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WO/1997/003784A2 |
An assembly of disc-shaped thermistors, in which first and second thermistors (24, 26) rest on respective fulcrums (20, 22) on a first contact (18), and a third thermistor (28) rests on the first two thermistors (24, 26), with a second c...
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WO/1997/000752A1 |
A gas knife cooling system for reflow soldering cools soldered articles (12) by impinging a gas flow directly on the articles and as a result uses less cooling gas. A heater (32) is associated with the cooling system to remove flux depos...
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WO/1996/041699A1 |
A device for manufacturing solid spheres such as solder spheres having a high sphericity and a high dimensional accuracy without the necessity for classification of solid spheres. The device comprises a flat plate having a plurality of h...
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WO/1996/038253A1 |
The soldering paste (1) is applied by means of a doctor blade (4, 8) via a template (2) disposed on the printed circuit board (3). The object of the present invention is to propose a suitable checking device which ensures that the produc...
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WO/1996/025264A1 |
A surface mount device desoldering and removal tool (10) including a flexible carrier plate (12) and a plurality of heated legs (14) attached to the flexible carrier plate (12) for contacting the leads (52) of an electrical component (50...
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WO/1996/023616A1 |
A device and method for attaching, or for removing, a solder-connected component to, or from, a circuit board. A direct contact heater mounted for movement on upper housing (200) and including laterally sliding housing (300) and a vertic...
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WO/1996/019312A1 |
A method for making bicycle frames from tubes made of a light non-ferrous material by preassembling the various elements and joining them together by braze welding in a salt bath. The basic tubes (1, 2, 3, 4, 5, 6, 7) are mutually arrang...
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WO/1996/014647A1 |
A connecting pin (10) of a coil, on the end section (11) of which is wound an end section (12) of a multi-turn winding, is first given a drop of fluxless soft solder (14) and then arranged near the points of two opposite electrodes (2, 3...
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WO/1996/010467A1 |
There are prior art manual soldering tools (1) consisting of a heat-insulating handle (2), a soldering tip (4) and a heating device (3) generating the soldering temperature. Here, in order to allow single-handed operation, there are acce...
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WO/1996/009121A1 |
Apparatus and methods for making uniformly-sized and predictably-spaced droplets from high-temperature liquids. Liquid droplet generators having electromechanical driving elements (16) are coupled to a power supply (17) to apply pulsed e...
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WO/1996/008336A1 |
A method for manufacturing metallic structures, in particular honeycombed bodies, especially for catalytic converters, from at least partially structured, wound up, intertwined or layered sheet metal layers, comprises the following steps...
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WO/1996/008338A1 |
A process and device are disclosed for applying a bonding material (11) in the form of discrete measures, in particular globules, to a substrate connection surface (12). In the proposed process, the bonding material is taken up by a plac...
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WO/1996/005014A1 |
A soldering tip comprising 50-95 weight percent uncoated copper particles and 5-50 weight percent iron particles is prepared by a method in which the particles are compacted, sintered and shaped into a soldering tip. The soldering tips a...
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WO/1996/002348A1 |
A flat tube brazing method for a laminated heat exchanger, having the steps of laminating a plurality of solder-clad flat tubes (2) via fins (3), inserting both end portions of a flat tube or at least one end portion thereof into a tube ...
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WO/1996/000629A1 |
A thermode solder blade (10) for soldering small components in industrial soldering equipment comprises a shaped body (12) formed from an electrically-insulating and heat-conducting material having an electrically-conductive heating elem...
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WO/1995/030509A1 |
The invention relates to a process for wave-soldering printed circuit boards. In order to obtain wave-soldered printed circuit boards with smallest possible number of solder beads, after the passage on the wave of solder (13), the printe...
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WO/1995/023045A1 |
A circuit board (26) is wave soldered as it is carried by a conveyor (30) through a solder wave (16) established in a solder reservoir. Disposed on both sides of the solder wave are gas plenums (240, 250) which discharge shield gas. Each...
