed therein an opening (35) for maintenance; and a substrate (42) having a first surface (42a), which is disposed in the casing (30) and on which ele...
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WO/2024/009830A1 |
One aspect of the present invention is a resin composition containing: a maleimide compound (A) that has a benzene ring in a molecule thereof and also has a maleimide equivalent of 500 g/mol or less; an imide compound (B) that has at lea...
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WO/2024/009000A1 |
An integrated optically functional multilayer structure (100, 200, 300, 400, 500, 600, 700, 800, 900, 1100, 1300, 1400, 1500) suitable for large area dynamic illumination, comprising a flexible, optionally 3D-formable and thermoplastic, ...
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WO/2024/009554A1 |
A substrate 100 comprises: a core substrate 10 which has a first surface 11 and a second surface 12 on an opposite side from the first surface 11 and is internally provided with an opening portion 13; an electronic component 20 and a met...
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WO/2024/009851A1 |
Provided is a ceramic circuit board that is capable of suppressing a decrease in conductivity of a copper plate while maintaining bonding strength. A bonded body according to an embodiment comprises a ceramic substrate, a copper plate, a...
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WO/2024/009589A1 |
Provided is an electroconductive paste capable of forming, in an electric circuit, an electric wiring line that is less likely to break even when the electric circuit and/or the electric wiring line is elongated and/or flexed.　This fle...
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WO/2024/009237A1 |
The present invention relates to the field of implantable neural interface devices and, in particular, it refers to a new implantable polymeric neural electrode for extra- or intra-neural applications, as well as to a process for the sim...
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WO/2024/009861A1 |
Provided are a copper-clad laminate that has excellent heat resistance and lowers transmission loss, a printed wiring board having the copper-clad laminate, and a semiconductor package. Specifically, provided is a copper-clad laminate or...
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WO/2024/001878A1 |
Embodiments of the present application relate to the technical field of semiconductors, and provide a substrate, a carrier, a chip packaging structure, and an electronic device, for use in reducing crosstalk between differential pairs. I...
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WO/2024/004401A1 |
A conductive film (1) includes: an organic resin base material (2); an inorganic layer (3) disposed on one side in the thickness direction of the organic resin base material (2); and a copper layer (4) disposed directly on one side in th...
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WO/2024/002227A1 |
A configuration method for a composite flexible circuit substrate based on stainless steel metal, comprising: configuring a stainless steel metal base layer (10) having a coefficient of thermal expansion of less than 16*10-6 m/mk as a su...
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WO/2024/004405A1 |
This electroconductive film (1) comprises an organic resin substrate (2), an inorganic layer (3) that is disposed on one thickness-direction side of the organic resin substrate (2), and a copper layer (4) that is disposed directly on one...
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WO/2024/004884A1 |
A method for producing a varnish-like cyclic olefin copolymer composition containing a cyclic olefin copolymer (m) and an organic solvent, wherein the method for producing a varnish-like cyclic olefin copolymer composition is characteriz...
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WO/2024/005494A1 |
A semiconductor package according to an embodiment includes: a photosensitive insulating layer; a first circuit pattern layer buried in the photosensitive insulating layer; and a lower oxide layer disposed at the interface between the ph...
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WO/2024/002068A1 |
The present application discloses a flexible circuit board, a circuit board assembly, and an electronic device. The flexible circuit board has a bending portion and a soldering portion connected to the bending portion; the flexible circu...
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WO/2024/005496A1 |
A circuit board according to an embodiment comprises: an insulating layer; a circuit pattern layer which is disposed on the insulating layer and includes a pad; and a protective layer which is disposed on the insulating layer and include...
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WO/2024/005310A1 |
A COF module according to an embodiment comprises: a substrate including a chip mounting region; a circuit pattern arranged on the substrate; and a chip arranged in the chip mounting region and connected to the circuit pattern. The circu...
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WO/2024/004664A1 |
A composite material according to the present disclosure comprises a metal-organic framework and a silicon-containing polymer. The metal-organic framework contains a zeolitic imidazolate framework. The silicon-containing polymer contains...
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WO/2024/004604A1 |
The present invention addresses the problem of providing, for example, a film that reduces dielectric loss and is excellent in adhesiveness with a copper foil layer. The film according to the present invention contains a resin and a fill...
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WO/2024/001183A1 |
Provided in the present disclosure are a via hole structure of a circuit board, and a circuit board. The via hole structure comprises at least one pair of differential signal holes, wherein each pair of differential signal holes comprise...
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WO/2024/004882A1 |
A method for producing a cyclic olefin copolymer, wherein the method for producing a cyclic olefin copolymer is characterized in that the cyclic olefin copolymer contains (A) one or more repeating units derived from an olefin, (B) one or...
