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JP2023042060A |
To provide a processor capable of improving processing accuracy.In a processor 1, a machine body 3 drives at least one of a workpiece 103 and a tool 101 to process the workpiece 103 by the tool 101. A processing chamber 5 separates the w...
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JP7245493B2 |
To provide a polishing pad capable of efficiently performing a polishing work and a polishing device having the polishing pad.A polishing pad 10 is used for polishing an object W to be polished. The polishing pad includes: a base materia...
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JP7245068B2 |
To provide waste liquid treatment equipment taking clean water from waste liquid, the liquid treatment equipment allowing for confirmation whether the clean water is appropriately taken from a water intake.The waste liquid treatment equi...
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JP2023039837A |
To provide a cutting method for a workpiece that is able to remove liquid from an imaging area of a workpiece during kerf checking and able to prevent adhesion of cutting chips to the workpiece.A cutting method includes: a cutting step o...
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JP7244650B2 |
A honing tool (1) is provided with: a grinding part (13); a tool main body (12) comprising a first region (121), a second region (122) with a window portion (122a) through which the grinding part (13) is inserted, and a third region (123...
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JP2023038865A |
To provide a cutting device which can prevent deposition of an end material on a bottom part of a draining tray with a simple structure without increasing costs.A cutting device 1 includes: a holding table which holds a workpiece; an X a...
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JP2023038068A |
To provide a grinding method of a workpiece which can suppress reduction of grinding liquid supplied to a contact interface between a plurality of grinding stones and the workpiece when performing creep field grinding with respect to the...
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JP2023038253A |
To provide a substrate processing apparatus capable of improving a through-put.A substrate processing apparatus comprises: a polishing part that polishes a substrate; a conveying part that conveys the substrate before the polishing to th...
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JP2023037140A |
To provide a technique for smoothly polishing a resin spectacle lens.A method for polishing a spectacle lens 20 includes the steps of: preparing a polishing pad 10 having a flocked polishing sheet having a flocked part and abrasive grain...
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JP2023037400A |
To prevent a binary fluid from scattering on a holding surface in a processing device having a function for jetting the binary fluid from a nozzle to clean the holding surface of a porous member.A processing device includes: a chuck tabl...
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JP2023037186A |
To suppress uneven wear and falling of brush bundles in segment brushes mounted on a rotary member.A rotary brush device includes a rotary member rotated in a state in which the rotary member is mounted with a plurality of segment brushe...
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JP2023036290A |
To reduce consumptions of grinding water, while appropriately performing cooling of frictional heat and washing-out of ground chips using the grinding water, in creep-feed grinding.A grinding device, which applies creep-feed grinding to ...
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JP7237275B1 |
[PROBLEMS] To provide an electric cutting machine with a dustproof cover in which a disk grinder and a dustproof cover are firmly connected. A disk grinder 3 having a spindle 1 rotationally driven by a built-in electric motor and a cylin...
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JP2023035431A |
To prevent dust from adhering to a suction disk of a holding mechanism arranged in a processing device, which suctions and holds a plate-like work-piece.A holding mechanism 24, which comprises a suction disk 245 having a suction port 240...
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JP2023034440A |
To provide a grinding device that can reduce consumptions of grinding fluid while suppressing poor processing from occurring.A grinding device, which grinds a work-piece, comprises: a chuck table having a holding surface for holding the ...
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JP7236361B2 |
To provide a grindstone cover device for an internal grinding machine that can prevent the grindstone from scattering due to breakage during setup change.A grindstone cover device 9 comprises: a spindle stock 2 that supports a spindle 3 ...
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JP2023031921A |
To provide a grinding device capable of reducing the consumption of a grounding liquid while suppressing the occurrence of a processing failure.A grinding device for grinding a workpiece includes a chuck table having a holding surface fo...
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JP2023031920A |
To easily and safely discharge residual water remaining in a cooling water passage without removing a pipeline of the cooking water passage.A processing device with a holding table, a processing unit and a movement mechanism, includes: a...
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JP2023030756A |
To provide a polishing device which can accurately measure a surface temperature of a substrate in a non-contact manner during polishing of the substrate.A polishing device includes: multiple window members 50A to 50E which are embedded ...
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JP7235454B2 |
To provide a technique by which a position of a cover end with respect to a housing can be held at each of plural positions.A grinder 4 comprises: a prime mover; a, power transmission device which is connected to the prime mover; a housi...
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JP2023028219A |
To provide a new cover member that can be replaced with a bellows-shape cover member in order to prevent processed wastes pinched resulting from expansion/retraction motion from breaking the bellows-shape cover member or the like.A proce...
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JP2023028133A |
To provide a processing device that can suppress cleaning of the inside of a processing chamber.A processing device 1 comprises: a chuck table 10 that holds a work-piece 200; a processing unit 20 that has a spindle 21 on which a polishin...
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JP2023027918A |
To suppress erroneous measurement of the thickness of a wafer.In a grinding apparatus 1 including a chuck table 2 for holding a wafer 8 on a holding surface 200, a grinding mechanism 3 for grinding the wafer 8 held on the holding surface...
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JP7232390B2 |
To provide a method for producing an R-T-B-based sintered magnet without requiring preparation of an inert atmosphere.There is provided a method for producing an R-T-B-based sintered magnet which comprises: a pulverization step S10 of pr...
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JP2023028360A |
To remove machining chips adhering to a holding surface of a chuck table and perform washing so that the machining chips do not adhere to the holding surface, without grinding the holding surface, in washing the holding surface.A grindin...
