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WO/2024/085620A1 |
A camera module according to an embodiment comprises: a first substrate having a first terminal part; an image sensor disposed on the first substrate; a base disposed on the first substrate; a lens driving device which is disposed on the...
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WO/2024/084847A1 |
In the present invention, a spacer (1) having a columnar shape is mounted such that a circular conductor pattern (5) corresponding to a bottom end surface (1b) of the spacer (1) is formed on a circuit board (4), a resist (6) is formed ar...
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WO/2024/084830A1 |
Provided is an electronic device capable of preventing cracking in a base material that occurs from a starting point between metal wiring patterns in a flexible portion of a multilayer wiring board. An electronic component is mounted on ...
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WO/2024/085511A1 |
A smart IC substrate, according to an embodiment, comprises: a base including a first surface and a second surface opposite the first surface; a bonding layer disposed on the first surface; a metal layer disposed on the bonding layer; an...
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WO/2024/085047A1 |
A multilayer polyimide film (10) comprises a non-thermoplastic polyimide layer (11) and a thermoplastic polyimide layer (12) that is disposed on at least one surface of the non-thermoplastic polyimide layer (11). The thermoplastic polyim...
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WO/2024/051603A9 |
The present application relates to the technical field of electronic devices, provides an electronic device, and solves the problem of interference to antenna signals caused by coupling inside electronic products. The electronic device c...
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WO/2024/085727A1 |
The present invention relates to a board for electronic parts, a method for manufacturing the board for electronic parts, and a display and a semiconductor device which include the board, the board comprising: a substrate including at le...
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WO/2024/082678A1 |
A small-size double-redundancy electric power steering motor controller structure, comprising a sealing cover cap, a ventilation valve, a connector, a power joint connector, a bendable PCBA board, screws, a stud screw, a magnet, a radiat...
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WO/2024/085602A1 |
According to an embodiment of the present disclosure, a relay board for manufacturing a display may comprise: a transparent plate; a transparent buffer material disposed under the plate; and a pattern layer disposed between the plate and...
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WO/2024/084637A1 |
The present invention provides a method for manufacturing a semiconductor device, the method including: a step for preparing a semiconductor package and a motherboard, the semiconductor package having a package substrate and a plurality ...
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WO/2024/085462A1 |
An electronic device according to one embodiment comprises: a housing; a printed circuit board including an insertion hole; at least one electronic component; and a fastening member inserted into the insertion hole, wherein the printed c...
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WO/2024/085476A1 |
An embodiment of the present invention provides a camera actuator comprising: a housing; a mover which is arranged in the housing and includes an optical member; a tilting guide unit connected to the mover in the housing; and a driving u...
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WO/2024/085687A1 |
A circuit board according to an embodiment comprises: an insulating layer; a first pad disposed on the insulating layer; and a protective layer that is disposed on the insulating layer and includes a first open region vertically overlapp...
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WO/2024/083576A1 |
The invention relates to a connector (1) for a printed circuit, the connector (1) comprising: a pin (1A) which extends longitudinally along a main axis (Ap); and a connector head (1B) which is attached to one end (1A.1) of the pin (1A) a...
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WO/2024/084906A1 |
This metallized resin film (10) comprises a resin composition layer (11), an electroless copper plating layer (12), and an adhesion layer (13) sandwiched between the resin composition layer (11) and the electroless copper plating layer (...
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WO/2024/085790A1 |
The present disclosure relates to an oscillator device (1) comprising at least one active circuit device (2), a circuit board (3) and a resonator cavity (4) that comprises a resonator cavity cover (21) and electrically conducting inner w...
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WO/2024/083507A1 |
A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjace...
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WO/2024/085564A1 |
An electronic device according to an embodiment of the present disclosure may comprise: a drive unit which includes a camera lens; a housing in which the drive unit is disposed and which encompasses the drive unit; and a printed circuit ...
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WO/2024/047244A3 |
The invention relates to an amplifier circuit (1) for broadband and low-noise amplification of a capacitive current source, preferably a pyroelectric sensor, comprising a signal input (3) that can be connected to the capacitive current s...
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WO/2024/084631A1 |
[Problem] To reduce volume shrinkage during cooling after sintering so as to reduce voids in a silicon nitride sintered body and reduce warpage of the silicon nitride sintered body. [Solution] Provided is a silicon nitride sintered body ...
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WO/2024/080624A1 |
An electronic device may comprise: a first substrate including a first hole; a second substrate including a second hole; a shield can attached to another side opposite to one side of the first substrate facing the second substrate; an in...
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WO/2024/080654A1 |
An electronic device according to one embodiment of the present disclosure may comprise: a housing; a circuit board arranged in the housing; and a battery which is arranged in the housing, and which includes a battery protection circuit ...
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WO/2024/079925A1 |
The present invention relates to a resin composition comprising a maleimide resin that is compatible even when main skeletons are different from each other. The objective of the present invention is to provide: a curable resin compositio...
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WO/2024/079332A1 |
In general terms, the present invention relates to improvements in a printed ink circuit and related assemblies, kits and/or garments. A first aspect of the invention provides an assembly of a fabric base carrying a printed ink circuit c...
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WO/2024/080046A1 |
This battery-monitoring device (100) comprises a wiring substrate (10) in which part of wiring (12) is provided to a substrate surface (S1), circuit components (21, 22) that are connected to the wiring (12) mounted on the substrate surfa...
