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JP2023101146A |
To provide a cleaning mechanism that can suppress remaining of a foreign matter on a chuck table.A cleaning mechanism for cleaning a chuck table for holding a workpiece at a holding surface includes: a fluid supply unit capable of being ...
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JP2023101211A |
To provide a technique capable of suitably suppressing the over-rolling of a blade cover.A working machine comprises: a rotary cutter; an output shaft fitted with the rotary cutter; a driving-motor rotationally driving the output shaft; ...
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JP2023100378A |
To provide a processing device including two fluid washing mechanism for washing holding surfaces etc., which is not enlarged and prevents scattering of two fluids.A processing device 1 includes a turn table 59 which has a plurality of c...
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JP2023530636A |
A method of cutting a plurality of slices from a workpiece with a wire saw during a series of cutting operations, the cutting operations being divided into an initial cut and a subsequent cut, the wire saw cutting a movable wire section ...
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JP7308547B2 |
The present disclosure provides an automatic processing apparatus including a main body, a receiving portion, a working assembly, a workpiece magazine, a setting mechanism, a passivation bucket assembly, and a rotation driving assembly. ...
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JP2023097533A |
To provide a polishing device which, even when using a substrate holding device causing the substrate to rotate about its axial center, can effectively discharge cleaning fluid supplied to the surface of the substrate, from the substrate...
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JP7304742B2 |
The present invention provides a technology capable of simplifying maintenance work of a substrate processing apparatus. The substrate processing apparatus includes: a rotating disk on which a tool for processing a substrate is mounted s...
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JP2023095080A |
To provide a method for slicing a silicon ingot, by which the variation in wafer thickness can be reduced, and the worsening of quality of wafers can be prevented.A method for slicing a silicon ingot comprises the step of supplying a coo...
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JP2023092774A |
To enable telescopic motion of a bellows without contacting a rail when moving a suspension type spindle unit in a bellows mechanism.A suspension type bellows mechanism 4 has one end connected to a first spindle unit 61 and the other end...
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JP2023528236A |
The present invention relates to a laboratory disc polisher and in particular a method for flat polishing the underside of an embedded sample, as well as a supplementary polisher for said laboratory disc polisher and a polisher in a labo...
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JP2023092675A |
To provide a method for setting the fullerene content in a processing oil composition and a cutting method using the same that reduce wear of tools and the like while suppressing the decrease in cutting performance.Fullerene content is s...
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JP2023092623A |
To provide a polishing device configured so that an installation cost of a hand shower cleaner and an installation space of a storage box can be reduced.A polishing device comprises: a first polishing module 4A and a second polishing mod...
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JP2023091897A |
To provide a grinding device which can prevent an operator from forgetting execution of self-grinding.A grinding device includes: a control unit which has a processing device and a storage device, and controls a chuck table, a grinding u...
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JP7301473B2 |
A grinding apparatus includes a first chuck table that has a porous holding surface corresponding to a first wafer and holds the first wafer, a second chuck table that has a porous holding surface corresponding to a second wafer differen...
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JP7300943B2 |
To provide a method for detecting a foreign matter on a holding surface, capable of more easily detecting a foreign matter on a holding surface of a holding table.A method for detecting a foreign matter on a holding surface includes: a r...
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JP7300260B2 |
To provide a grinding attachment that enables efficient execution of maintenance work and that efficiently cools a wafer and a grinding stone by discharging grinding water to a fixed place.A grinding attachment comprises: a chuck 11 for ...
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JP2023089533A |
To provide a substrate processing device that can prevent a substrate from warping and further prevent the substrate from being contaminated due to removed chips, when making a processing head press an outer periphery part of the substra...
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JP7299773B2 |
To enable a grinding wheel to be washed in a processing chamber before wheel replacement in a case where the grinding wheel is soiled.A grinding device 1 comprising: means 30 that rotates a grinding wheel 304 to grind a work piece held o...
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JP7299102B2 |
An intermediate raw material according to the present invention includes a charge control agent having a critical packing parameter of 0.6 or more and a dispersing medium and a pH of the intermediate raw material is less than 7.
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JP2023088376A |
To provide a workpiece grinding method by which the air-cut period in which the rotation of a grinding wheel drops at a low speed to be idled, is shortened compared to heretofore.A workpiece grinding method includes: a first movement ste...
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JP2023089266A |
To provide an alternative apparatus and a method for finishing an edge of a glass sheet by combining with a discharged cooling agent.A finishing member is rotatably maintained in a chamber of a shroud. The shroud includes a wall part 52 ...
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JP2023088515A |
To appropriately perform gas-liquid separation even when an amount of mist of cutting waste liquid is increased.A cutting device 1 is such that a cutting mechanism 6 comprises a nozzle 66 for supplying cutting water to a region for cutti...
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JP2023087899A |
To prevent processing chips from adhering to a spindle.When a spindle 44 rotates, a downward spiral air flow is generated in a cylindrical clearance 88 by a spiral groove 90 formed in an outside surface of a second disk part 77 thereof. ...
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JP2023088145A |
To solve such a problem that detection of a region to be imaged by imaging means and to be processed is hindered, by preventing waste liquid scattered during cutting work from dropping onto an upper surface of a wafer from a blade cover ...
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JP2023087959A |
To provide a grinding removal system and grinding removal method that are excellent in dust scattering prevention property and work efficiency property.A grinding removal system 10 for grinding an object 14 and removing dust generated in...
