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WO/2023/184912A1 |
Embodiments of the present application disclose a flexible circuit board, comprising: a pad that is disposed so as to be welded to a printed circuit board, the pad comprising a signal pad layer and a ground pad layer; a signal pad area i...
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WO/2023/189611A1 |
A connecting structure (1) comprises: a first substrate (2) having a plurality of first electrodes (12) arranged in the surface direction; a second substrate (4) that has a plurality of second electrodes (14) arranged in the surface dire...
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WO/2023/189297A1 |
The present invention provides a resin composition which enables the bonding of a copper foil and a glass substrate by a lamination method, while having excellent dimensional stability. This resin composition contains a polyimide resin t...
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WO/2023/189745A1 |
This printed wiring-board substrate comprises: a base film having a main surface; a sintered body layer which is disposed on the main surface of the base film and which is formed of a plurality of copper particles that were sintered; and...
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WO/2023/191012A1 |
An embodiment of the present invention provides: a film having a layer A and a layer B on at least one surface of the layer A, wherein the ratio of the elastic modulus of the layer A at 160°C to the elastic modulus of the layer B at 160...
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WO/2023/190662A1 |
This laminate (1) comprises: a metal substrate (2) including one surface (21) and another surface (22) in the thickness direction, and also including a side surface (23) linking the peripheral edge of the one surface (21) and the periphe...
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WO/2023/190860A1 |
This surface-treated copper foil has one surface (A) and the other surface (B), wherein the surface (A) satisfies the following requirements (I) and (II). • Requirement (I): on the surface of the surface-treated copper foil, the mirr...
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WO/2023/190615A1 |
Provided is a conductive paste with which adhesion to a base material can be further enhanced. This conductive paste contains a conductive powder, an additive, a binder resin, and an organic solvent, wherein the conductive paste contai...
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WO/2023/189839A1 |
Provided is a metal foil with a carrier, such metal foil capable of suppressing unintended releasing of a metal layer, caused by the penetration of chemicals from an end. A copper foil with a carrier is provided with: a carrier including...
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WO/2023/189345A1 |
This wiring board includes a layered body. The layered body is constituted by: a ceramic layer formed of a ceramic material; and a substrate wiring layer having an organic-resin substrate and having a wiring layer. The substrate wiring l...
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WO/2023/188678A1 |
The present invention pertains to a laminate using a circuit pattern having a thickness of at least 0.8 mm, and proposes a production method that is for the laminate and that is capable of preventing defects from occurring in an insulati...
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WO/2023/188506A1 |
The present invention provides: a resin composition for forming a low-dielectric adhesive layer that has excellent 5G-compatible electrical properties (low-dielectric properties), ensures high adhesiveness, and exhibits a small linear co...
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WO/2023/189795A1 |
The present invention contains (A) fluororesin powder and (B) an inorganic filler and further contains one of or both of: (X) one or more oligomers selected from the group consisting of aliphatic or semi-aromatic hydrocarbon-based oligom...
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WO/2023/184725A1 |
The present application discloses a printed circuit board and a manufacturing method therefor. The printed circuit board comprises at least three common FR4 core boards and a high-frequency board; the high-frequency board and a laminated...
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WO/2023/189813A1 |
This substrate for a printed wiring board is provided with an insulating layer, a first copper foil, and a second copper foil. The insulating layer has a first principal surface and a second principal surface, which is the reverse surfac...
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WO/2023/190833A1 |
Provided is a surface-treated copper foil in which circuit workability is excellent and transmission loss and generation of foreign matter are less likely to occur. When the optical roughness of the surface (20a) of a surface treatment l...
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WO/2023/189513A1 |
This wiring board comprises: an insulating layer made of a ceramic material; and a conductor layer extending in a planar direction within the insulating layer. The conductor layer is constituted by a plurality of sintered crystallites co...
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WO/2023/189609A1 |
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B havi...
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WO/2023/187222A1 |
The present invention relates to a coating or surface treatment method. In the method, a substrate holder (2) and slot die head (3) are provided. The slot die head has a slit nozzle (4). A substrate (5) is mounted on the substrate holder...
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WO/2023/188206A1 |
Provided are: a metal sheet bonding agent that has excellent adhesive strength and solder reflow tolerance and that reduces adhesive residues generated during detachment from metal sheets and the like; a reinforcement member that is for ...
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WO/2023/189565A1 |
Provided is a carrier-attached metal foil in which the occurrence of fractures or cracks in the metal foil during handling thereof can be suppressed. The carrier-attached metal foil comprises a carrier, a release layer, and a metal foil ...
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WO/2023/190712A1 |
Provided is an electrical component assembly capable of reducing a load acting on an electrical connection section between a connection terminal of an electrical component and a control board. This electrical component assembly (1) inclu...
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WO/2023/190500A1 |
Provided is an elastomer sheet (21) made of an elastomer, which is wound on a ring part (12) having a three-dimensional curved surface. The elastomer sheet (21) is provided with: a central region (30) located at the center of the elastom...
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WO/2023/190393A1 |
The present invention provides a cured product of a photosensitive resin composition, the cured product containing an inorganic filler and still having excellent resolution, while being capable of suppressing warp of a substrate during m...
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WO/2023/190811A1 |
The present invention pertains to a photosensitive multilayer resin film comprising a first resin composition layer and a second resin composition layer. The first resin composition layer and the second resin composition layer each conta...
