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JP7341611B2 |
To provide a waste liquid disposal apparatus that can reduce amounts of impurities included in waste liquid.A waste liquid disposal apparatus, which disposes waste liquid including silicone, comprises: a waste liquid disposal tank compri...
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JP7340911B2 |
A package substrate processing method for processing a package substrate having a division line, an electrode being formed on the division line includes a cutting step of cutting the package substrate along the division line by using a c...
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JP7340731B1 |
A filter capable of extending the replacement cycle of the water-soluble cutting fluid by improving the stickiness of the water-soluble cutting fluid and recovering the performance, and realizing a reduction in size and cost. A filter fo...
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JP7339824B2 |
To improve working efficiency of an operator when adjusting a flow rate of fluid supplied to a supply part from a fluid supply source in a processing device.There is provided a processing device 1, including: fluid supply means 7 which h...
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JP2023124321A |
To provide a tire polishing device that can achieve a target polishing level with high accuracy.A tire polishing device 10 as one example of embodiments comprises a driving unit 15 that rotates a tire 1, and a polishing unit 20 that poli...
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JP7339860B2 |
To bring a robotic hand adsorption face into a state where no dust is deposited, before holding a processed workpiece in a processing device.The present invention relates to a processing device 1 comprising: a robot 8 in which a robotic ...
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JP2023124308A |
To provide a tire polishing device than can measure polishing amounts of a tire accurately.A tire polishing device 10 as one example of embodiments comprises a driving device 15 that rotates a tire 1, a polishing device 20 that polishes ...
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JP7339822B2 |
To provide new structure for a water supply hose of a power cutter.A power cutter comprises: a disc blade; a main body that supports the disc blade rotatably and has a motor rotationally driving the disc blade; a blade cover assembled to...
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JP2023124594A |
To provide a flange of a new structure and a cutting method for making it possible to shorten a time for washing that is carried out to remove cutting chips and burrs.Recessed spaces 57A, 54A are formed along a circumferential direction ...
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JP2023124113A |
To provide a cleaning fixture for effectively cleaning a chuck table with high strength in a short time and a low cost and a cleaning method.A cleaning fixture 1 for cleaning a chuck table 2 containing: a porous member 4 of which an uppe...
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JP7339049B2 |
A waste liquid treating apparatus includes a waste liquid accommodating unit for waste water discharged from a processing apparatus. A waste liquid filter unit filters the waste liquid in that tank to purify the waste liquid into fresh w...
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JP7338515B2 |
In an automatic wet sanding apparatus including a disc and a cushion pad, a disc center hole is formed at a central portion of the disc and a pad center hole is formed at a central portion of the cushion pad. Water having been supplied t...
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JP7339033B2 |
To provide an installation method for a processing-liquid waste treatment apparatus, by which a suitable number of processing-liquid waste treatment apparatuses are installed to prevent diseconomy.An installation method for a processing-...
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JP7338516B2 |
To change the direction of water flowing toward a painted surface so as to flow toward the center side of a hood, a water deflecting member is provided that extends toward the center side of the hood while extending toward the painted su...
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JP7337442B2 |
To provide a circulation system of a working liquid which can reduce loads on an environment and is also excellent in economical efficiency.A circulation system of a working liquid that recovers a working liquid after having been used in...
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JP2023537561A |
A method for cutting a plurality of slices from a work piece by a wire saw during a series of cutting operations divided into an initial cut and subsequent cuts, the wire saw having a wire array and a drive of a movable wire section of t...
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JP7336954B2 |
To provide a processing device configured so that a blade cover can be cleaned.A processing device 1 comprises a first cutting unit 20-1, a second cutting unit 20-2, a first cleaning part 30-1, and a second cleaning part 30-2. The first ...
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JP2023122309A |
To enable a processing machine to perform a process with high accuracy regardless of a difference in outside air temperature.A transition of outside air temperatures at days when a processing machine 10 is operated is estimated on the ba...
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JP2023121052A |
To efficiently regenerate and utilize a used coolant liquid by using an electrolytic treatment device.A circulation type electrolysis coolant liquid generation system comprises: a coolant liquid tank which stores a used coolant liquid; a...
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JP2023119795A |
To uniformly hold an in-plane thickness of a wafer after processing without grinding a holding surface when processing dust attached to the holding surface is removed.A processing device 1 includes: a chuck table 10; a processing mechani...
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JP2023119084A |
To provide a protective cover that can be prevented from dropping out from a housing.A protective cover 50, which is used while being mounted on a grinder main body 10 which is provided with a driving part 20 having a rotary shaft 22 for...
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JP7333749B2 |
An object of the present invention is to provide a method of measuring a suction force that can easily measure the suction force in an exhaust duct by a suction source on an equipment side. The method of measuring the suction force is in...
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JP7332136B2 |
To provide a nozzle and a nozzle module which mix gas such as air into a fluid to be supplied and outputted, and discharge or inject it from a discharge port with a simple structure.A nozzle has an inflow port into which a fluid is suppl...
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JP2023116542A |
To properly cut a wafer.A crack advancing device for advancing a crack from a laser-modified region formed within a wafer comprises crack advancing means for advancing the crack by providing a water supply interruption state midway throu...
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JP7330086B2 |
To provide a processing method capable of reducing an influence from heat generation due to re-utilization in a shorter time than a conventional one.A processing method includes an idling step and a cutting step. The idling step is a ste...
