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WO2004030854B1 |
Selective gas knives (24, 24', 24'') for wave soldering provide for targeted gas flow at a particular location on a substrate, such as a printed circuit board (22). Both the temperature and flow rate of gas through a segment (28) of a ga...
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WO/2004/082346A1 |
A method and a device for mounting conductive balls on one face of an arranged body in a specified pattern, the method wherein an arrangement member having one face and the other face opposite to the one face and a positioning open part ...
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WO/2004/076114A1 |
A small soldering apparatus capable of increasing the reliability of products by reducing the occurrence of dross and using lead-free solder, wherein a primary jet nozzle (1), a secondary jet nozzle (2), and an unshown pump forming jet w...
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WO/2004/071710A2 |
A superabrasive tool blank whose carbide side is affixed with a suitable braze alloy, for subsequent shaping into desired tool geometry and induction-brazed forming a cutting tool. The use of the pre-coated braze alloy in the tool blank ...
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WO/2004/062761A2 |
The invention relates to a method for the purification of the process gas in a soldering furnace, which influences said gas on the path from the withdrawal points (31) in the soldering furnace (11) to a condensation trap (28), with regar...
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WO/2004/054339A1 |
A method for supplying solder being used for forming pad electrodes at a finer pitch and for obtaining bumps having a sufficient quantity of solder while suppressing variation. At first, a substrate (20) is placed in a liquid tank (11) f...
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WO/2004/050286A1 |
The invention relates to a method wherein a solder deposit is formed on a contact surface (12), e.g. a circuit carrier (11), such that a beam (13) of solder powder particles (14) is directed at the contact surface (12) and the solder pow...
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WO/2004/048024A1 |
Iron tip (2) for soldering for use as the tip of an electrical soldering iron (copper) or electrical solder sucking iron (copper), comprising tip core material (10) of copper or copper alloy having its front end fitted with iron forefron...
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WO/2004/044577A1 |
A convenient apparatus for analyzing solder component comprising means (1) for detecting the melting rate of a metallic member immersed into molten solder in a molten solder tank, and an processing means (2). Melting rate of the metallic...
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WO/2004/041469A2 |
The present invention is directed to a welding tip (10) for welding polymeric materials such as containers. The welding tip (10) includes a cylindrical body (14) having a central bore (16) and includes a perimeter (20) around the bore (16).
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WO/2004/042420A2 |
The invention relates to an arrangement for the soldering of a metal block (12) by the jointing of a number of segment sheets (12/i), whereby solder material (18) forms a whole-surface material connection with low layer thickness in capi...
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WO/2004/039526A1 |
A soldering method comprising the steps of allowing an ac current of which the frequency changes with time in a band of 20 Hz to 1 MHz to flow to at least one of (d) a soldering material, (e) a work to be soldered and (f) a portion surro...
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WO/2004/037475A1 |
The present invention is directed to preventing an indoor air pollution by purifying a harmful gas produced by an electric welding apparatus. It is an object of the present invention to provide an electric welding apparatus having a harm...
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WO/2004/035252A1 |
A gas powered soldering tool (1) comprises a main housing (3) which forms a handle (4) and a fuel gas reservoir (5) and defines a main central axis (2). A body member (10) terminating in a soldering tool tip (11) forms a combustion chamb...
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WO/2004/035253A1 |
An apparatus and method for filling a ball grid array template (3) is disclosed. The apparatus comprises a normally horizontal base plate (1) with the ball grid array template (3) being mounted onto the base plate at one end. A solder ba...
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WO2003090507A9 |
A two-stage filtration system is coupled with an oven, such as a solder reflow oven, to remove a vapor stream from the oven and to remove organic compounds that have volatilized from a solder flux and other contaminants from the vapor st...
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WO/2004/033140A1 |
The use of a fixture element (1) according to the invention, which is composed of two stainless steel plates (2), and mounting of a core of graphite (3) therebetween, said plates (2) being oxidized by heating in air at a temperature abov...
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WO/2004/032584A2 |
The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and circuit boards. Vision systems are used to loc...
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WO/2004/030855A1 |
Disclosed is a cleaning device (11) for the processing gas of a reflow soldering system and a method for the operation thereof. According to the invention, the cleaning device contains a cleaning fluid (16) enables non-cleaned process ga...
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WO/2004/011177A2 |
Only one spherical fine particle 1 is fed from a cartridge 2. The particle 1 is held by a precision manipulator 3. The diameter of the particle 1 is measured by a measuring device 6 to detect the central position of the particle 1. The p...
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WO/2004/011191A1 |
The present invention is concerned with an apparatus (2) and a method., for holding in position adjacent facing ends of tube sections for preferably joining them by welding. The apparatus has an elongated element (8) insertable between t...
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WO/2004/010753A1 |
A method and a system for jetting droplets of viscous medium, such as solder paste, onto a substrate, such as an electronic circuit board. The volume of the droplets are adjusted by regulating the amount of viscous medium that is fed int...
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WO/2004/007133A1 |
A dispensing system (10) and method for dispensing material onto a substrate. The dispensing system (10) includes a frame, a support, coupled to the frame, that the supports the substrate at a dispensing position in the dispensing system...
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WO/2004/001940A1 |
A power supply for supplying a high current instantly by inverter-controlling a step-down transformer by using the energy stored in a storage battery. The power supply comprises, as shown in Fig. 1, an electric circuit unit for charging ...
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WO/2004/000500A1 |
An apparatus for performing operations on at least one surface of an electronic substrate (10) having a first surface and a second surface includes a frame, a transportation system that moves the substrate (10) through the apparatus, a s...