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JP7232136B2 |
To prevent a telescopic cover from accidentally stretching during wheel replacement work in a grinding device.A processing device 1 comprises a telescopic cover 4 which is connected onto a case 2 surrounding a table, surrounds a processi...
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JP2023026126A |
To propose a novel technique for preventing particles from sticking to a surface of a workpiece.A workpiece processing method uses a cutting device that comprises a holding table 20 for holding a workpiece, and a cutting unit 5 having a ...
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JP7228750B2 |
A disc changing system for a robotic defect repair system is presented. The system has a first abrasive disc and a second abrasive disc. The first and second abrasive discs are coupled to a liner. The system includes an abrasive disc pla...
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JP7227754B2 |
To prevent ground chips from adhering to an innermost segment grindstone when grinding a work-piece using a grinding wheel in which positions of segment grindstones are changed in a radial direction.A grinding device 1 comprises: a wheel...
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JP7223922B2 |
To provide an elastic buff annular body (elastic buff) which makes a rubber base material, a special fiber base material and a special leather base material to be polished of an elastic base material and is composed of the elastic base m...
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JP7224244B2 |
To provide a flange mechanism configured so that suction of a foreign matter and the like into a space between a cutting blade and a flange part can be suppressed more than before.A flange mechanism 1 is configured so that a first suppor...
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JP2023023042A |
To adjust liquid to a prescribed temperature by a small-sized configuration which is simple and at operation cost.A constant temperature liquid supply device for supplying liquid with an adjusted temperature to a processing device provid...
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JP2023023578A |
To provide a cutting device which can efficiently clean a light emitting part and a light receiving part while inhibiting adhesion of sawdust to the light emitting part and the light receiving part.A cutting device includes a cutting bla...
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JP2023023057A |
To provide a processing apparatus and a method for manufacturing a processed product, which simplifies a configuration and prevents scattering of working liquid while reducing footprint.A processing apparatus includes processing tables 2...
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JP2023022522A |
To provide a processing device configured so as to prevent processing water from leaking and enable loads acting on processing/feeding means to reduce.A processing device includes holding means 4 that holds a work-piece, processing means...
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JP2023022523A |
To provide a cutting device that can properly cool a cutting blade and a work-piece, while removing powder dust scattering from a cut site.In a cutting device that cuts a wafer W, cutting means 4 comprises: a rotating shaft 44; a cutting...
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JP2023505781A |
A cleaning apparatus for vacuum pedestals and a method for cleaning pedestals used in semiconductor device fabrication are described. The device has a baseplate, a collar attached to the baseplate, a cap disposed on the collar, and a sha...
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JP2023021191A |
To provide a novel technique for setting cleaning conditions in a workpiece cleaning mechanism.There is provided a cleaning mechanism including: a holding table having a holding surface to hold a workpiece; a cleaning nozzle facing the h...
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JP2023021282A |
To provide a compact grinding machine which is suitable for robot-supported grinding, and enables comparatively accurate control of processing force during grinding.A grinding machine has: a housing; a motor arranged inside the housing; ...
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JP2023019355A |
To provide a processing device which can suppress fluctuation of a supply amount of a working fluid.A processing device processes a workpiece, and includes a holding table for holding the workpiece, processing units 20A, 20B which proces...
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JP2023018318A |
To prevent leakage of mist-like grinding water from a processing chamber without using a bellows cover.A processing device includes: a chuck table having a holding surface which suctions and holds a workpiece; a processing unit which has...
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JP2023018559A |
To provide a cutting device which can inhibit occurrence of dew condensation while enabling supply of a low temperature cutting fluid.A cutting device 1 includes: a holding table which holds a workpiece; a spindle to which a cutting blad...
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JP7218731B2 |
The present invention provides a cleaning device for a device which comprises rotatable upper and lower surface plates and a slurry feeding nozzle and which laps a sandwiched workpiece by rotating the upper and lower surface plates while...
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JP2023016165A |
To provide an electric tool having a new structure in which a power distribution to a motor is permitted only in a state where two kinds of accessories are attached thereto, which is improved in degree of freedom of design of the electri...
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JP7216601B2 |
To continuously measure a thickness of a wafer during polishing working.Pressure of a center portion of a first pipe 62 becomes negative with jetting of air (shown by an arrow A) through an annular air jetting port 66. This causes air to...
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JP2023015782A |
To maintain a high processing quality while suppressing movement of processing waste toward a back surface of a substrate.A processing device includes: a holding table 10 having a holding surface 11 for holding a back-surface side of a s...
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JP2023015609A |
To prevent both chipping of a chip and adhesion of cutting waste to the chip.After a second cutting step, a washing step of washing the upper surface of a wafer 100 and a second cutting groove is performed. Thus, it is possible to preven...
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JP2023014896A |
To wash an upper surface of a support plate around a holding table by utilizing cooling water.A holding table 6 includes: a holding portion 610 for holding a workpiece; a frame body 620 having a recessed portion 621 for accommodating the...
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JP2023013913A |
To provide a hook bolt polishing device which can polish a hook bolt in a more proper manner and inhibit scattering of powder dust occurring during polishing.A polishing device 10 includes a cylindrical rotating body 11 and a cover. The ...
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JP2023013331A |
To provide a slate-based tile polishing device which can polish a slate-based tile more properly and yet inhibit scattering of powder dust occurring during polishing.A polishing device includes: a rotary brush which polishes a surface la...
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