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WO/2006/025595A1 |
A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to a slow down starting position where there is no risk that the electronic component makes ...
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WO/2006/019966A1 |
A stencil printer for printing solder paste onto a substrate includes a frame, a stencil, coupled to the frame, having apertures formed therein, a support assembly, coupled to the frame, to support the substrate in a printing position be...
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WO/2005/118196A1 |
To hard-solder parts to be joined (2) along a common joint, the parts are heated by a heat source e.g. a laser beam (3). Fused solder (7) that is stored in a container (6) is then introduced into the joint. Joints can be rapidly filled w...
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WO/2005/120141A1 |
A solder jetting apparatus is provided with a solder bath (2); a planar heater (3) and a tube heater (4) as heating means; a solder blowing means (5) which has nozzles (51, 52) protruded for blowing a solder (10) and is attached in the s...
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WO/2005/118197A1 |
Disclosed is a soldering iron comprising at least one replaceable soldering tip and a tip holder which supports the same and is provided with a handle section and a terminal housing section that adjoins the tip holder. In order to be abl...
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WO/2005/119847A1 |
Methods and apparatus are provided for removing plating from a device. The method and apparatus may be used for preparing an electrical connector (100) for connecting at least one wire or other terminus thereto where the electrical conne...
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WO/2005/115670A2 |
A soldering iron (and a desoldering iron) with a replaceable tip, which is releasably securable on the forward heat-conducting end of a soldering (or desoldering) iron heat assembly. The tip has a tapered heat conducting core in a tip ca...
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WO/2005/115669A2 |
Solder is pumped through a nozzle to produce a jet (12) of solder and leads on a printed circuit board are passed through the jet to solder them to the board tracks. The nozzle (2) is mounted on a flange (16) held between slip rings (18,...
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WO/2005/115671A1 |
A soldering apparatus comprises a solder bath (6), a body (8) positioned in the bath (6) and having a plurality of main conduits (22) for feeding solder from a solder pump (16) to a nozzle or thimble (34). Each conduit (22) communicates ...
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WO/2005/115072A2 |
The invention relates to a support (4) with solder globule elements (1), for assembly of substrates (2) with globule contacts. The invention further relates to a unit for assembly of substrates (2) with globule contacts and a method for ...
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WO/2005/110657A2 |
A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Leadfree solder becomes practical for use since the temperature for re...
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WO/2005/107991A1 |
The invention relates to a wave soldering installation comprising a conveying device (12) for articles to be soldered and comprising a solder delivery device, which, in the direction of gravitational force, is situated underneath the con...
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WO/2005/097390A1 |
In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individu...
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WO/2005/096367A1 |
An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowin...
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WO/2005/096459A1 |
A solder is prevented from flowing onto a coaxial cable side at the time of soldering. A method is provided for soldering a fine coaxial cable, and the method includes a step of arranging a coaxial cable shield on a grounding bar, a step...
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WO/2005/093115A1 |
A passivated coating including a nitriding modified layer wherein no chromium nitride (CrN) is contained is formed on a surface of austenite stainless steel. The passivated coating constituted of chromium oxide acts as a protective film ...
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WO/2005/092552A2 |
A portable induction tool (10) is provided for soldering or brazing sections of metal pipe tog they. A work coil head (20), with induction coil (34), is U-shaped, allowing placement of the head (20) around lengths of pipe, heating a susc...
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WO/2005/092562A1 |
The invention relates to a solder film for soldering parts, particularly plates of heat exchangers. To this end, the solder foil has a defined contour adapted to the parts to be soldered. According to the invention, the solder foil (12) ...
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WO/2005/087422A1 |
The invention provides a process for soldering in the vapour phase, in which after the solder has melted onto the soldered item (2) a vacuum is created around the soldered item (2) in the vapour phase. Also provided is a device for solde...
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WO/2005/084865A1 |
A cordless electric solder heating tool and a holding stand for the heating tool. The solder heating tool (1) comprises a tip chip (3) heating a solder, a heating part (5) heating the tip chip (3), a body (2) having the tip chip (3) and ...
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WO/2005/083402A1 |
A method of inspecting a stencil having apertures through which a substance is deposited onto an electronic substrate includes depositing the substance through the stencil and onto the substrate, capturing a first image of the stencil af...
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WO/2005/077583A1 |
Disclosed is a method enabling soldering with good quality. The pressure in a vacuum chamber (2), wherein an object (10) with a solid solder containing tin only or tin and one or more components selected from silver, lead, copper, bismut...
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WO/2005/077582A2 |
Plant for brazing metal pieces, including a device for washing the metal pieces to be brazed, a device for applying fluxant on said pieces and a brazing furnace. Said device for fluxant application is a fluidized bed.
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WO/2005/070601A1 |
In order to avoid excessive internal stress and micro structure problems inherent with previous fusion welding techniques utilised for component structure fabrication, the present method creates a relatively thin in situ brazing alloy la...
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WO/2005/070606A1 |
A soldering iron tip member (20) for a solder heater and electric solder irons (10) and (50) using the tip member, the soldering iron member (20) comprising a metal soldering iron tip (3) fusing a solder by coming into direct contact wit...
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WO/2005/070603A1 |
The invention relates to a repair soldering head (12) which can for example be used to replace structural elements (26). For unsoldering, the structural component (26) is heated by means of a heat transfer medium (16) until the soldered ...