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WO/1995/020456A1 |
A soldering apparatus has a bellows chamber, formed by a bellows (4) and upper and lower closure pieces (6, 8) for containing molten solder (3). As the volume of the bellows chamber (2) is reduced, solder is expelled through a nozzle (52...
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WO/1995/019864A1 |
A cover or shroud extends over a solder reservoir and has a slot for a solder wave to protrude therethrough. Gas is provided to blanket the solder wave and the shroud is positioned to reduce solder from contacting elements that are conve...
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WO/1995/013161A1 |
The invention provides a device for moving an object by means of thermal change in shape or volume, such that the object is moved when a predetermined process temperature has been reached. Preferably the device can be used in a soldering...
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WO/1995/009712A1 |
A gas powered soldering tool (1) comprising a main body member (4) terminating in a soldering tip portion (8) has a combustion chamber (10) located therein. A gas catalytic combustion element (12) is located in the combustion chamber (10...
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WO/1995/008403A1 |
A method and apparatus for depositing solder on the terminal pads (10) of printed circuit boards (12) in which a solder resist layer (16) or layers (16, 17) having a thickness corresponding to the desired solder height border the pads. M...
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WO/1995/002788A1 |
A soldering tool (1) comprising a main housing (2) within which is located a fuel gas reservoir (4). A soldering body member (5) terminates in a rearwardly extending combustion chamber (11) within which is located a gas catalytic combust...
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WO/1995/000279A1 |
A process and device for making metallised contacts in which solder material shaped into a body (18) is conveyed by means of a power transmission device (13) guided in a capillary (12) and acting like a stamp to a contact surface (24) of...
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WO/1995/000280A1 |
A handheld soldering tool has a fuel reservoir (10), a tip (1) heated in use by a catalyst assembly (2), a valve assembly (9) for controlling flow of gaseous fuel from the reservoir (10) to the catalyst assembly (2), and a piezo-electric...
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WO/1994/028580A1 |
A solder ball feeder comprises flux supply means (200) for simultaneously supplying flux to input/output terminals on a substrate (1) before the supply of solder balls, and solder ball supply means (300) for taking out a large number of ...
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WO/1994/021415A1 |
A reflow soldering device for SMD printed circuit boards is provided with an optical arrangement for monitoring melting of the solder. A tunnel furnace can be installed upstream of the soldering device in order to preheat the printed cir...
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WO/1994/020253A1 |
A solder nozzle to produce a smooth turbulent free solder wave has at least one air jet associated therewith to remove solder icicles and bridges that can form on the under surface of circuit boards and other elements. The circuit boards...
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WO/1994/017949A1 |
A cover plate (28) extends over at least part of a solder reservoir (34) and has a slot (30) for a solder wave (22) to extend up above the cover plate (28). Shield gas is supplied under the cover plate (28) to blanket the solder wave (22...
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WO/1994/014563A1 |
A method of carrying out soldering in an atomsphere of a mixed gas of vapor of diketone and/or vapor of carboxylic acid, and an inert gas and/or a reducing gas (exclusive of a mixed gas of vapor of carboxylic acid and an inert gas). A so...
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WO/1994/012311A1 |
The present invention provides a vertical card connector (12) capable of preventing an undesirable flow of melted solder which destroys proper contacts and of removing a corrosion-causing acid gas. The vertical card connector includes an...
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WO/1994/013125A1 |
A process (1) for printing a printed circuit board (4, 4a, 4b) by means of a mask (5) and of a doctor blade (9) has a support (3) for positioning the printed circuit board (4) and a frame (22) for holding the mask (5). The cross section ...
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WO/1994/011144A1 |
The invention relates to an inductor pipe for the high-frequency inductive heating of ferromagnetically coated solder injectors by means of an inductor. In prior art solder injectors, each one had to be fitted with a separate inductor, m...
