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JPWO2010070947A1 |
The present invention contains a polyurethaneimide resin represented by the following general formula (I), a thermosetting resin, a filler, and a printing solvent, and the blending amount of the thermosetting resin is 100% by mass of the...
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JP4935406B2 |
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JP2012094876A |
To provide die attach adhesives containing metal salts of quinolinol derivatives as adhesion promoters and conductivity promoters.Die attach compositions exhibit improved adhesion and conductivity by the addition of a metal salt of an 8-...
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JP2012094586A |
To provide a semiconductor device capable of preferably eliminating an unfilled part when heating and crimping a supporting member with wiring and a semiconductor chip with wiring by a die-bonding film, and having an excellent moisture r...
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JP4929634B2 |
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JP4929623B2 |
To provide a thermosetting resin composition, useful for an insulating material for use in flexible circuit boards, capable of readily forming a conductor layer superior in adhesive strength by plating. This thermosetting resin compositi...
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JP2012077302A |
To provide a polyimide film which, especially when superposed on a metal layer by the laminating method, has the function of diminishing the thermal distortion to be imposed on the material; an adhesive film and a flexible metal-clad lam...
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JP4920699B2 |
A composition comprising one or more polyaminoaminde epihalohydrin resins and one or more polyamides in a ratio of about 1:99 to about 99:1 based on polymer actives and use of the composition for creping paper webs.
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JP2012067240A |
To provide an adhesive resin composition that can form an adhesive layer not lowering adhesive force between a wiring layer and an adhesive layer even when repeatedly put in a high temperature circumstance.The coverlay film includes an a...
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JP4903521B2 |
Die attach adhesive compositions exhibit improved adhesion and conductivity by the addition of a metal salt of 8-quinolinol or of an 8-quinolinol derivative as an adhesion and/or conductivity promoter. The metal salt of 8-quinolinol or o...
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JP4901483B2 |
An object of the present invention is to provide a polyimide multilayer adhesive film in which the thicknesses of the respective layers can be precisely measured by an infrared absorption method and a method for producing the same. In an...
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JP4901125B2 |
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JP4895073B2 |
To provide a heat-curable resin paste which maintains the insulation reliability of fine pitch wirings under a high temperature and humidity condition, does not allow the plating components to penetrate into the edge of the protective fi...
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JP2012049388A |
To provide a sheet for forming a semiconductor wafer protective film which can be optically oriented without contaminating the surface of a circuit on a wafer.The sheet for forming a semiconductor wafer protective film used for forming a...
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JPWO2010041644A1 |
To provide an adhesive composition and an adhesive sheet which are capable of low-temperature adhesion, have excellent adhesiveness, solder resistance after humidification treatment, and migration resistance under high temperature and hi...
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JP4875794B2 |
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JP4875294B2 |
A sprayable adhesive composition having a viscosity within the range of 0.5 Pa.s to 5.0 Pa.s, containing at least one colored filler present in an amount up to 50% by weight of the adhesive composition, is suitable for marking identifica...
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JP4872949B2 |
The present invention provides a circuit connecting material (1) which is the circuit connecting material for electrically connecting opposite circuit electrodes, comprises (1) a solidified agent for generating a free radical, (2) free r...
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JP4872187B2 |
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JP4872125B2 |
To provide a thermosetting resin composition capable of forming an interlayer insulation resin layer excellent in close adhesion, heat resistance, flame resistance, a low dielectric constant, etc., and an adhesive film and a multi-layere...
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JP4866738B2 |
Cyclic carbonate and urea derivatives (I) and (II) are new. Cyclic carbonate and urea derivatives of formulae (I) and (II) are new. [Image] R : 1-12C alkylene; X : -CONHR 1>; R 1>1-30C alkyl (optionally substituted by halo, hydroxy, 1-6C...
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JP4867073B2 |
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JP2012502154A |
A method glues two plastic surfaces together with adhesion produced by a heat-activatable adhesive. The adhesive is a heat-activatable adhesive, which is based on i) at least one elastomer having a weight proportion of 30-70 wt. % ii) at...
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JP4862247B2 |
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JP2012007013A |
To provide a surface protection adhesive tape being excellent in heat resistance, having less rising of adhesion force at peeling off and having no remaining of paste and no contamination on an adherend.In the surface protection adhesive...
