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WO/1986/004855A1 |
Displaceable protective cover for handtools using rotary, disc-shaped tools. The protective cover comprises two halves (7, 8) which completely enclose the tool (3) when in their rest position. The cover-halves (7, 8) can be rotated to an...
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WO/1986/001461A1 |
An abrasive surfacing machine (11) having a surfacing head which utilizes a large disk (81) with a fibrous web abrasive medium (85). The disk is sized to be at least as large in diameter as the width of the underlying workpiece conveyor ...
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WO/1985/001004A1 |
A housing (10) for a vacuum sanding device consists of a ring or plate spaced above a backup pad to define a chamber, the periphery of the housing is spaced slightly above the backup pad for the whole periphery of the housing and the out...
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WO/1984/003467A1 |
The device comprises a carrier frame (1, 2) secured to the vehicle in place of the braking means. The carrier frame (1, 2) comprises two supports (5) which are displaceable individually and perpendicularly to the disc (13) to be reworked...
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WO/1981/002130A1 |
An adjustable guard for splintering machine tools, preferably for lathes and circular grinders, the said guard comprising a transparent shield (6) and moving along guide bars (1) parallel to the lathe spindle. The object of the invention...
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WO/1979/000192A1 |
A method and an arrangement for cleaning cutting fluid used for metal machining. The cutting fluid is withdrawn from the collecting tank (1) at a metal cutting machine by means of vacuum and conveyed to a central cleaning plant by way of...
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JP2024059509A |
【課題】帯状濾材上からスラッジを容易に掻
き取ることができ、濾過効率を維持すること
ができる無端環状の帯状濾材を用いたドラム
型濾過装置を提供する。【解決手段】ス...
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JP2024059510A |
【課題】無端環状のメッシュベルトおよび無
端環状の帯状濾材の内周側のスペースを増加
させることなく、濾過効率が得られる無端環
状の帯状濾材を用いたドラム型濾過装置...
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JP7475464B2 |
Wafers are sliced from a workpiece using a wire saw during slicing operations. The wire saw has a wire web of sawing wire and a setting device. The wire web is stretched in a plane between wire guide rollers that are mounted between fixe...
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JP2024058243A |
An object of the present invention is to discharge air remaining in a cooling channel without destabilizing the pressure of cooling water flowing in the cooling channel. [Solution] An air bleed mechanism that can eliminate air in a cooli...
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JP7473401B2 |
A processing water supply system for supplying processing water to a processing apparatus includes a first heat exchanger that cools the processing water by heat of vaporization of a cooling medium, a second heat exchanger that cools the...
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JP2024517999A |
A method consisting of planarizing the substrate with a functionalized chemical planarizing pad. Functionalized chemical planarization pads include multiple functional groups bonded to the material of the pad. The functional group is con...
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JP2024055281A |
An object of the present invention is to provide a wet grinding device that can perform uniform grinding work with good workability. [Solution] A housing main body part 10 incorporating an air motor 2, a disc-shaped cover 9 fixed to one ...
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JP2024055748A |
The present invention provides a grinding machine that can smoothly discharge coolant after use to the outside of the grinding machine. A column 20 rotatably supports a threaded grindstone 11 and is installed on a machine stand 13 via a ...
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JP7469921B2 |
To provide a chuck device that can suppress a wafer from being damaged, by suppressing machining chips from accumulating in a chuck, and a machining system.A chuck table 3 comprises: a first porous chuck 31; a second porous chuck 32 prov...
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JP2024054227A |
A power tool arrangement including a filter arrangement for filtering dust-laden air and a hand-operated power tool and its filter arrangement. The present invention relates to a filter arrangement for filtering dust-laden air (7) genera...
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JP2024053988A |
The present invention suppresses the generation of noise caused by pressure fluctuations around the tongue in a sander having a scroll portion. [Solution] The sander includes a motor, a polishing part, a shaft extending in the axial dire...
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JP2024053779A |
The present invention provides a ceria regeneration method that allows ceria to be regenerated from a CMP process waste liquid containing multiple types of abrasives in a simple process. [Solution] The ceria regeneration method includes ...
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JP2024053985A |
An object of the present invention is to provide a cutting device that can facilitate quality control and reduce cutting defects by recording the position of a cutting water injection nozzle in the cutting device and quickly detecting de...
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JP2024053989A |
An object of the present invention is to suppress deterioration of the working environment due to dust generated during polishing work being scattered from the sander to the outside. [Solution] The sander includes a motor, an output shaf...
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JP7466995B2 |
An objective of the present invention is to provide a cutting apparatus capable of suppressing the formation of fog caused by the scattering of cutting water. To achieve the objective, the cutting apparatus includes: a holding means hold...
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JP7467653B2 |
This grinding apparatus comprises a plurality of chucks, a tool driving unit, a table, and a table cover. The chuck holds a substrate. The tool driving unit drives a grinding tool being abutted on the substrate. The table holds the plura...
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JP7467611B2 |
A processing apparatus includes a holder configured to hold a processing target object; a processing mechanism to which a processing tool configured to process the processing target object held by the holder is installed in a replaceable...
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JP7467031B2 |
A wheel cover including a first cover attachable to a body of a power tool and a second cover removably attachable to the first cover reduces rattling of the second cover. The wheel cover includes a first cover attachable to a body of th...
