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WO/2001/034334A1 |
A method and device for thermal treatment of workpieces or components, especially for producing a soldered joint between a solder material and at least one component or workpiece which is used as a carrier for said solder material. The s...
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WO/2001/033923A2 |
The invention relates to a soldering unit for soldering electrical components onto boards using a machine. The soldering unit comprises a solder storage container (4) for receiving liquid solder, a solder applicator device (20) wherewith...
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WO/2001/030531A1 |
The invention relates to a fluxing agent based on alkalifluoroaluminate which is very suitable for dry application ('dry fluxing'). Said fluxing agent does not have any fine grain components and is defined by a coarse grain distribution ...
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WO/2001/030527A1 |
A chain/ring making brazing furnace, comprising a conveying device for conveying longitudinally a chain to be heated (1) having a joining powder brazing filler metal to the vicinity of a butting portion of a gold/gold alloy- and platinum...
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WO/2001/020957A1 |
A multi-layer printed circuit board assembly (300) that incorporates one or more heating elements (310'') as an inner layer of the assembly such that after screen printing solder paste and the placement of components (252'', 254'', 256''...
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WO/2001/019561A1 |
The invention relates to the joining of a support matrix of a honeycomb (4), especially a catalyst support body, on at least one end face; said support matrix consisting of at least partially structured layered or wound metal sheets and ...
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WO/2001/014093A1 |
An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific locati...
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WO/2001/007192A1 |
A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurised viscous mat...
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WO/2001/005592A1 |
A screen printing head for a method of applying a pasty product to a printing screen, the printing head comprising : a main body (30); wiper blades (31, 32) disposed to the main body for contacting a printing screen (34); a first chamber...
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WO/2001/002123A1 |
The invention relates to a printhead for jetting a hot liquid medium. Said printhead comprises a membrane that forms the wall of a medium chamber and an actuator that is mechanically connected to said membrane. The printhead is character...
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WO/2001/002122A1 |
The invention relates to a print chip for a printing head working according to the ink printing principle, comprising a recess in the print chip that forms a medium chamber, a deflectable membrane forming a wall of the medium chamber, a ...
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WO/2001/002120A1 |
A heat exchanger, wherein an oil cooler unit in the state of preventing heat exchange cores (110) from falling off from a casing (120) is assembled temporarily to first and second plates (130, 140) and, after the oil cooler unit is immer...
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WO/2001/001739A1 |
A solder paste stencil printing apparatus (20) and method of applying a controlled pattern and volume of solder paste onto a single area array component site on a populated printed circuit board (PCB). The stencil is a disposable, adhesi...
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WO/2000/073180A1 |
An apparatus (10) is provided for supplying solder balls (12) to a receptacle (14). The apparatus (10) includes a reservoir (16) for storing the solder balls (12) and a flow path (38). The flow path includes a first end (40) connected to...
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WO/2000/073009A1 |
An apparatus for processing printed circuit boards including a system for measuring and controlling solder wave height generally comprises conveyor system for transporting printed circuit board through a number of processing stations. Th...
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WO/2000/071764A2 |
An improved cobalt-base braze alloy composition and method for diffusion brazing are provided for use in repairing superalloy articles. The improved cobalt-base alloy composition includes nickel; at least one element selected from the gr...
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WO2000052228B1 |
The present invention is directed to a means for the surface preparation of a metal or metal alloy substrate. In the process of the present invention, a stream of a mixture of flux particles and metal particles is hurled at the substrate...
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WO/2000/067005A1 |
The invention relates to a method and apparatus for inspecting a substrate having a substance deposited thereon. The steps of the method include depositing the substance onto the substrate; capturing an image of the substrate; detecting ...
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WO/2000/066312A1 |
The invention concerns a method for moulding and soldering electrical connection studs on mounting lands (12) for electrical connection in circuits or electronic components. The method comprises a step which consists in injecting a condu...
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WO/2000/062969A2 |
A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting element such as aluminum in the presenc...
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WO/2000/062967A1 |
A hot iron such as a soldering iron, a plastic welding machine, iron, hair iron, and others, which is used while a workpiece is being observed, particularly those which can be used several seconds after a switch is turned on, wherein a h...
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WO/2000/061297A1 |
This invention relates to an assembly (5) for dispensing droplets of a viscous medium. The assembly (5) is releasably mountable in a machine (1) using the assembly for providing a substrate (2) with deposits. The assembly comprises an as...
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WO/2000/062587A1 |
This invention relates to an assembly (5) for jetting droplets of a viscous medium. The assembly (5) is releasably mountable in a machine (1) using the assembly for providing a substrate (2) with deposits. The assembly comprises an assem...
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WO/2000/059670A1 |
The invention relates to a soldering frame (1) for soldering electronic and electrical components (32) by machine onto printed circuit boards (31). Said soldering frames comprise at least two struts which lie opposite each other and whic...
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WO/2000/059671A1 |
An inspection station (6) has a ring of 370 nm LEDs (24) for low-angle diffuse illumination of flux. This stimulates inherent fluorescent emission of the flux without the need for flux additives or pre-treatment. A CCD sensor (20) detect...