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WO/2004/001177A2 |
The present invention provides an improved system and method for performing a desired operation at a remote location in a wellbore. The system is composed of a downhole docking station assembly (20) and a detachable downhole tool assembl...
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WO/2004/000497A1 |
A fluxer (10) applies powdered flux (11) to an object (12). The fluxer (10) includes an enclosure (14) that defines a chamber (28) where the object (12) is fluxed. The enclosure (14) includes an inlet (24) for receiving the object (12) i...
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WO/2003/098982A1 |
A reflow soldering device where a substrate (5) mounted with electronic components is transported by a conveyor (4) in a device partitioned into chambers (1), (2), (3). Blowers (6) are installed in the chambers (1), (2), (3). The centers...
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WO/2003/097288A1 |
A heater tip for thermocompression bonding capable of eliminating the possibilities of separation of the thermo-detecting part of a thermocouple and breakage of leads by heating and vibration, wherein a set of power terminal parts, a hea...
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WO/2003/092947A1 |
This invention relates to a method for dispensing solder into contact with a substrate to be soldered wherein the part of the dispensing pathway that comes into contact with liquid solder is lined with a material suitable for assuaging t...
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WO/2003/080286A1 |
A paste-like composition for brazing which comprises a brazing material powder, a butyl rubber and an organic solvent, wherein the brazing material powder comprises one or more selected from the group consisting of a copper brazing powde...
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WO/2003/079743A2 |
The invention relates to a method for fitting out and soldering a circuit board which is fitted with a wired electric component with at least one connection wire or pin and a thermally critical housing for conventional automatic solderin...
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WO/2003/066265A2 |
A vacuum heat treating furnace for brazing a large metallic part is disclosed. The vacuum furnace includes a pressure vessel having a cylindrical wall and a door dimensioned and positioned for closing an end of the cylindrical wall. A wo...
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WO/2003/061893A1 |
The invention provides an apparatus (10) that separates solder from solder dross (65), comprising first and second rolls (15, 20) and a fixture (23). The first roll (15) has a substantially cylindrical surface and is rotatable about a fi...
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WO/2003/059564A1 |
A soldering method, wherein the rate of decrease of an oxidation suppressing element in a soldering bath is measured during operation of the bath, and a solder alloy containing the oxidation suppressing element in an amount equal to or m...
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WO/2003/060987A1 |
A method of arranging micro spheres with liquid, a micro sphere arranging device, and a semiconductor device, the method comprising the steps of placing the semiconductor device (2) with holes placed, through a large number of pads, on a...
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WO/2003/056592A1 |
Solder ring (12) for joining two components (10, 11) of a vacuum tube, the solder ring (12) comprising a joining part that consists of solder material for forming an airtight joint between the two components. The solder ring (12) further...
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WO/2003/055639A1 |
A slotting device for resin flux cored solder capable of slotting a resin flux cored solder, comprising a disk-like slotting blade for slotting the solder, a drive means for rotatingly driving the slotting blade, a guide roller having V-...
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WO/2003/051568A1 |
A soldering iron comprises a graphite tip having two separate halves (9, 10) that are electrically isolated from each other. When both halves of the tip are applied to an electrically conductive material, such as the material to be solde...
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WO/2003/030246A2 |
According to the invention, a chip (4), maintained on a chip support (13) by means of a mandrel (1) is heated by a radiation source (12) on the side opposite to the wafer (2) so as to melt an input soldering metal applied on one side opp...
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WO/2003/028932A1 |
A processing device, a processing method, and production equipment using the device and the method capable of locally heating a work at a high speed and being applied to a soldering connection, the device comprising a light source (1) ge...
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WO/2003/026833A1 |
A mask (1010, 1210) having cells (1034, 234) is disposed on a surface of a heater stage (1008, 1208), and is filled (printed) with solder paste (1202). A substrate (e.g., wafer 1006) is assembled to the opposite side of the mask, and the...
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WO/2003/024653A1 |
The invention relates to a method for the production of a soldered connection between at least two contact partners (22, 23) of a contact arrangement (21), whereby a moulded piece of soldering material (27) is arranged at a separation fr...
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WO/2003/022499A1 |
The invention relates to a method and a device for applying a solder material to a metallic structure (23), especially a honeycomb body (1). Said metallic structure (23) is brought into contact with a powdery solder material (6) in such ...
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WO/2003/022504A2 |
The invention relates to a method for joining a metallic fastening element to a metallic workpiece (5), whereby the fastening element has a support (2) that supports a soldering material (3) to which the support (2) is connected in an el...
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WO/2003/013774A2 |
Manufacture of a spark-erosion electrode from a blank (2) is carried out with the blank (2) clamped in a vice 1 mounted on a standard pallet. The closing faces (11,12) of the vice-jaws (9,10) have projections (15-17) of pyramidal form fo...
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WO/2003/006197A1 |
The invention relates to a method which is characterized by applying a solder by positioning it in its solid physical condition, melting it and then pitching it against a substrate by means of compressed gas. The device for applying a so...
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WO/2003/004208A1 |
The invention relates to a soldering nozzle for wave soldering printed circuit boards with electric components, which comprises rows of solder outlets arranged transversely with respect to the direction of conveyance of the printed circu...
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WO/2002/100589A1 |
An integrated solder bump deposition method and apparatus that enables solder bumps to be lithographically formed on a substrate (206). The apparatus comprises a plurality of electrolyte cells (112, 114), and etch/clean/passthrough stati...
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WO/2002/096589A1 |
The present invention provides an electric soldering iron comprises: a heating device (12) disposed at a side of a handle; a tip portion (13) into which the heating device (12) is inserted; a heat insulating connector (14) connected to t...
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