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WO/2023/191010A1 |
Provided are a film and a laminate using the film, the film comprising a layer A and a layer B, which is on at least one surface of layer A, the elastic modulus of layer A at 160°C being 100-2,500 MPa, and the difference LA-LB between t...
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WO/2023/189719A1 |
Provided is a laminate in which a first substrate, a silane coupling agent layer, and a second substrate are laminated in this order, wherein: [B1] ≥ [A1] is satisfied when A1 is the number of circular floats having a diameter of 0.5 m...
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WO/2023/190037A1 |
This silicone skeleton-containing compound is represented by formula (1). (In the formula, each R1 independently represents a monovalent organic group, each R2 independently represents a divalent organic group, each R3 independently repr...
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WO/2023/190020A1 |
An active ester resin comprising at least one α-methylbenzyl group in each molecule is provided in order to provide an active ester resin capable of achieving an excellent dielectric loss tangent in high-temperature environments.
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WO/2023/189744A1 |
In the present invention, a substrate for a printed wiring board comprises: a base film having a first main surface and a second main surface; a first electrically conductive layer disposed on the first main surface; a second electricall...
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WO/2023/184410A1 |
Provided in the present disclosure are a circuit board, an electronic apparatus and a manufacturing method for the circuit board. The circuit board comprises a substrate; a plurality of bonding pad regions located on the substrate; and a...
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WO/2023/191067A1 |
This ceramic wiring member (1) comprises: a body portion (10) made of ceramic and having tabular portions (11, 12); and an electrically conductive portion (20) disposed in contact with the tabular portions (11, 12). The composition of th...
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WO/2023/190661A1 |
The laminate (1) has a metal substrate (2) and an inorganic insulating layer (3) in this order in the direction of thickness. The inorganic insulating layer (3) has a first layer (31) and a second layer (32) in this order, each with a di...
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WO/2023/190244A1 |
This circuit board comprises a ceramic plate, a metal plate, and a brazing material layer which joins a main surface of the ceramic plate and a main surface of the metal plate, wherein: a recess section is formed in the metal plate along...
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WO/2023/190255A1 |
Provided is a circuit board comprising a ceramic plate, a metal plate, and a brazing material layer that joins a principal surface of the ceramic plate and a principal surface of the metal plate, wherein a recess is formed in the metal p...
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WO/2023/189300A1 |
The present invention provides a method for producing a printed wiring board with a built-in capacitor, the printed wiring board exhibiting excellent adhesion between a circuit and a dielectric layer, with high productivity, while reduci...
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WO/2023/189610A1 |
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B havi...
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WO/2023/188670A1 |
This circuit board comprises a ceramic plate, a metal plate, and a bonding layer that bonds the ceramic plate to the metal plate. When the circuit board is viewed in a cross section perpendicular to the main surface of the ceramic plate ...
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WO/2023/189337A1 |
Provided is a paste circuit having a circuit pattern and an adhesive agent layer, which does not undergo disadvantages such as the short-circuiting of a circuit and corrosion and shows an excellent durability of appropriate adhesion forc...
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WO/2023/184256A1 |
A display module, comprising a circuit board (30) and a display substrate (10), which is provided on a first surface of the circuit board (30), wherein the first surface of the circuit board (30) comprises a flat area and a non-flat area...
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WO/2023/186235A1 |
A method of manufacturing an electrode assembly is disclosed, which includes providing a release substrate, forming an electrode assembly on the release substrate; wherein forming an electrode assembly comprises providing a printable fir...
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WO/2023/189256A1 |
The present invention relates to a conductive film provided with a film-like base material and a conductive layer provided on one major surface side of the base material. The conductive layer comprises a first metal layer including a fir...
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WO/2023/191066A1 |
A ceramic wiring member (1) comprises a body portion (10) which is made of ceramic, and a conductive portion (20) which is disposed in contact with the body portion (10). The composition of the conductive portion (20) includes: a first m...
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WO/2023/187625A1 |
The present invention relates to an adhesive-attached metal substrate and a laminate that have a low-dielectric property in a high-frequency region, and in which sufficient adhesive strength can be ensured between a resin film and a meta...
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WO/2023/190614A1 |
Provided is an electroconductive paste making it possible to further improve adhesion to a substrate. The electroconductive paste contains an electroconductive powder, an additive, a binder resin, and an organic solvent. The electrocon...
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WO/2023/181742A1 |
A manufacturing method for a magnetic substrate that is for manufacturing a magnetic substrate by using a resin sheet comprising a support and a resin composition layer formed on the support, the resin composition layer including a resin...
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WO/2023/180624A1 |
A method for manufacturing a number of electrical nodes (10), wherein the method comprises providing (410) a number of electronic circuits onto a first substrate (11), such as on a printed circuit board or other electronics substrate, op...
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WO/2023/180626A1 |
A multilayer structure comprising a substrate film and a number of functional components and/or integrated circuits, comprising at least one first conductive element, at least one second conductive element, and at least one subsidiary co...
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WO/2023/180264A1 |
The invention relates to a printed circuit board (100) for electrical components (5) and/or conductor tracks (4), comprising - a base body (2) which extends along a main extension plane (HSE), and - an insert (1) which, in a mounted stat...
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WO/2023/182177A1 |
The present invention provides a roughened copper foil which can have both high adhesion to a thermoplastic resin and excellent high-frequency characteristics at the same time. This roughened copper foil has a roughened surface on at lea...
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