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WO/2000/054921A1 |
A filling device for and a method of filling balls in an array of apertures in a ball-receiving element, the filling device comprising: a housing including an opening at a lower surface thereof and defining in part a chamber for containi...
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WO2000022667A9 |
An apparatus for placing solder balls in a pattern on a substrate, e.g., to form a ball grid array, the apparatus comprising a template (46) having a first plane (48), a second plane (60), and a plurality of holes passing substantially o...
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WO/2000/050196A1 |
An apparatus for solder stenciling includes a stencil (35), a ball joint (41) including a ball and a socket, and an arm (37) fixing the stencil to one of the ball and the socket. A method for stenciling solder on a workpiece is also disc...
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WO/2000/044522A1 |
The invention relates to a metal foil connection (1) between a first (2) and a second (3) metal foil, where the first (2) and the second (3) metal foil both have a thickness of less than 0.05 mm and are soldered together at a connection ...
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WO/2000/043156A1 |
A printer (10) for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer (10) includes a frame (12), a device, mounted to the frame (12), having a number of perforations arranged to form the...
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WO/2000/038874A1 |
Solders, fluxing agents or binders are applied at a high speed on surfaces to be subjected to brazing, especially on the surfaces of extruded components (10) produced from aluminum and its alloys. Heat is used to melt these agents. Accor...
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WO2000008684A9 |
An improved semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. A silicon die (102) is attached to a carrier (100) (or substrate) that has a cavity surrounding the die (10...
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WO2000020154A9 |
An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform (112) to support the substrate at a first sphere placement position in the apparatus, and a placement station (107) disposed ab...
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WO/2000/027570A1 |
The invention concerns a method using powder metallurgy for making components capable of being assembled by self-brazing to receiving metal parts, comprising the following steps: a) preparing a molten or liquid mixture of a basic metal p...
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WO/2000/025972A1 |
A solder paste product includes solder paste in a container with a time-temperature indicator positioned to measure the solder paste's cumulative exposure to heat.
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WO/2000/025971A1 |
The present invention relates to an apparatus and a method for inerting a wave soldering installation having a solder bath (19) and a conveying system for producing one or more solder waves (14, 15), in particular for soldering electric ...
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WO/2000/025358A1 |
The invention concerns a device (14) for implementing a method for setting on a substrate (2) interconnecting balls or preforms (1) comprising the following phases: storing in bulk the preforms (1); seizing in ordered position the prefor...
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WO/2000/018534A1 |
The invention relates to a device for treating printed circuit boards. This device comprises a frame, a solder vessel for liquid solder arranged on the frame, blowing means for blowing off excess solder, clamping means mounted movably on...
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WO/2000/016941A1 |
A heat shield device suitable for use with a soldering device comprises a heat shield and means for moving the heat shield to and from a shielding position in which it shields a target area from a heat source, wherein the movement of the...
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WO/2000/015384A1 |
The invention relates to a paste for welding ceramic materials to metal contact surfaces or metals, containing a precious metal, an aluminium compound, a silicon compound and a compound selected from the following group: barium compounds...
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WO/2000/011921A1 |
The invention relates to a method and a device for placing a plurality of shaped pieces (20) consisting of solder material on a connecting surface arrangement (29) of a substrate (23) having a plurality of connecting surfaces (28) and fo...
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WO/2000/010763A1 |
Purpose: a method and a device for distributing solder balls which completely prevent missing or duplicated solder balls. Constitution: a storing hole (11) sized for allowing only one solder ball (4) to be stored therein is provided in a...
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WO/2000/006333A1 |
The invention concerns a method for brazing by solder reflow electronic components (22) on a support, for example a printed circuit wafer (20) which consists in: arranging a solder alloy on the support (20) in sites for connecting the co...
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WO/2000/003829A1 |
An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with...
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WO/2000/002695A1 |
The invention relates to a method for separating dross floating on solder into solder and a residue, comprising of repeatedly cutting through the dross with at least one knife extending substantially parallel to the direction of movement...
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WO/1999/064167A1 |
The present invention refers to a method and a device for jetting droplets of a viscous medium onto an electronic circuit board. According to the invention, said viscous medium is applied from a viscous medium supply container (140) to a...
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WO/1999/058283A1 |
A polished soldering tip (10) is created by making a form from copper or a copper alloy with a high rate of thermal conductivity. The working surfaces of the soldering tip are overlaid with electroplated iron of at least .002 inch thickn...
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WO/1999/056889A1 |
Apparatus and methods for dispensing droplets of liquid or viscous material. The apparatus generally comprises a valve operated dispenser (10) and a control (128', 129) for moving the valve member (42') with respect to a valve seat (38')...
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WO/1999/048642A1 |
A mask (110; see also 160, 210, 260, 310, 408, 500, 702, 802, 904) having a plurality of openings (cells) is disposed on, or nearly on, the surface of a substrate (102), the openings (112) of the mask being aligned over a corresponding p...
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WO/1999/041036A1 |
A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting a pressurized stream of air, ...
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