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JP7450385B2 |
To provide a cleaning device capable of moving a cleaning member from a retracted position to a cleaning position, in which the footprint of a cleaning tank can be reduced.A cleaning device 16 includes: a cleaning tank 41 defining a clea...
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JP2024036403A |
An object of the present invention is to provide a magnetic separator that is unlikely to cause a decrease in magnetic sludge recovery performance or to cause malfunctions in the device even if the content of magnetic sludge in a liquid ...
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JP7450700B2 |
A processing apparatus includes a chuck configured to hold a substrate; a moving unit to which a processing tool configured to process the substrate is mounted; a sprinkler configured to spray a cleaning liquid configured to clean the mo...
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JP2024033112A |
An object of the present invention is to provide a cutting device that can reduce the probability that a liquid containing cutting waste will drip from a partition plate onto a workpiece held by a holding table. [Solution] When moving a ...
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JP2024032712A |
An object of the present invention is to enable good cutting of a wafer. A crack propagation device for propagating a crack inside a wafer, comprising a crack propagation means for changing the degree of propagation of the crack by contr...
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JP2024032131A |
The present invention provides a cutting device that can prevent cutting debris from adhering to a device and prevent electrodes from oxidizing and rusting. [Solution] A chuck table that holds a workpiece in which a plurality of devices ...
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JP7446668B2 |
To provide a processing waste liquid treatment apparatus which can reduce a frequency of reproduction processing of an ion exchange resin.A processing waste liquid treatment apparatus that is connected to a processing device for processi...
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JP7446677B2 |
In general, provided is a processing apparatus that monitors the pressure in an exhaust duct of the processing apparatus and does not issue an alarm about a temporary decrease in the magnitude of negative pressure in the exhaust duct. Th...
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JP7446683B2 |
The present invention aims to provide a cutting apparatus which is able to definitely replace a cutting blade and prevent the occurrence of a processing fault. The cutting apparatus comprises: a cutting means which has a rotatable cuttin...
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JP3245967U |
An object of the present invention is to provide a construction material polishing machine that is easy to operate and improves the dust removal effect. A construction material polishing machine includes a base plate 1 and further has a ...
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JP7446084B2 |
To provide a technique that can suppress chips from being accumulated.A grinding device comprises: a chuck that holds a substrate; a grinding unit which a grinding tool for grinding the substrate is attached; a housing in which a grindin...
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JP2024030826A |
An object of the present invention is to provide a cutting device capable of suppressing the movement of a sliding door from being hindered by the accumulation of unnecessary materials scattered during cutting of an object to be cut. [So...
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JP7444582B2 |
To reduce costs by improving the versatility of holding means of an angular bearing, to shorten replacement time of a machined workpiece and an unmachined workpiece, and to prevent rolling during carrying.A grinding device 1 for grinding...
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JP7444633B2 |
To quickly wash the upper surface of a wafer.A processing device 1 includes a chuck table 2 that holds a workpiece 15 on a holding surface 200, processing means 3 that processes the workpiece 15 held on the holding surface 200, and a fir...
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JP7444632B2 |
To easily adjust a water reception point of processing water injected from a water nozzle.A control part adjusts the amount of water that flows in first to third inclined pipes 201-203 by controlling first to third flow rate adjustment p...
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JP2024029312A |
An object of the present invention is to reduce the amount of dust remaining on a support table of a dressing unit. [Solution] A polishing device that performs dry polishing on a workpiece, which includes a holding table that holds the w...
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JP2024029658A |
[Problem] A method for processing a workpiece comprising a substrate and a protective member affixed to the front side of the substrate, which can prevent the back side of the substrate from becoming uneven due to grinding of the back si...
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JP7442314B2 |
A substrate processing apparatus includes: a holding part for holding a substrate; a rotating part for rotating the holding part to rotate the substrate together with the holding part; a liquid supply part for supplying a cleaning liquid...
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JP2024027260A |
The present invention provides a cutting device that prevents cutting fluid containing cutting waste from adhering to a workpiece. [Solution] A holding table (12) that holds a workpiece (1) on a holding surface (13), a rotatable cutting ...
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JP2024027610A |
An object of the present invention is to provide a grinding device that can perform grinding according to the conditions of a grinding wheel. [Solution] A grinding device for grinding a workpiece, which includes a chuck table that holds ...
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JP2024026991A |
An object of the present invention is to provide a technique that can suppress a decrease in abnormality detection accuracy. An abnormality detection device 11 is a device for a grinding device 2 that performs a grinding process on a wor...
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JP7440361B2 |
To provide a device which efficiently polishes an outer periphery of a steel pipe while moving in a circumferential direction.A polishing device 1 comprises a polishing unit 2 and a carrier unit 3, and polishes an outer circumference of ...
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JP7439614B2 |
To provide a method for producing an R-T-B based sintered magnet capable of increasing the utilization efficiency of a diffusion material for a sintered body.There is provided a method for producing an R-T-B based sintered magnet which c...
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JP2024508767A |
A containment and evacuation system for substrate polishing components is disclosed. In one aspect, a substrate carrier head includes a polishing pad, a substrate carrier head configured to hold a wafer against the polishing pad, and a s...
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JP7439613B2 |
To provide a method for producing a novel R-T-B-based sintered magnet capable of further increasing a yield.There is provide a method for producing an R-T-B based sintered magnet which comprises: a step of preparing a workpiece of a powd...
