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JP2023072862A |
To keep the distance between a surface to be washed and an injection port of a nozzle constant to always properly perform washing in a grinding device having a two-fluid washing mechanism.A grinding device 1 includes a chuck table 30 tha...
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JP2023072880A |
To provide a technology that can suppress adhesion of grinding debris to semiconductor wafers after grinding.A semiconductor manufacturing equipment has a chuck table 2 on which a semiconductor wafer 5 is placed with the grinding surface...
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JP2023521611A |
A grinder/polish machine comprises a sample holder, a platen, an actuator configured to move at least one of the sample holder and the platen, an input device, a machine readable memory, and a controller. The input device includes a plur...
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JP2023072315A |
To prevent degradation of strength of an edge face of a glass plate that accompanies processing in a polishing step in production of a glass plate.A production method of a glass plate includes a grinding step P1 for processing an edge fa...
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JP7280790B2 |
To efficiently irradiate organic substances contained in waste liquid with ultraviolet rays to ionize the organic substances and cause the ionized organic substances to be adsorbed on ion-exchange resin in a waste liquid treatment method...
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JP2023071329A |
To provide a cutting device which can excellently process a hard-to-cut material by using a cutting blade.A cutting device comprises: holding means 3 which holds a workpiece W; cutting means 4 which includes a rotatable cutting blade 45 ...
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JP3241965U |
An object of the present invention is to provide a knife sharpening device with improved convenience. Kind Code: A1 A blade grinding apparatus includes a motor 1 having a rotating shaft 10, a base 40 to which a cylindrical grindstone 2 h...
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JP2023068687A |
To provide a control device and a machine tool that automatically execute washing processing according to an operation state of a pump.A control device comprises: a sensor which is applied to a pump for pressure-feeding liquid in differe...
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JP2023069861A |
To provide a grinding device which can suppress decrease of a grinding liquid supplied to a contact interface between a plurality of grindstones and a work-piece when performing creep feed grinding for the work-piece, and a work-piece gr...
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JP7275288B2 |
An apparatus for the robot-assisted machining of surfaces is described. In accordance with one embodiment, the device comprises the following: a support which can be mounted on a manipulator, a machining device with a tool (e.g. a grindi...
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JP7275119B2 |
The invention relates to an extraction device for a robot-assisted machine tool for surface processing. According to an exemplary embodiment, the extraction device comprises a housing with a vacuum nozzle and an outlet for connection of ...
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JP2023066697A |
To provide a processing device that makes it easy to take out or carry in a processing tool through a processing chamber opening.There is provided a processing device 1 in which a grinding wheel 204 is installed at the tip of a spindle 2...
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JP7274278B2 |
To provide a work-piece processing system provided with an exchanger that performs exchange of a processing tool, a nozzle and a work-piece, between a processing machine and a stocker.The work-piece processing system is provided with: a ...
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JP7273610B2 |
To prevent, in a spindle unit, processing water (processing waste liquid) containing processed waste from entering a space between a spindle and a housing.A spindle unit 62 comprises: a spindle 621 on one-end side of which a mount 65 for...
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JP7273535B2 |
A sludge drying apparatus includes a waste fluid bath for storing a waste fluid containing a sludge, an extracting unit for extracting the sludge from the waste fluid stored in the waste fluid bath, a transfer belt for transferring the s...
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JP2023065445A |
To provide a disk change system for a robot defect repair system.A system has a first abrasive disc and a second abrasive disc, and includes an abrasive disc placement device configured to: automatically remove the first abrasive disc fr...
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JP2023063928A |
To provide a processing tool, a groove processing device, an elevator system and a groove processing method which can suppress the occurrence of clogging.A groove processing method according to the present disclosure comprises: an attach...
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JP7270373B2 |
A grinding apparatus and a grinding method of a composite substrate including resin, by which loading of a grinding wheel can be suppressed in grinding of a large-sized composite substrate including resin, and with which grinding can be ...
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JP2023063801A |
To keep power consumption and water consumption of factory equipment low when using a processing water regenerator.There is provided a processing water regenerator 8, including: a waste liquid treatment device 1 for treating waste liquid...
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JP2023062553A |
To provide a technique that can reduce burdens on a user who uses a processing apparatus.An exchange apparatus exchanges a holding part that is used in a processing apparatus. The processing apparatus comprises: the holding part that hol...
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JP2023518650A |
The chemical mechanical polishing system includes a steam generator having a heating element that applies heat to a container to generate steam, an opening that delivers the steam onto the polishing pad, a first valve in a fluid line bet...
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JP2023060481A |
To provide a grinding device that can prevent a large difference from occurring between a thickness of a central part and a thickness of an outer edge part of a work-piece after grinding.A grinding device, which grinds a plate-like work-...
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JP7266369B2 |
To provide CMP device and method by which CMP polishing is performed for a wide variety of wafers.A polishing head 10 of a CMP device 1 comprises: a porous chuck 31 which is opposite to a top face of a wafer W; a vacuum source which supp...
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JP2023517313A |
Embodiments herein relate to chemical impregnation applicators and related application methods that can be used to provide hydrophobic surfaces to CMP system components. In one embodiment, a method of forming a hydrophobic coating on a s...
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JP2023057601A |
To provide a machine tool capable of acquiring information of a position which serves as a reference when a workpiece and a tool are relatively moved.A Z-axis motor 39 in a machine tool 1 moves a main spindle 37 in a Z direction. A Z-axi...
