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WO/2007/137547A1 |
The invention relates to a method and a device (10) for the heat treatment of workpieces (19) or components, especially for producing a soldered connection between a solder material and at least one component or workpiece used as a solde...
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WO/2007/138310A2 |
A selective soldering apparatus comprises a bath (3) for molten solder (5), a solder nozzle (19) and a pump (9) for pumping molten solder (5) through the nozzle (19). The nozzle has a nozzle body (21) with an inner bore (22) through whic...
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WO/2007/137952A1 |
The invention relates to a soldering arrangement (1) for soldering components that are mounted on a printed circuit board. Said soldering arrangement contains a soldering module (4) and comprises at least one mobile and interchangeable s...
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WO/2007/134590A1 |
The invention relates to a method and a device for joining conductive parts (11, 12) in a soldering fashion by feeding solder material (5) to the connection zone (13) of the parts (11, 12), fusing off solder material (5) and introducing ...
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WO/2007/134740A1 |
A soldering apparatus has a container (11), in which a bath of soldering liquid (12), in particular tin, is arranged, and a pump (13), by means of which the soldering liquid (12) can be fed under pressure to at least one nozzle. The pump...
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WO/2007/131360A1 |
It has been observed that turbulent solder flow, particularly at the opening of a conventional flow well, correlates to a greater degree of Cu dissolution of the PTH barrels of a PCB, especially those that are aligned with the opening. A...
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WO/2007/128981A1 |
A screen printing head which, in a printing operation, is displaceable in a first direction over a surface of a workpiece to print deposits of a print medium on the workpiece, the screen printing head comprising: a print head assembly co...
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WO/2007/123237A1 |
A jet solder tank having excellent maintainability, having no variation in the height of a jet, not damaging the rotating shaft of a jet pump, and capable of being stably used for a long period. The jet solder tank (1) has a tank body (1...
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WO/2007/119377A1 |
In a method for fabricating a dissimilar material jointed body (1), two plate members (2, 3) consisting of dissimilar materials are laminated to obtain a plate member laminated body (4) and the two plate members (2, 3) are joined by heat...
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WO/2007/116853A1 |
[PROBLEMS] Conventional jet solder baths using screw pumps have a problem that molten solder jetted from a jet nozzle pulsates up and down. The pulsation in the screw pump is due to a reverse flow caused by a wide gap between the screw p...
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WO/2007/116666A1 |
[PROBLEMS] In conventional reflow furnaces having suction ports in the vicinity of many hot-air blowing ports, there have been some cases where the hot-air blowing nozzles are cooled when hot air at a reduced temperature after printed bo...
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WO/2007/116451A1 |
A process for producing a solder-joined product, comprising carrying out solder joining of parts to a substrate through reflow heating of a substrate having mount parts placed thereon under given heating conditions, wherein the respectiv...
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WO/2007/105687A1 |
A flux transfer unit is provided to be used in an electronic component mounting apparatus which transfers a flux onto an electronic component taken out from a component supplying section and mounts the electronic component on a substrate...
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WO/2007/100129A1 |
According to the present application, a cartridge system (35) for a cartridge type soldering iron has a sleeve stopper (1) with hooks (24) and a sleeve (21) which goes over the stopper (1). The hooks (24) of the sleeve stopper (1) lock w...
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WO/2007/097134A1 |
In the manufacturing of camera module structure (100), while melting a solder at solder joining area (3) by blowing hot air from hot air nozzle (4), hot air in convection toward the side of camera module (2) is suctioned by suction nozzl...
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WO/2007/085563A1 |
The invention relates to a method of applying a solder deposit (4) consisting of a solder material (6) containing aluminium to a substrate (8), in which the solder deposit (4) is applied to the substrate (8) by cold gas spraying of the p...
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WO/2007/085484A1 |
The invention relates to a method for producing a metal part. Said method comprises the steps of supplying a strand of metal material and applying a coating from a fluxing agent composition to a surface of the strand of material by means...
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WO/2007/084888A2 |
A method of dispensing a solder paste comprising at least a flux carrier and solder onto a substrate (70), wherein the flux carrier and solder each have a melting temperature with the melting temperature of the solder being higher than t...
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WO/2007/077688A1 |
Disclosed is a method for soldering semiconductor elements on bonding sections arranged at a plurality of areas on a circuit board, respectively. The soldering method is provided with a step of arranging the bonding sections in nonlinear...
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WO/2007/077727A1 |
Provided is a reflow apparatus which can adjust heating temperature and heating time in detail for heating a work for reflow. A work transfer conveyer (12) for transferring a work (W) into a furnace (11) is arranged. Along the work trans...
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WO/2007/074835A1 |
A soldering method for soldering an electronic component on a circuit board is provided. In the soldering method, a cooling circuit board is used as the circuit board. The cooling circuit board includes an insulating board having a metal...
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WO2006044430B1 |
A portable electronic device, such as a soldering iron (1), is provided with two electrodes (9, 10) formed of or containing an electrically resistive material. The electrodes (9, 10) are electrically connected to a source of power (8). W...
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WO/2007/060101A1 |
The invention relates to a method of brazing metal components, in which essentially fluxless metal components are brazed in an inert gas atmosphere, and to a corresponding device for brazing metal components in an inert gas atmosphere. T...
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WO/2007/054371A1 |
A jetting apparatus (15) for jetting droplets of viscous medium onto a substrate and a method of improving the performance of the jetting apparatus. The jetting apparatus (15) includes a jetting outlet (27) through which the droplets are...