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JP2024508534A |
A polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit that conveys fluid from the fluid source into the chemical mechanical polishing system. A chemical mechanical polishing sy...
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JP2024025198A |
[Problem] To propose a new configuration for ensuring the flow of waste liquid from a drain port without requiring energy such as air injection or electric power. [Solution] A holding unit that holds a workpiece, a processing unit that p...
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JP2024025383A |
An object of the present invention is to provide a processing device and a method for processing a workpiece that can prevent cleaning liquid from entering the loading/unloading area and spray from scattering. [Solution] A holding table ...
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JP2024025302A |
An object of the present invention is to improve the dustproof performance of a switch with a simple configuration. In a grinder 10, a switch holder 30 holding a switch 40 is provided on a frame section 28 of a motor housing 24, and a ta...
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JP2024025598A |
[Problem] Processing technology using a wire mesh grindstone that enables a variety of cutting processes such as straight groove machining, arbitrary groove width processing, and straight line cutting to arbitrary curve cutting on workpi...
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JP2024024325A |
[Problem] To notify and alert a worker that polishing liquid or cleaning liquid is attached to the outside of a processing chamber. [Solution] A chuck table 10 that holds a wafer W on a holding surface, a polishing mechanism 20 that poli...
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JP7436250B2 |
To provide a holding table newly configured in consideration of a problem caused in a holding table due to deterioration of an adhesive for fastening a porous plate.A holding table 50, which holds a work-piece (a wafer 10), comprises: a ...
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JP2024022852A |
An object of the present invention is to make it easier to replace a cylindrical filter in an apparatus equipped with a filter unit, and to downsize the apparatus. [Solution] A cylindrical filter unit 3 extending in the vertical directio...
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JP2024023654A |
The present invention provides a system for supplying fluid for a grinder/polisher, a grinder/polisher, and a method for controlling the fluid supply device. A method and apparatus for controlling a fluid supply device in a metallurgical...
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JP7433951B2 |
The invention refers to a filter arrangement for filtering dust-laden air (7) generated by a hand-guided power tool (1) having a pneumatic or electric motor, in particular a sander or a grinder, during operation of the power tool (1). Th...
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JP7432912B2 |
To achieve down-sizing of a polishing device while enabling easy replacement of a buff wheel in the polishing device.In a connection structure of a buff wheel 12 and a drive shaft 11 for rotating the buff wheel, the buff wheel has a coup...
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JP2024022107A |
An object of the present invention is to suppress spray containing processing debris from being ejected from a processing chamber. A first seal plate 135 and a second seal plate 136 are arranged above a passage port 132 and close the pas...
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JP2024021602A |
An object of the present invention is to provide a method for manufacturing a chip that can suppress the remaining of foreign matter attached to a protective tape. [Solution] A chip manufacturing method that divides a workpiece divided i...
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JP2024020719A |
An object of the present invention is to provide a processing device that can simplify the work for properly processing a workpiece and shorten the time required. [Solution] When it is determined that processing of a workpiece cannot be ...
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JP2024017100A |
[Problem] To efficiently clean the entire lower surface of a curved workpiece in a short time. [Solution] A cleaning device 1 that cleans a curved wafer (work) W by bringing a cleaning brush 71 into contact with the lower surface of the ...
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JP2024016941A |
An object of the present invention is to provide a grinding device which is highly economical by reducing the displacement of an exhaust means. [Solution] A chuck table 6, a moving means 55 for moving the chuck table 6 between a loading/...
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JP2024018207A |
An object of the present invention is to suppress the generation of dust when transporting a workpiece to a processing unit. [Solution] A transport unit 61 of a transport device 60 includes a battery 123 as a power source for each compon...
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JP2024019225A |
The present invention provides a wafer chuck cleaning method and apparatus for removing minute foreign matter from the surface of a wafer chuck. A wafer chuck cleaning device 1 includes a grindstone 3 for grinding a chuck surface 21 and ...
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JP2024017196A |
[Problem] To adjust extremely humid air to an appropriate humidity and then discharge it. [Solution] An electrical component, an air cooling unit that supplies a first gas to the electrical component to cool the electrical component, and...
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JP7428519B2 |
To provide a new technique that enables cutting liquid to be optimally supplied to a cutting blade.A cutting device comprises: a cutting unit 34 having a cutting blade 38; a holding table 8 including a holding surface for holding a work-...
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JP7427921B2 |
To provide a new method for determining a slicing processing condition of a semiconductor ingot.A determining method of a processing condition of slicing processing in which a semiconductor ingot is cut with a wire saw includes determini...
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JP7427326B2 |
An objective of the present invention is to correct a setting temperature to reduce the temperature change of a processing unit and a workpiece to supply water to a processing apparatus. A constant temperature water supply apparatus is c...
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JP2024503978A |
Provided herein are advanced substrate polishing methods that use machine learning artificial intelligence (AI) algorithms or software applications generated using AI to control one or more aspects of a polishing process. . An AI algorit...
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JP2024012279A |
The present disclosure relates to the use of water vapor for cleaning or preheating during chemical mechanical polishing. A water vapor generation device (410) includes a barrier (426) within a canister (420) that divides the canister (4...
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JP7422558B2 |
To provide a technology which suppresses adhesion of particles, which fly up when cleaning a suction surface of a chuck, to a substrate.A grinding system includes a grinding part which grinds a substrate, a conveying part which carries t...
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