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WO/1994/006594A1 |
In a process for soldering partial areas (5) of a metallic structure (2, 4), a sticky material is applied on the partial areas (5) and then soldering powder is applied thereon, which adheres to the sticky material. The sticky material re...
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WO/1994/004305A1 |
A dispensing apparatus for applying a thin stream of flux to a surface (14) of a printed circuit board (10). The dispensing head (42) travels (70) at a high rate of speed relative to the board (10) during the dispensing, preferably at a ...
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WO/1993/025339A1 |
A process is disclosed for soldering a metallic honeycombed body consisting of at least partially structured wound, layered or curled sheet metal layers which need to be soldered at least in partial areas. The process includes the follow...
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WO/1993/018882A1 |
The invention relates to a soldering device comprising: a chamber; soldering means for soldering objects for soldering present in the chamber; a transporting device present in the chamber for transporting the objects for soldering; a cle...
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WO/1993/015868A1 |
A prefluxed, flux retaining aluminium-based component is provided comprising a solidified coating layer having flux particles firmly embedded into the coating layer. A method for producing such components comprises steps of applying a mo...
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WO/1993/013904A1 |
The invention relates to a soldering device comprising: a vessel (1) opened at the top for filling with solder; at least two solder towers (5, 6) placed in the vessel, each adapted for delivering a flow (8, 12) of solder on their upper s...
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WO/1993/012908A1 |
The application of solder to the fine structured catalyst supports in a catalytic converter can pose problems. The invention proposes that solder powder of a suitable particle size is first dispersed in a liquid mixture of binder and liq...
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WO/1993/011653A1 |
A cover plate (34) extends over a solder reservoir (10) and has a slot (40) for a solder wave (22) to extend up above the plate, a gas excluding oxygen is supplied under the cover plate (34) and flows up through the slot (40) on both sid...
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WO/1993/008949A1 |
A wave soldering apparatus with a wave height control device. The apparatus includes a solder pan (28), a tray (32) arranged in the pan and provided with at least one wave-forming nozzle, a driving assembly (52) for supplying the solder ...
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WO/1993/009654A1 |
A soldering-part kind table (26) contains beforehand the information on soldering conditions such as the position and the angle of a soldering iron, the amount of solder fed, and heating time, for each soldered part. In a floppy disc of ...
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WO/1992/019416A1 |
A horizontal solder leveller includes: solder spurge bars (21, 22) for providing downwardly and upwardly directed, distributed flow of solder, as a spray (25), through which a board (1) being tinned can pass to displace oil from contact ...
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WO/1992/016330A1 |
Apparatus and method for butt-splicing two metal tapes (14, 17) by confining molten solder (18) between two carbon electrodes (11, 19) while the tape edges (13, 16) are moved together.
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WO/1992/014347A1 |
The description relates to a process for soldering printed circuit boards or sets of components in electronics or metals in engineering work. The heat required for the soldering process is at least partly transmitted to the soldering poi...
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WO/1992/010324A1 |
In a temperature regulator for soldering and unsoldering equipment having a heating device fed by a controllable electric source of heating current, the heating output of which is transmitted to a spot to be soldered by a heating output ...
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WO/1992/010323A1 |
A wave soldering apparatus and process occurs in an atmosphere which substantially excludes oxygen. By providing a gas blanket over the solder, reduction in dross occurs and improved soldering results avoiding the necessity of removing f...
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WO/1992/010078A1 |
A device for soldering provided with a pressing piece (4) to be pressed from above for pressing an electronic component part (3) to a printed board, and with a heating device (5) for heating said pressing piece to or above a melting temp...
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WO/1992/007452A1 |
Recycling of liquids in a liquid cleaning device permits the savings of solvent liquids and avoids throwing out contaminating liquids that can contribute to pollution. A closed loop system is provided for cleaning liquid agent and water ...
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