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WO/2007/054045A1 |
The invention relates to a soldering device (01) for soldering workpieces, wherein the soldering device (01) has a least one heating element (06), at least two heating current leads (07, 08) and at least one sensor (05, 06, 07, 08, 09, 1...
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WO/2007/055149A1 |
[PROBLEMS] To provide a work holding vessel and a work dismounting method for containing a liquid member and dismounting a work without breaking the work. [MEANS FOR SOLVING PROBLEMS] A work holding vessel (10) can contain a liquid solde...
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WO/2007/034439A1 |
A soldering iron (100) includes a head (118) defining a cavity (120) shaped and dimensioned to receive an electric light bulb (16) operable to heat the head (118).
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WO/2007/031331A1 |
The invention relates to a device and a method for applying hard solder (1) to an at least partially structured metal foil (2), comprising at least the following steps: a) provision of at least one flat metal foil (2), b) shaping of the ...
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WO/2007/029866A1 |
A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackif ier compound, thereby imparting tackiness to the metallic surface to form a tacky part, ...
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WO/2007/027401A2 |
Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder...
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WO/2007/020174A1 |
The invention relates to a thermode device for connecting and/or electrically contacting a multitude of first semiconductor components with at least one supporting element and/or a multitude of second semiconductor components by heating ...
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WO/2007/004780A1 |
Provided is a reflow soldering apparatus that can uniformly provide high-temperature gas to an entire surface of a print board, without influence of temperature gradient and flow rate gradient. Thus, the reflow soldering apparatus can re...
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WO/2006/136095A1 |
An electrical soldering iron includes a power supply unit, an electric heating element, a temperature sensor, and a controller unit that controls electric power outputted from power supply to the electric heating element based on the sig...
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WO/2006/136094A1 |
The present invention provides a quick temperature compensation method for an electric soldering iron and a quick temperature compensable electric soldering iron which includes a static temperature control circuit and a dynamic temperatu...
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WO2006089032B1 |
A container for soldering adjuvant is made of a metal having a composition similar to the composition of a solder bath. Preferably, the container holds solder paste and the container is made of metal having a composition similar to the c...
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WO2006094621B1 |
Disclosed is a device for purifying a process gas in a reflow soldering system. Said device comprises a receptacle that contains at least one packing bed. The process gas is fed to the receptacle via a gas inlet while being discharged fr...
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WO/2006/112473A1 |
A bond and a joining method for the bond. A solder (13) is molten and adhered to the joining face of the terminal (2) of a rail bond and the outer side face of the rail head part (6A) of a rail (6) to which the terminal is joined. The te...
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WO/2006/110519A1 |
The present application refers to a pair of soldering tweezers (10), having: a first arm (20) having a distal end (21) that is adjustably positionable in a direction parallel to its central longitudinal axis, a second arm (30) having a d...
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WO/2006/103766A1 |
A ball capturing device and a ball capturing method for capturing one ball from a plurality of balls of the same size and a solder ball arranging device and a solder ball arranging method for arranging solder balls with solder at prescri...
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WO/2006/100899A1 |
A jet solder vessel capable solving a problem in a conventional jet solder vessel wherein the bottom face of a body at the lower side of the inlet of a duct is bitten by a fused solder and a hole is formed therein and the fused solder ov...
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WO/2006/091410A1 |
A wave solder nozzle (42) is capable of delivering solder material to perform a wave soldering operation on a printed circuit board (18) in an inert atmosphere. The wave solder nozzle (42) includes a front plate (48) and a back plate (50...
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WO/2006/078000A2 |
To provide an electronic component mounting system, an electronic component placing device, and an electronic component mounting method, which can prevent waste due to the place of an electronic component onto a unit substrate having a p...
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WO/2006/077618A1 |
A baffle plate (20) fixedly installed in the air passage of a mechanism blowing out hot air to a solder treatment part, a nozzle fitted to a hot air blower for solder treatment, and the hot air blower for solder treatment blowing out the...
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WO/2006/075803A1 |
A reflow furnace, wherein circular holes (21) are formed in a second horizontal plate (18a) forming the bottom surface of an atmospheric gas collecting box (18) at equal intervals between adjacent delivery pipes (20) and (20). A partitio...
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WO/2006/067827A1 |
[PROBLEMS] To provide a precoating method by which uniform coating can be performed without generating a failure, and further, by simple equipment, and to provide a work whereupon solder is uniformly adhered. As precoating methods for pr...
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WO/2006/066221A2 |
A soldering assembly (13) has a base (12) with a support member (14) and at least one workpiece support member (57) to support a workpiece. A soldering iron (10) is removably supported by the base support member. The soldering iron inclu...
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WO/2006/041210A1 |
A method of manufacturing a hollow circuit substrate, the entire of which is composed of two metal sheets 3 and 4 which are brazed to each other in a laminated state with a bulging hollow circuit formed between the two metal sheets 3 and...
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WO/2006/040815A1 |
A chip for soldering iron exhibiting extremely excellent thermal conductivity by tightly bonding plural kinds of metals having different thermal conductivity together at a level equivalent to plating. The chip for soldering iron is chara...
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WO/2006/037520A1 |
The invention relates to a device for wave soldering workpieces (15), comprising means for moving the workpiece (15) that is to be soldered along a specific path across at least one solder wave (3, 4, 5, 6) generated above a solder reser...
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WO/2006/030955A1 |
An electrically-controlled soldering pot apparatus with (100) a timer control mechanism and a temperature control mechanism; alerting a user when to exchange a solder bath before erosion to the solder bath occurs in an electrically-contr...
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