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JP7467188B2 |
According to one embodiment, a polishing method includes supplying a polishing agent to be between a polishing pad and to-be-polished surface, then polishing the to-be-polished surface with the polishing agent while rotating at least one...
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JP7465986B2 |
This processing device for processing a substrate comprises: a polishing mechanism which is provided with an annular grindstone for processing a substrate held by a holding mechanism; a polishing solution supply mechanism which supplies ...
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JP7466006B2 |
Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. During each c...
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JP7465579B2 |
The present invention relates to a tool-cooling mechanism, which includes a grinding tool. The grinding tool is provided with a converging disc, and the converging disc rotates with the grinding tool to draw external cooling water into t...
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JP2024050022A |
[Object] It is possible to suppress adhesion of cutting debris to a workpiece. A cutting device 1 includes a holding table that holds a workpiece 200, a cutting unit 20 that has a spindle 23 to which a cutting blade 21 that cuts the work...
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JP7464327B2 |
A nano-layer (41) lubricated diamond grinding wheel (20) grinding device based on a shock wave cavitation effect. The grinding device comprises a control system, an acceleration module, a shock wave speedup module, a machining module and...
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JP7464088B2 |
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JP7464575B2 |
This cutting device comprises a table, a cutting mechanism, a holding mechanism, and a water isolation/discharge mechanism. The table or the holding mechanism is connected to a dry vacuum pump through a suction path. The water isolation/...
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JP2024046843A |
An object of the present invention is to more efficiently supply grinding water to an arc-shaped area to be ground. [Solution] The grinding unit has a spindle with a longitudinal portion arranged along a first direction, a grinding wheel...
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JP7461118B2 |
A processing method for a wafer includes a thermocompression-bonding sheet arrangement step of arranging, on a front side of the wafer, a thermocompression-bonding sheet of a size sufficient to cover the wafer, an integration step of pre...
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JP2024046448A |
An object of the present invention is to provide a grinding device that can reliably prevent grinding debris from adhering to a contact shaft while saving water. [Solution] A linear gauge 31 provided in a grinding device 1 detects a cont...
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JP2024044839A |
[Problem] To improve work efficiency. In a belt sander 10, a reinforcing part 90 is provided in a side housing 24, and the reinforcing part 90 protrudes from the side housing 24 toward one side in the axial direction of a motor pulley 54...
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JP7460386B2 |
A processing method for a workpiece includes a cutting step of cutting the workpiece along streets by a cutting blade having a V-shaped tip end, to form V grooves of which shallower parts are wider than deeper parts, and a cleaning step ...
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JP7458760B2 |
A processing apparatus includes a chuck table that holds a workpiece, a cutting unit that processes the workpiece held by the chuck table, a cassette placing region where a cassette is placed, a carrying unit that carries the workpiece b...
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JP7458807B2 |
To provide a cutting device which can accurately detect breakage of a cutting blade during cutting.A cutting device 1 includes a cutting blade 21 which cuts a workpiece 200 by rotation, a holding table 10 which holds the workpiece 200, a...
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JP2024043122A |
[Objective] To provide a device capable of draining treated water mixed with Si scraps from a treatment equipment and recovering Si scraps in the waste water from the treatment equipment without stopping the treatment equipment. [Structu...
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JP2024042530A |
An object of the present invention is to provide a grinding tool that can maintain good visibility of the grinding part while removing chips during grinding. A grinding tool 1 of the present invention includes a main body 11 containing a...
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JP7457637B2 |
To provide a tailstock device capable of inhibiting the formation of rust, and a machine tool.A tailstock device 30 comprises: a tailstock shaft part 32 that has a tailstock center 31 for supporting a workpiece W between itself and a spi...
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JP7457521B2 |
To easily switch an injection direction of processing water while suppressing enlargement of a processing device.A direction of water injected from an injection port 73 can be switched by controlling the opening/closing state of an openi...
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JP7454920B2 |
To provide a processing device to which a cutting blade is attached, which enables a distance between spindles to be shortened without requiring troublesome work.A processing device 100 comprises a spindle housing 11, a mount, a cutting ...
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JP7454312B1 |
An object of the present invention is to provide a floating object recovery device that can efficiently recover floating objects such as scum and oil floating on the liquid surface of a coolant. [Solution] A floating object recovery devi...
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JP2024039285A |
[Objective] To provide a device capable of draining treated water mixed with Si scraps from a treatment equipment and recovering Si scraps in the waste water from the treatment equipment without stopping the treatment equipment. [Structu...
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JP7452960B2 |
To provide a processing device equipped with a cleaning unit, which can sufficiently clean dirt adhering to a lower surface of a work-piece.Carrying-out means 5 comprises a carrying pad 50 that can move in horizontal and vertical directi...
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JP7451948B2 |
To provide a processing quality prediction system that can predict a state of an affected layer generated in a work-piece, with higher accuracy.A processing quality prediction system 1 comprises: a grinder main body 11 that performs grin...
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JP7451949B2 |
To provide a processing quality prediction system that can predict a depth of an affected layer generated in a work-piece, with higher accuracy.A processing quality prediction system 1 comprises: a grinder main body 11 that performs grin...
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JP7451324B2 |
A substrate processing apparatus which reliably prevents a cleaning liquid containing foreign particles from falling from a polishing head onto a substrate is disclosed. The substrate processing apparatus includes a rotating and holding ...
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