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WO/1991/016995A1 |
An apparatus (10) for spraying a liquid, such as a low-solids flux, onto a substrate (12), during its transit along a first path (15), comprises a spray gun (38) directed at the substrate. The gun (38) is carried by a carriage (34) recip...
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WO/1991/015327A1 |
Solder wave nozzle adjustment devices allow backplate adjustment, weir height adjustment and gate opening to be adjusted. The device makes adjustments remotely without having to turn off the solder wave thus allowing one to provide the r...
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WO/1991/014532A1 |
A solder delivery system (10) including a carrier (12) of compliant, dimensionally passive, high-temperature material, the carrier remaining generally dimensionally passive during heating and having a detent (18) therein including fusibl...
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WO/1991/015092A1 |
Method and apparatus for increasing the efficiency and safety of conducting heat treating operations or other operations involving the heating of metal with conventional welding equipment by eliminating mechanically-operated contacters. ...
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WO/1991/015091A1 |
Method and apparatus for increasing the efficiency and safety of conducting heat treating operations with conventional welding equipment by eliminating mechanically-operated contacters. The apparatus operates on lower power and produces ...
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WO/1991/012921A1 |
A device for applying a solder paste, a glue or another similar material in patches on a substrate (24) comprises a supply (10) of said material, an outlet (16), connected to said supply by means of a conveying conduit (14), and means (1...
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WO/1991/012920A1 |
Apparatus for reflow soldering of component leads is disclosed, in which a heater bar is positionable above the leads. A guide is positionable outside of the leads parallel to the heater bar, and the apparatus moves the guide downwardly ...
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WO/1991/012106A1 |
A device is proposed for applying material such as solder paste and glue in discrete points, particularly for applying solder paste on electronic circuit boards. The device comprises a pump house (202 - 205; 301, 307), a tube or a channe...
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WO/1991/011081A1 |
This invention provides a method for soldering using induction heating, which is accomplished by the use of lossy heating particles in or on the solder (3) and an alternating magnetic field. The lossy heating particles (3) useful in this...
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WO/1991/007247A1 |
Disclosed is a method for making a solder joint without flux, in the presence of an inert gas. A pair of articles (10, 20) having solder-coated surfaces are heated to melt the solder, pressure is applied to the joint region, and the arti...
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WO/1991/007248A1 |
A wave soldering apparatus and process occurs in an atmosphere which substantially excludes oxygen. By providing a pressurized effect on an element to be soldered while passing through a solder wave, fluxless soldering is accomplished av...
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WO/1991/006390A1 |
A horizontal solder leveller for applying solder to a board comprises: means (15u, 151; 16u, 161; 17u, 171) including a solder bath (1) for applying molten solder (2) to a board; means (47) for levelling solder applied to the board, incl...
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WO/1991/003350A1 |
The present invention relates to a soldering machine provided with a solder tower and at its top with a narrow outflow slot. In practice it has been found that such an outflow slot quickly becomes dirty so that the stream coming out of t...
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WO/1991/002618A1 |
A soldering tool comprises a handle (10) and a rod-shaped or tubular heating element fastened to the front end of the handle. A soldering tip (4) can be placed on the free end of the heating element. The soldering tip (4) has a borehole ...
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WO/1990/011867A1 |
A method and composition for protecting and enhancing the solderability of a metallic surface. A mixture which includes a chosen protective material and a dicarboxylic acid fluxing agent is applied to the metallic surface to form a prote...
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WO/1990/011864A1 |
The device comprises a body (2), a support (4), a torch (6) and a connector (8) providing for the mobility of the support (4) and the torch (6). The torch may be in at least one working position in which the flame is used for welding and...
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WO/1990/010518A1 |
A method of soldering without the need for fluxing agents, high temperature, hydrogen, laser excitation or sputtering techniques. The method uses plasma excitation to remove surface oxides from solder surfaces, thereby eliminating the ne...
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WO/1990/004481A1 |
An unsoldering iron has a heated unsoldering bit with a bore that communicates by means of a suction tube with the front end of an elongated tin collecting container, the rear end of which is linked by a suction tube with a vacuum source...
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WO/1989/011938A1 |
Process and device for gluing and soldering a rolled or coated honeycomb body (8) composed of layers of structured metal sheets (1, 2) and having a plurality of channels for the passage of a fluid. To obtain high-strength solder joints, ...
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WO/1989/011940A1 |
A device for applying solder to two opposite faces of an object, such as an array of conductors (23) of a flat electrical cable (21), in a predetermined location, comprises a support sheet (1) having a line of weakness (3) along which th...
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WO/1989/011939A1 |
A soldering or unsoldering set has a handle secured by fastening means to an elongated heating element having a soldering or unsoldering tip at its free end. The longitudinal axis of the heating element and of the soldering or unsolderin...
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WO/1989/010230A1 |
The description refers to a device and a procedure for the wavesoldering of printed circuits, in particular for the soldering of components suitable for the surface mounting. As claimed in the invention the soldering wave - or a portion ...
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WO/1989/008527A1 |
The method and apparatus for removing defective solder according to the present invention are characterized by pressing a suction wire onto the defective solder on a printed board, heat melting the defective solder while supplying a smal...
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WO/1989/007898A1 |
A gas-operated appliance for personal use comprises a gas container, a gas dosing nozzle (21, 29), a mixing region (111) and a burner. The gas jet issuing from a gas dosing nozzle (21, 29) is surrounded by the ambient air (25). The gas d...
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WO/1989/006581A1 |
A soldering iron which is developed specifically to address a wide variety of miniaturized integrated circuit soldered pin configurations has a handle (20) with a heating block (34) which mounts one of a set of wide, chisel-shaped blades...