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JP2023517191A |
The present invention provides a polishing pad 40 of a sander 15, having a drive holder 49 located on the machine side 41 of the polishing pad, the polishing pad 40 being suitable for polishing a workpiece W, particularly in a rotary pol...
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JP2023516873A |
A chemical-mechanical polishing system includes a platen for supporting a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly includes an arm extending across the platen and a nozzle suspended b...
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JP2023057458A |
To suppress falling of a substrate from a hand when the substrate is received from a top ring and to position the substrate in a prescribed seating region.The hand for holding a substrate comprises: a hand body 620; a plurality of seatin...
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JP2023516871A |
The chemical mechanical polishing system includes a polishing port for supplying polishing fluid onto the polishing pad, a fluid flow controller for controlling the flow rate of the polishing fluid to the port, a temperature control syst...
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JP7262152B1 |
A grinder capable of efficiently and sufficiently applying coolant to a grindstone is provided. A polishing machine (1) is used for polishing a workpiece (W), and a supply nozzle (41) for supplying a coolant (CL) to a grindstone (23) and...
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JP2023057456A |
To more stably absorb compressing load applied from a top ring.A hand for holding a substrate includes a hand main body 620 and a plurality of seating members 630 which are mounted to the hand main body 620, and on which the substrate is...
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JP2023057047A |
To surely suck a substrate regardless of flatness of a sucked surface of a substrate.A substrate suction member 330 includes: a porous member 334 having a substrate suction surface 334a for sucking a substrate WF and a decompression part...
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JP7260322B2 |
To provide a polishing device which can prevent splash of a liquid including grinding sludge to a substrate to prevent contamination of the substrate, and to provide a polishing method.A polishing device includes: a holding stage 4 which...
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JP2023055160A |
To provide a cooling device of a diamond dresser which can suppress heat degradation and abrasion of a longitudinal diamond without reducing holding force of the longitudinal diamond.A cooling device of a diamond dresser comprises: a dre...
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JP2023055115A |
To effectively prevent short circuit by imparting high sealability to an electrical connection part between a controller and a switch.A grinder 1 comprises in a rear cover 4: a motor 6; a controller 9 which has a circuit board 86 and a c...
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JP7258440B2 |
To provide a processing waste liquid treatment apparatus which can reproduce an ion exchange resin without stopping operation of a processing device.A processing waste liquid treatment apparatus that treats a processing waste liquid disc...
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JP2023054962A |
To prevent a hand of a worker from being caught when closing a shutter provided in an opening of an external cover.A processing device comprises: a chuck table which can hold a workpiece; a processing unit which processes the workpiece h...
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JP7256644B2 |
A waste fluid treatment apparatus removing processing debris from a processing waste fluid discharged from a processing apparatus. The waste fluid treatment apparatus includes a fluid bath storing the processing waste fluid, an inflow po...
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JP7256605B2 |
To provide a grinding holder, a grinding tool and a grinding device continuously supplying grinding liquid to a grinding area without interruption and without needing a large-scale composition change in a flow channel of the grinding liq...
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JP7254136B2 |
Disclosed are an air circulation system and a final polishing apparatus including the same. The air circulation system improves the degree of contamination in a final polishing apparatus including a housing formed to accommodate a load u...
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JP2023047458A |
To supply grinding water only to an area where an abrasive wheel contacts with a workpiece to save water in creep feed grinding.A grinding device includes a grind water supply mechanism 7 having: multiple jet nozzles 75 which jet grindin...
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JP2023047614A |
To fill a grinding wheel with grinding water, and to thereby improve cooling effect of the grinding wheel, by suppressing consumption of the grinding water, in a grinding device for creep feed grinding.An external supply part 7 of a grin...
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JP2023047326A |
To provide a receptacle for a rotating tool.The invention relates to a receptacle. The receptacle includes a rotationally symmetrical, hollow cylindrical receptacle main body. A through-pipe, which is braced in particular in relation to ...
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JP2023047325A |
To provide a grinding disc receptacle.The invention relates to a grinding disc receptacle. The grinding disc receptacle has a rotationally symmetrical, hollow cylindrical receptacle main body. A through-pipe, which is braced in particula...
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JP2023046629A |
To increase a removal ratio of dust associated with polishing.Dust generated in a rear surface of a substrate due to polishing by a polishing tool 96 is pushed even to an outer peripheral side of the polishing tool 96 due to a centrifuga...
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JP7250716B2 |
The invention refers to a hand-held and hand-guided random orbital polishing or sanding power tool (1). The tool (1) comprises a static body (31), a motor (15), an eccentric element (17) driven by the motor (15) and performing a rotation...
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JP2023045378A |
To provide a slate polishing device capable of polishing a front layer of a wavy slate more accurately and also capable of suppressing scattering of dust generated in polishing.A polishing device includes: a brush member 22 that vertical...
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JP2023044257A |
To reduce a degree of transmission of heat from a motor to an inclination adjustment mechanism and a chuck table and reduce a used amount of processing water.A processing device includes: a holding unit which holds a workpiece; and a pro...
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JP7249063B2 |
The present invention provides a filtering apparatus for lens polishing wastewater and a system for reducing polishing wastewater, which efficiently remove fine particles such as lens particles and fine lens particles that are mixed into...
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JP2023043253A |
To efficiently clean a rod-like substrate at low cost.A rod-like substrate cleaning device 8 for cleaning a rod-like substrate comprises: a cleaning tank 146 that has, at an upper end thereof, an opening larger than a planar shape of a s...
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