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WO/2024/080681A1 |
An electronic device may comprise: a first housing; a second housing that may be retracted into or extended out of the first housing; a flexible display that may be retracted into or extended out of the first housing in response to slidi...
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WO/2024/080195A1 |
The present invention pertains to: a prepreg which contains a fiber base material and a resin composition containing (A) a thermosetting resin and (B) a spherical zinc molybdate, and in which the weight per unit area of the fiber base ma...
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WO/2024/080270A1 |
An electronic device 1 comprises: a wiring board 10 having a first main surface 11 and a second main surface 12 that oppose each other in the thickness direction; a first electronic component 20 mounted on the first main surface 11 of th...
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WO/2024/081466A1 |
The present disclosure relates to a base station antenna, comprising: a reflector; a first frequency band radiating element located on the front side of the reflector; and a feed board located on the front side of the reflector, the feed...
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WO/2024/079923A1 |
The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that can be patterned with light, has a glass transition temperature of 200°C or higher, and has a low dielectric dissipation factor...
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WO/2024/080830A1 |
A camera module, disclosed in one embodiment of the present invention, comprises: an optical member for reflecting light, and a first lens assembly for controlling the tilt of the optical member; a plurality of lens holders, and a second...
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WO/2024/080644A1 |
According to various embodiments, an electronic device may comprise: a first housing; a second housing slidably coupled to the first housing; a flexible display having a display area that changes on the basis of the slide-in or slide-out...
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WO/2024/077529A1 |
The present application relates to a chip to module (C2M) cable assembly and a PCB circuit. The cable assembly comprises: a first joint part comprising a plurality of first interface terminals, one end of each first interface terminal be...
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WO/2024/078972A1 |
There is described a component carrier (100), wherein the component carrier (100) comprises: i) a stack (101) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structu...
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WO/2024/079926A1 |
The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that has excellent compatibility, that can be cured by means of light, and that requires less heating time and an additional heating ...
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WO/2024/080642A1 |
According to various embodiments, the electronic device may comprise: a first housing; a second housing slidably coupled to the first housing; a flexible display having a display area varying on the basis of the slide-in or slide-out sta...
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WO/2024/079924A1 |
Provided are a resin composition that does not inhibit a photocuring reaction in an exposure step and that can provide excellent alkali developability in a development step, and a resin sheet, a multilayer printed wiring board, and a sem...
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WO/2024/075816A1 |
This wiring board comprises a base portion, a dielectric board, and a first signal conductor. The base portion has a first upper surface, a first lower surface, a first side surface, and a first opening portion having an opening in the f...
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WO/2024/076143A1 |
An electronic device according to one embodiment of the present disclosure comprises: a camera module having a viewing angle formed in a first direction; and a recess for accommodating the camera module, wherein: the camera module includ...
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WO/2024/075791A1 |
Provided are a dielectric and a method of manufacturing the same that reduce the frequency dependency of relative permittivity in a terahertz high-frequency band (110 to 330 GHz) of the relative permittivity. In the dielectric, the slope...
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WO/2024/075864A1 |
The present disclosure relates to a printed circuit board capable of improving heat dissipation performance, comprising: a substrate; a solder formed in a predetermined area of the substrate; and a heat transfer metal layer formed betwee...
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WO/2024/075735A1 |
This RFID module comprises: a first substrate having a first main surface and a second main surface that face each other; an RFIC chip disposed on the first main surface-side of the first substrate; a first radiation element disposed on ...
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WO/2024/075456A1 |
This circuit board comprises a fluorine resin layer, a to-be-adhered layer, and an adhesive layer adhering the fluorine resin layer with the to-be-adhered layer. The fluorine resin layer includes polytetrafluoroethylene and a first inorg...
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WO/2024/075218A1 |
In the present invention, an optical device (1) includes a feedthrough substrate (2). The feedthrough substrate (2) is connected to one end of a flexible substrate (3). A cap (4) is fitted onto one end of the flexible substrate (3). The ...
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WO/2024/074743A1 |
The invention relates to a microthruster applicable to space engineering that comprises printed circuit boards (PCBs) connected to each other, wherein the first board comprises a fuel tank (1) and an outlet nozzle (2) and the second boar...
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WO/2024/074905A1 |
Methods, systems, and apparatus for logical reverse computing and circular compression and decompression. In one aspect, a method for compressing a classical binary data input includes obtaining a classical binary data input; performing ...
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WO/2024/076113A1 |
An electronic device according to an embodiment of the present invention may comprise: a housing including a first surface, a second surface, and a lateral surface surrounding a space between the first surface and the second surface; a p...
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WO/2024/076211A1 |
A semiconductor package according to an embodiment comprises: a first insulating layer; a second insulating layer disposed on the first insulating layer; a third insulating layer disposed on the second insulating layer; a fourth insulati...
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WO/2024/075629A1 |
One aspect of the present invention relates to a resin composition comprising: (A) a preliminary reaction product obtained by preliminarily reacting a mixture that includes a maleimide compound (a1) and a phosphorus-containing compound (...
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WO/2024/076040A1 |
According to various embodiments, an electronic device may include a base plate, a side frame connected to the base plate, a front cover covering one side of the base plate, a back cover covering one side of the side frame and provided o...
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