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WO/1989/003272A1 |
A solder injector with high-frequency heating comprises a front part designed as a hollow soldering tip made of a material having a high thermal conductivity and a hollow coil core made of a Curie temperature-dependent material rigidly c...
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WO/1989/001989A1 |
A method of applying a uniform thickness layer of hot solder resist on printed circuit board (PP) containing a raised pattern of conductive paths of predetermined thickness having edge surfaces disposed perpendicular to the upper surface...
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WO/1989/001379A1 |
The invention concerns a process for adjusting the feed rate of a cord solder (7) with automatic advance of a definite quantity of cord solder to be melted in a soldering device. The soldering device comprises a carriage (14) with a cord...
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WO/1988/009068A1 |
A device for forming a solder connection between a plurality of elongate bodies comprises a dimensionally recoverable article, e.g. a heat-shrinkable sleeve, into which the bodies can be inserted, and a solder insert. The solder insert c...
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WO/1988/008356A1 |
Solder deposits on tools, particularly gripping, inserting and bending tools, impede the manufacturing process. In machine construction, the application of layers of mechanically resistant nitride-based materials to improve the surface o...
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WO/1988/006503A1 |
A soldering iron (10) is temperature controlled by temperature control circuitry (20) in handle (16). The temperature setting of the iron is changeable only by the replacement of a laser trimmed highly accurate resistor in the control ci...
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WO1988003455A1 |
A temperature-controlled soldering iron with varying power, especially adapted for soft soldering, silver soldering and the like, wherein the sensing means for measuring the soldering temperature is formed of the same resistor supplying ...
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WO/1988/003455A2 |
A temperature-controlled soldering iron with varying power, especially adapted for soft soldering, silver soldering and the like, wherein the sensing means for measuring the soldering temperature is formed of the same resistor supplying ...
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WO/1988/001217A1 |
A set of titanium guide bars are shaped with inner angular finger shields to isolate designated underside edge areas of a printed circuit board being conveyed across a molten solder bath in a wave solder machine.
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WO/1987/007549A2 |
A gas heated tool such as a soldering iron has a refillable gas container (1) with an inlet valve (17, 18, 19) and an outlet valve (14) biassed mutually to the closed position by a spring (21) acting between them. The outlet valve is ope...
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WO/1987/007538A1 |
An apparatus (20) and method for forming an integral three-dimensional object (22) from laminations (24) of the same or gradually varying shape. The apparatus includes a supply station (26), a work station (30) for forming a material (28...
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WO/1987/007196A2 |
A solder leveller comprises a bath (1) for molten solder (53), air knives (5) at a downstream end of the bath (1), three pairs of boardgripping rollers (10u, 101; 11u, 111; 12u, 121) arranged across the bath (1) to define a curved board ...
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WO/1987/007195A2 |
A solder leveller comprises a solder bath (1) into which a board bearing exposed metal to be coated with solder can be lowered, and from which the soldered board can be withdrawn upwardly past means for levelling the solder deposited on ...
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WO/1987/005547A2 |
Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat. Several embodiments f...
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WO/1986/004844A1 |
An automatic soldering method and apparatus, which are capable of carrying out with a high accuracy and a high efficiency a point soldering operation using a wire solder (14) with respect to a work surface. The soldering method consists ...
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WO/1986/004843A1 |
An automatic soldering apparatus, in which a base portion of a holder (23) extending a free end portion (soldering nozzle) (30) of a feed tube (10), which is used to guide a wire solder (22), toward a free end of a trowel tip (9) and sup...
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WO/1986/004002A1 |
Soldering apparatus and method wherein an assembly (10) containing solder (16) is simultaneously subjected to vapor heating and ultrasonic vibration to provide for fluxless soldering. The solder (16) is heated in a solder pot (14) which ...
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WO/1986/001695A1 |
The heating instrument comprises an outer tubular envelope (4) surrounding an inner tubular envelope (5) while delimiting with the latter an annular space, two end annular pieces (6, 7) to sealingly close said annular space, a material w...
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WO/1986/000842A1 |
A multipoint dispensing of viscous material onto a board (23) comprises the monitoring and controlling of several process parameters such as the initial gap (delta) between a dispensing tool (20, 25) and the board (23), the dispense pres...
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WO/1985/004068A1 |
Designation of specific heating zones and increase in minimum resistance relative to prior autoregulating heaters of the type to which the present invention pertains is achieved, together with flexibility or bendability, if desired, by s...
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WO/1985/001963A1 |
A treatment container (14) with a transversal loading space (22) comprises an upper container portion (20) and a lower container portion (16). The lower heatable portion (16) is filled with a molten brazing metal (24) above which there i...
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WO/1985/001791A1 |
The invention relates to heat treating machines. It relates to a machine of the in line type which comprises a tunnel (1), displacement means (2) for conveying the articles or products to be heated from the inlet of said tunnel to its ou...
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WO/1985/000263A1 |
There are numerous cases in which it is desired to employ a flexible autoregulating heater that can both heat, without overheating, and at the same time, tightly hold the work. An example of such use is in the shielded communications cab...
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WO/1984/002098A1 |
When using a connector containing a fusible material to join objects, there is a danger, upon heating the connector, of overheating the objects to be heated, as well as adjacent objects. This problem is overcome by incorporating the conn...
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WO/1984/001258A1 |
Device for soldering a printed board, which has a nozzle (14a) provided in a solder tank (14) containing molten solder so as to form a molten solder fountain (15), printed board conveyor (25) passing a printed board (17) through the sold...
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