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JP4849604B2 |
To provide a clamp which is capable of holding an adherend and from which the adherend can be removed, and a silicone adhesive composition used in the clamp. The silicone adhesive composition contains a silicone raw rubber (a), a crossli...
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JP4852280B2 |
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JP4846952B2 |
This invention provides stable waterborne polymer compositions, which are stabilized against gelling, comprising a stable waterborne polymer composition having a Tg of greater than about 0° C. and comprising an acetoacetoxy-type functio...
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JP2011256372A |
To provide a resin composition in which the roughness on the surface of an insulating layer is small in a wet roughening process and on which a plating conductor layer having sufficient peel strength can be formed.The resin composition i...
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JP4839505B2 |
To provide an adhesive film which bonds an electronic part such as a semiconductor element to a lead frame and an insulating support substrate and has high adhesion at a high temperature, low stress properties, and low temperature adhesi...
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JP4839622B2 |
To obtain an adhesive film for providing excellent conductivity while controlling deformation, etc., in bonding as much as possible. The adhesive film 10 comprises an adhesive sheet-like substrate 1 and conductive particles 2 formulated ...
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JP4839628B2 |
To provide a film-like adhesive sufficiently satisfying both processability such as low temperature laminatability and reliability of a semiconductor device such as reflow resistance and the like. The film-like adhesive is used for bondi...
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JP4839670B2 |
To provide an adhesive film having sufficient adhesive strength at a high temperature. The adhesive film 10 comprises a polyamide resin having a partial structure represented by general formula (I) wherein R1and R5each denotes a divalent...
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JP4839629B2 |
To provide a film-like adhesive sufficiently satisfying both processability such as fillability to an adherend, low temperature laminatability and the like and reliability of a semiconductor device such as reflow resistance and the like....
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JP4830686B2 |
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JP4828772B2 |
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JP4823809B2 |
Die attach adhesive compositions comprise a quinolinol or a quinolinol derivative as an adhesion promoter. An exemplary quinolinol derivative has the structure:
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JP2011225820A |
To provide a polyimide solution which is obtained by producing a soluble transparent polyimide in a solvent mixture having a specific ratio, is excellent in storage stability and is suitable for production of various electrical and elect...
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JP2011225733A |
To provide a curable composition and a cured product, more in detail, a cured product solving many problems caused due to an internal stress.The curable composition contains: (A) an organic compound containing at least 2 carbon-carbon do...
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JP4796687B2 |
To provide an adhesive composition used for a flexible printed circuit board, a build up base substrate, a tape for TAB, a lead frame peripheral material and a laminating material, capable of adhering at a relatively low temperature e.g....
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JP4794719B2 |
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JP2011202139A |
To provide an adhesive composition enabling the crosslinking polymerization reaction of the thermosetting polyimide based resin composition to proceed without essentially requiring a high temperature condition, moreover enabling the cros...
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JP4785732B2 |
The invention provides a polyaniline dopant which has small environmental load and from which an electrically conductive polyaniline having better processability on polyaniline can be obtained. A phenol derivative of lignin having a bis(...
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JP4776188B2 |
A wafer-processing tape, having a removable adhesive layer (2), and an adhesive layer (3), formed on a substrate film (1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5...
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JP4778472B2 |
A pressure-sensitive adhesive optical film of the present invention comprises an optical film; and a pressure-sensitive adhesive layer laminated on at least one side of the optical film, wherein the pressure-sensitive adhesive layer is f...
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JP4774749B2 |
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JP4766809B2 |
The present invention relates to novel solventless reactive systems curable at room temperature, based on blocked polyisocyanates, primary amines, compounds with oxirane groups, and 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine, and to proce...
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JP2011159899A |
To provide an adhesive film for semiconductor, which is attached to a semiconductor wafer at a low temperature and has a high elastic modulus when heated, and also to provide a semiconductor device using the same.An adhesive film for sem...
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JP2011157559A |
To provide a die attach adhesive producing a space of a predetermined size between a chip and a chip support.A curable adhesive composition comprises in combination: a curable polymeric base material and, contained in the polymeric base ...
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JP4748292B2 |
To provide an adhesive for a film-like electronic part which contributes to simplification and reduction in time in assembly processes of an electronic part having various adherend surfaces. The adhesive for a film-like electronic part c...
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