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WO/2005/070604A1 |
A solder heating device, comprising an iron head member (20) in which an iron head tip (3) directly touching solder to fuse the solder is integrally fitted to the tip of a cylindrical member (6), a body side member (25) to which the base...
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WO/2005/070605A1 |
A soldering iron bit member for a solder heating tool characterized by comprising a soldering iron bit (3) of metal for melting a solder by direct contact with the latter, a substantially bar-like ceramic heater (4) provided with a tempe...
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WO/2005/069370A1 |
An apparatus is provided for forming a solder layer (11) on a die pad (1) of a leadframe. Initially, a drop (3) of the solder is deposited on the die pad (1), and this is formed into a layer (11) by the lower surface (19) of a tool (17) ...
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WO/2005/065877A1 |
[PROBLEMS] A reflow furnace with a conventional flux fume removing device has had difficulty in completely sucking flux fume in the furnace, and in addition, when a purified gas is circulated in the furnace, such a reflow furnace has bee...
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WO/2005/065876A1 |
[PROBLEMS] A reflow furnace using a conventional hot-air blowing-type heater has a problem in reducing &Dgr t and in stabilizing an oxygen concentration at a low state. Further, in a conventional hot-air blowing-type heater, uniformly bl...
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WO/2005/059823A2 |
A method of analyzing an image of a substance deposited onto a substrate, the image comprising a plurality of pixels, includes defning a region of interest in the image, associating the region of interest with first and second perpendicu...
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WO/2005/056227A1 |
A soldering and desoldering iron (100) with a replaceable tip cap (130) fitted on the forward heat conducting core end (150) of a soldering or desoldering iron assembly. Conductive paste, powder or a low melting temperature material (220...
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WO/2005/056200A1 |
The present invention provides a stencil and method for depositing a viscous product about solder balls therewith.
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WO/2005/047769A2 |
A soldering iron (1) comprises a handle (2) and a soldering tip (3) secured to the handle (2) by a gas supply pipe (4). Fuel gas in a reservoir in the handle (2) is supplied to a combustion chamber (14) located in the soldering tip (3) t...
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WO/2005/046921A1 |
The invention includes a method of joining two components (102 103). The Method includes providing at least two components (102, 103) to be joined, a reactive multilayer foil (101), and a compliant element (2), placing the reactive multi...
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WO/2005/046923A1 |
A soldering iron (10) with a removable tip (20), including: a soldering iron (10), including: a shaft (30); a ferrite bobbin (32) disposed on the shaft (30); a magnetic coil (36) wrapped around the ferrite bobbin (32); and a removable ti...
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WO/2005/035176A1 |
A jet solder vessel, wherein a solder feeding chamber (2) is formed in a solder vessel body (1), and an inlet (3) is formed in the solder feeding chamber on the lower side of a liquid level (L) and an outlet (4) is formed on the upper si...
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WO/2005/033352A2 |
A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an elect...
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WO/2005/031847A1 |
The invention relates to a method and an associated device which make use of suction ports in order to grip balls individually and/or collectively and remove said balls from a bulk container of loose balls, such as to transfer same onto ...
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WO/2005/018861A1 |
A heater chip for thermocompression bonding, where the degree of heating at a thermocompression bonding part does not vary among individual heater chips and durability is enhanced. In a heater chip for thermocompression bonding, a small ...
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WO/2005/009626A1 |
The invention relates to a fluid droplet discharging device comprising a fluid reservoir that is open for discharging fluid droplets and comprising an actuator for pressurizing the fluid serving the discharge thereof. The invention provi...
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WO/2005/000515A1 |
A wire material payout device where a soft wire material is easily inserted and set. The wire material payout device pays out a wire material by a chuck body (7) capable of gripping and releasing the material and moving it in the forward...
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WO/2004/113008A1 |
A controller automatically starts an electromagnetic induction pump (14) in a predetermined timing after start of a heater (13), causing JOG jet flow of a solder (11) melted by the heater (13). Stirring by the electromagnetic induction p...
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WO/2004/107432A1 |
A packaging method of an electronic component employing solder bumps in which thermal stress is controlled for the board, a removing method and devices therefore. The packaging method of an electronic component (bare chip (32)) being sol...
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WO/2004/105989A2 |
When dross (20) is removed from a molten-solder reservoir (12), a substantial amount of molten solder is often removed with the dross. This molten solder can be separated from the dross and returned to reservoir via a conduit for reuse...
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WO2003085697A9 |
A method of retaining a solder mass (40) to a solder-bearing article (20) is provided and includes the steps of: (a) disposing a length of solder mass over at least some of the plurality of openings (30); and forming a plurality of solde...
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WO/2004/103628A1 |
The present invention (Figure 1) relates to a new formula-controlled method of joining by brazing a connecting piece with a workpiece where the temperature is controlled during all phases of the process before, during and after the brazi...
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WO/2004/103627A1 |
The invention relates to a method for connecting a hollow profile (1) to a two-dimensionally contacting vehicle component (2) by means of soldering. According to the inventive method, a solder (4) is inserted between the hollow profile (...
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WO/2004/100629A1 |
A flux transferring device for forming a high-quality flat flux film without irregularities by squeegeeing. The device comprises a scrape squeegee (15) for scraping the used flux in a film-forming recessed portion (12) of a transfer tabl...
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