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JP2023115592A |
To provide a grinding device 1 which realizes rotation of an abrasive wheel 33 with a configuration that does not correspond to a fire instrument and can perform grinding processing.A grinding device 1 comprises: a frame 10 which can be ...
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JP2023115106A |
To provide a grinding device capable of efficiently carrying out maintenance work and discharging grinding water to a fixed place to efficiently cool a wafer and a grindstone.A grinding device 1 comprises: a chuck 11 that absorbs and hol...
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JP7328932B2 |
The invention relates to a centerless cylindrical grinding machine (100) for throughfeed and plunge grinding of arbitrary workpieces comprising a first drivable positioning axis XS for a grinding headstock (10) with a grinding wheel (11)...
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JP7328507B2 |
To suppress the residue of scraps on a jig that supports a workpiece.A manufacturing method of a semiconductor device includes a step (A) of preparing a composite substrate having a device area including a plurality of unit structures an...
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JP2023114076A |
To provide a method for processing a workpiece that can provide high flatness of a surface to be polished while efficiently processing a workpiece.A method for processing a workpiece which is applied when processing a plate-like workpiec...
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JP7327217B2 |
An automatic wet sanding apparatus is equipped with a suction unit having a suction nozzle that is located under an automatic wet sanding unit in a state where automatic wet sanding is performed and a suction device that generates a suct...
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JP2023113093A |
To provide a grinder in which a grinding wheel with a grindstone on its lower surface side can be safely attached to and detached from a discoid spindle flange.A grinder 10 for processing a wafer W includes: a grinding wheel 22 provided ...
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JP7323341B2 |
To urge an operator to execute an origin position recognition operation.In a griding device, when an origin position recognition operation is to be executed, an origin position recognition operation start button 51 is made conspicuous by...
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JP2023534119A |
A method for cutting a plurality of slices from a work piece by a wire saw during a series of cutting operations divided into an initial cut and subsequent cuts, the wire saw having a wire array and a drive of a movable wire section of t...
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JP7323342B2 |
To make dirt less likely to adhere to a holding surface of transporting means of a robot etc.If a robot 155 is located in a stand-by position, a holding surface 156 of the robot 155 is oriented in parallel with airflow S1 of a cleaned ga...
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JP2023108668A |
To provide a grinding device that can effectively utilize grinding wheel accompanying air stream, in generating electric power.A grinding device 1 grinds a work-piece 8, by rotating a grinding wheel 31 with respect to the work-piece 8. T...
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JP7320358B2 |
To provide a processing device of cleaning a work-piece underside by cleaning means which is reduced in space and is not unusable due to dirty of a sponge in the cleaning means.A processing device comprises means 16 of holding a work-pic...
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JP2023106877A |
To provide a plate-like object support device which can suppress positional deviation of a plate-like object.A plate-like object support device 80 includes a support unit 81 for supporting a plate-like object, and a destaticizing unit fo...
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JP7319912B2 |
The utility model provides a cover accessory and an electric tool. The cover attachment is used for being detachably installed on an electric tool. The electric tool is provided with a top end tool and a cover, wherein the top end tool i...
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JP2023532659A |
In a chemical mechanical polishing system, a platen shield cleaning assembly is mounted above the rotatable platen in a gap between the rotatable platen and the platen shield. The assembly includes a sponge holder attached to the platen ...
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JP2023104215A |
To provide a grinding device, which is configured so that ground chips are ejected from a holding surface and porous members constituting the holding surface, without being enlarged in size.Ground chips intruding from a holding surface 2...
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JP2023104443A |
To provide a gas-liquid separation device that can surely separate exhaust air exhausted from a processing device or the like into gas and liquid.A gas-liquid separation device, which separates exhaust air into gas and liquid, includes: ...
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JP7316785B2 |
The present invention relates to a method of cleaning an optical film-thickness measuring system used for measuring a film thickness of a substrate, such as a wafer, while polishing the substrate. The method includes: cleaning an optical...
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JP2023532464A |
The polishing assembly includes a rotatable platen for supporting the polishing pad, an open bottom enclosure, and one or more plates for supplying polishing and cleaning fluids downwardly onto the polishing pad through an interior space...
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JP2023102926A |
To restore a wafer ID in a grinding apparatus without inviting an increase in the size of the apparatus.A grinding apparatus 1 includes an ID formation unit 110 which executes reading and restoration processing of a wafer ID. The grindin...
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JP2023102458A |
To prevent an adhesion of dust adhered to a spinner table to a wafer.A processing device comprises: a spinner cleaning unit 80 of cleaning a wafer held by a spinner table 81; a robot that conveys the wafer to a cassette by approaching a ...
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JP2023101881A |
To provide a cutting device capable of suppressing worsening of responsiveness and the occurrence of overshooting in flow rate control of process water, and a method for manufacturing a cut product.The cutting device receives process wat...
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JP2023101963A |
To perform washing by keeping a distance between a washing surface of an object to be washed and a nozzle constant in a washing device.A washing device 1 includes: a table 28 which holds an object 90 to be washed on a holding surface 282...
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JP2023101596A |
To provide a cleaning method capable of removing abrasive grains stuck to a light passage in a polishing table.This cleaning method guides light through a light passage 50A provided in a polishing table 3 to a substrate W during polishin...
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JP7312058B2 |
To measure fine water pressure distribution around a processing point.A measurement jig 8 comprises: a lower table 80 having a mounting surface 80b mounted on a base 22; a side part 81 erecting from an upper surface 80a of the lower tabl...
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