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WO/2024/004783A1 |
This stretchable device (1) comprises: a stretchable base material (11) having a main surface (111); an electronic component (30) provided on the main surface (111) of the stretchable base material (11); first stretchable wiring (21) con...
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WO/2024/002324A1 |
The present application relates to a heat sink, a circuit board module and an electronic device. The heat sink is configured for the heat dissipation of an electronic component. The heat sink comprises a base, a plurality of fins, and a ...
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WO/2024/004527A1 |
A composite material according to one embodiment of the present disclosure comprises a substrate and a polydopamine that contains multiple hydroxyl groups and at least one acyl group.
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WO/2024/004652A1 |
A method for manufacturing a structure with bumps, according to the present invention, comprises: a step (bump formation step) for forming, on a demolding layer of a transfer substrate having the demolding layer, bumps containing an orga...
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WO/2024/004525A1 |
A boron nitride material in one embodiment of the present disclosure contains boron nitride, polydopamine adhered to the boron nitride, and a silicon-containing polymer. The silicon-containing polymer contains a functional group represen...
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WO/2024/005101A1 |
[Problem] The present invention addresses the problem of providing a circuit board wherein a small-diameter via hole is formed as designed, and the via hole has excellent adhesion to a copper plating layer without requiring wet desmearin...
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WO/2024/004663A1 |
A composite material according to the present disclosure comprises a metal-organic framework and a silicon-containing polymer. The silicon-containing polymer contains a main chain including at least one unit selected from the group consi...
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WO/2024/005331A1 |
According to an embodiment of the present disclosure, an electronic device may comprise a housing, a first printed circuit board, a second printed circuit board, an interposer, a first electric component, a power management integrated ci...
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WO/2024/005337A1 |
An electronic device according to an embodiment may comprise: a microphone module arranged on a first printed circuit board; and a support structure configured to provide a seating space for accommodating the microphone module on the fir...
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WO/2024/003384A1 |
The present invention refers to an automotive luminous device (10) a main substrate (1) with a driver (2) and a main connector (3) coupled to the edge portion (11) of the main substrate (1), the main connector (3) comprising at least fou...
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WO/2024/006846A1 |
A method of manufacturing a flexible circuit comprised of conducting and insulating layers in an extended length format using multi-point registration to benefit subsequent processing and utilizing one pass printing for up to 110 inches ...
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WO/2024/006176A1 |
The disclosed hybrid shielding structure (200A) may include a printed circuit board, PCB (201) that is to be overmolded with at least a portion of molding compound. The PCB (201) may include various electronic components (205A-D) dispose...
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WO/2024/003175A1 |
An aerosol provision device for generating an aerosol from aerosol-generating material is described. The device comprises a heating assembly (140) and an electrically conductive housing part (121) arranged to at least partially receive t...
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WO/2024/005408A1 |
This foldable electronic device comprises: a display comprising a first region and a second region; a first housing and a second housing; a hinge structure connecting the first and second housings so as to be foldable relative to each ot...
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WO/2024/002847A1 |
The invention relates to a LED module comprising, at least two LEDs connected in series and arranged on a printed circuit board, PCB, the printed circuit board comprising two terminals for electrically supplying the LEDs off a driver; a ...
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WO/2024/004992A1 |
A wiring board according to the present disclosure comprises a first insulating layer that has a first surface and a conductor layer that is arranged on the first surface. The first insulating layer comprises an insulating resin and a pl...
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WO/2024/003406A1 |
The invention relates to a lighting device for a motor vehicle, the device comprising a housing (10), a power supply circuit (5), a stepped support (1) rigidly attached to the housing, a flexible main substrate (2) having an electronic c...
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WO/2024/004526A1 |
A boron nitride material (10) according to the present disclosure comprises: a hexagonal boron nitride which has a thickness of 5 nm or more in the c-axis direction; and a polymer (2) which adheres to the hexagonal boron nitride. The sol...
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WO/2024/006422A1 |
A composition for making a filler including a plurality of ceramic particles, an oxirane monomer in liquid form, an ultraviolet initiator that absorbs ultraviolet, and a thermal initiator.
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WO/2024/006495A1 |
Multi-layer circuit boards and methods of manufacture are described herein. A multi-layer circuit board includes a top layer and a bottom layer. The top layer includes an array of metal sections that are electrically insulated from one a...
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WO/2024/006108A1 |
In order to relieve the stress on the substrates in a 3D stacked electronic assembly, a substrate frame may be divided into a plurality of frame sections that are separated by spaces between the frame sections. These separations allow th...
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