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JP2023086170A |
To efficiently discharge cutting water scattering inside a processing chamber without impairing maintainability.A cutting device includes a cutting unit for cutting a workpiece held by a chuck table, a processing chamber for storing the ...
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JP2023086404A |
To efficiently remove particles adhering to a substrate, a membrane, and a retainer ring after polishing.A substrate cleaning device is provided in a polishing device including a polishing table having a polishing surface for polishing a...
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JP2023085921A |
To provide a cutting device which can adjust its exhaust force to an optimal exhaust force according to conditions in a processing chamber.A cutting device 1 includes: a holding table 10 which holds a workpiece 200; a cutting unit 20 whi...
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JP7295764B2 |
To provide a processing device configured so that an air introduction port of an exhaust box thereof is prevented from getting clogged.A processing device 1, which comprises: processing means 3 that processes a work-piece W while being s...
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JP7295653B2 |
Provided is a chuck table which is provided with a holding surface suctioning and holding a workpiece, wherein even when the holding surface is not cleaned by a cleaning grindstone, the holding surface is maintained in a clean state in w...
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JP7294837B2 |
To provide a processing device that can suppress costs required for cyclic use of processing water.A processing device 1 comprises: a spindle that is mounted with a cutting blade for cutting a work-piece held on a chuck table; a processi...
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JP7293893B2 |
To provide a filter member which inhibits damage and deformation, and to provide a power tool having the filter member.A power tool 1A includes: a motor 6; a motor housing 2 which houses the motor 6; a tail cover 3 fixed to a rear part o...
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JP2023084785A |
To provide a washing method and device of a plate for holding a used wafer substrate which can excellently remove a deposited matter such as natural rubber and colloidal silica that easily remains.A washing device comprises: an ultrasoni...
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JP2023084188A |
To provide an observation device enabling detailed observation of a recess formed in a workpiece.An observation device for observing a workpiece having a recess at a center part and having an annular reinforcement part surrounding the re...
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JP2023084522A |
To provide a technique which can efficiently separate sludge-like fine chips from a coolant and does not use a filter that becomes waste.Chips in a coolant passing through a first tank 202A and a second tank 202B are suctioned to a perma...
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JP2023082868A |
To provide a substrate processing device which enables a control unit to be cooled without exhausting air for cooling the control unit to the outside of the device.A substrate processing device 1 includes: a table 30 which holds a substr...
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JP2023082509A |
To prevent processed waste from adhering to a holding member when a workpiece is processed by using the holding member.A processing method includes: a holding step in which a workpiece 200 supported by a holding member 211 on a frame 210...
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JP2023523939A |
The present invention relates to a method of grinding a semiconductor wafer, the semiconductor wafer being machined for material removal by a grinding tool comprising grinding teeth having a height h, a cooling medium being provided in c...
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JP2023076942A |
To provide a processing device and a processing method, which reduce a use amount of a liquid.A processing device 1 comprises a processing part, a first accumulation part 61, and a first supply part 62. The processing part includes: a ho...
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JP2023076852A |
To provide a processing device capable of simplifying the maintenance work of a cleaning unit and suppressing the occurrence of defective processing.A processing device that processes a workpiece includes a chuck table that holds a workp...
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JP2023077114A |
To provide a grinding device capable of efficiently cleaning a workpiece held on a chuck table and suppressing scattering of cleaning water around.This grinding device for grinding the surface of a workpiece comprises: a grinding unit pr...
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JP2023523348A |
The power tool (10) has a motor (20) and a sensor configured to generate a differential voltage signal (102) indicating that the distance between the individual and the cutting tool (60) is less than a threshold distance. It is configure...
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JP2023076056A |
To provide a mixing device capable of easily producing a mixed fluid at low cost.A mixing device that mixes pure water and carbon dioxide includes a pure water supply source that supplies pure water, a carbon dioxide supply source that s...
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JP2023072862A |
To keep the distance between a surface to be washed and an injection port of a nozzle constant to always properly perform washing in a grinding device having a two-fluid washing mechanism.A grinding device 1 includes a chuck table 30 tha...
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JP2023072880A |
To provide a technology that can suppress adhesion of grinding debris to semiconductor wafers after grinding.A semiconductor manufacturing equipment has a chuck table 2 on which a semiconductor wafer 5 is placed with the grinding surface...
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JP2023521611A |
A grinder/polish machine comprises a sample holder, a platen, an actuator configured to move at least one of the sample holder and the platen, an input device, a machine readable memory, and a controller. The input device includes a plur...
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JP2023072315A |
To prevent degradation of strength of an edge face of a glass plate that accompanies processing in a polishing step in production of a glass plate.A production method of a glass plate includes a grinding step P1 for processing an edge fa...
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JP7280790B2 |
To efficiently irradiate organic substances contained in waste liquid with ultraviolet rays to ionize the organic substances and cause the ionized organic substances to be adsorbed on ion-exchange resin in a waste liquid treatment method...
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JP2023071329A |
To provide a cutting device which can excellently process a hard-to-cut material by using a cutting blade.A cutting device comprises: holding means 3 which holds a workpiece W; cutting means 4 which includes a rotatable cutting blade 45 ...
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JP3241965U |
An object of the present invention is to provide a knife sharpening device with improved convenience. Kind Code: A1 A blade grinding apparatus includes a motor 1 having a rotating shaft 10, a base 40 to which a cylindrical grindstone 2 h...
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