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WO/2021/118340A1 |
The present invention is in the field of an improved 2-component polysulfide sealant composition, use of said composition, especially in or on locations which are preferably not closed, such as roads, and railways, on parking decks, and ...
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WO/2021/112320A1 |
The present invention relates to a composition for freezing food, a composition for freezing cells, and a composition for controlling freezing comprising a compound in which two to five amino acids, for example two, three, four or five a...
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WO/2021/113468A1 |
Compositions and devices comprising MXene materials, suitable for use as selective and/or tunable infrared emitters and/or absorbers, and methods of making coatings with low thermal emissivities using coatings comprising MXene materials.
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WO/2021/113296A1 |
Textile fibers at least partially coated with a coating that includes particles of metal-organic frameworks dispersed in a polymeric base are provided. Also provided are fabrics formed from the textile fibers, protective gear and article...
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WO/2021/111863A1 |
The present invention provides: a composition for chemical mechanical polishing, said composition increasing the polishing rate ratio of a silicon nitride film to a silicon oxide film, while reducing the occurrence of dishing in the sili...
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WO/2021/113109A1 |
Sealants are provided, including silicone gels, compositions, and methods of making, for use in sealing telecommunications closures. The silicone gels are capable of sealing and resealing rapidly, for example, within 5 minutes after clos...
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WO/2021/111992A1 |
In the present invention, a surface treatment agent that includes a fluoropolyether group-containing polymer represented by formula (1) and/or a partial (hydrolysis) condensate of the polymer can form a cured coating film having excellen...
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WO/2021/113285A1 |
High oxide film removal rate Shallow Trench Isolation (STI) chemical mechanical planarization (CMP) polishing compositions, methods, and systems of use therefore are provided. The CMP polishing composition comprises abrasives of ceria co...
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WO/2021/111819A1 |
Provided are: a coating solution comprising an organic solvent solution containing a polyol-crosslinkable fluororubber, a polyol vulcanizing agent and an N-phenyl-3-aminopropyltrialkoxysilane, and preferably a coating solution that furth...
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WO/2021/111256A1 |
The present disclosure provides a method of making a chemical mechanical planarization slurry. The method includes contacting a chemical mechanical planarization slurry precursor including a carrier and a plurality of abrasive particles ...
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WO/2021/108480A2 |
A seal can include a body including a thermoplastic material and a filler material including a fluoropolymer. The fluoropolymer can include a modified fluoropolymer. The body can include an elongation-at-break of at least 3%. In an embod...
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WO/2021/107338A1 |
The present invention relates to an OLED thin film encapsulant and a method for producing same, and more particularly, to a process and a device thereof, whereby a process for producing a thin film can be performed in an open space under...
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WO/2021/105174A1 |
The invention relates to cerium based particles having a rough surface and their use as a component of a polishing composition, especially for chemical mechanical polishing. The present invention also relates to the method of preparation...
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WO/2021/107109A1 |
A sealing material 1 has a configuration in which adhesive materials 7 and seal members 5 that have a prescribed shape are arranged on a release paper 3. Guide holes 9 are formed at corner sections of the release paper 3. A storage tool ...
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WO/2021/105169A1 |
The invention relates to cerium based core-shell particles having a core of cerium oxide optionally doped with at least one metal (M) and a shell consisting of a plurality of nanoparticles of cerium oxide optionally doped with at least o...
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WO/2021/103178A1 |
Provided is an organosilicon foam with interpenetrating network pH responsiveness, prepared by the following steps: 25 to 90 parts by mass of organosilicon resin, 10 to 75 parts by mass of pH responsive monomer and 1 to 5 parts by mass o...
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WO/2021/105299A1 |
The present invention provides a process for producing a polyethylene composition by treating a cross-linkable ethylene copolymer containing monomer units with hydrolysable silane-groups and polar monomer units. The invention further pro...
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WO/2021/100788A1 |
Provided are a composition for forming an anti-snow-accretion film capable of forming a film that hinders snow accretion, and an anti-snow-accretion film. This composition for forming an anit-snow-accretion film contains composite part...
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WO/2021/100827A1 |
A fluoropolyether group-containing silane compound which is represented by formula (1a) or formula (1b). In the formulae, the symbols are as defined in the description.
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WO/2021/102338A1 |
Systems and methods are described for generating low altitude clouds saturated with moisture above bodies of water including oceans, lakes, reservoirs, and rivers to generate rain down wind of the location of rain cloud generation.
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WO/2021/101868A1 |
The invention relates to the use of compatible, semi-miscible or miscible polymer compositions as support structures for the 3D printing of objects, including those made from polyether-block-amide copolymers such as PEBAX® block copolym...
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WO/2021/094292A1 |
The invention relates to a potting paste composition for honeycomb reinforcement having improved fire retardancy characteristics. The potting paste composition comprises (a) a curable polymer; (b) a curing agent for the curable polymer; ...
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WO/2021/096160A1 |
Polishing particles and the like of embodiments can have high polishing rate properties and suppress the formation of scratches, which may occur in a polishing process, when applied to a chemical mechanical polishing (CMP) process, by ad...
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WO/2021/095415A1 |
Provided are a chemical mechanical polishing composition and a chemical mechanical polishing method that can polish a semiconductor substrate containing an electric conductor metal, such as tungsten or cobalt, flat and at high speed, and...
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WO/2021/095792A1 |
Provided is a manufacturing method with which it is possible to provide a sealing sheet in which warpage after drying is minimized, and absorption of moisture by a resin composition layer during storage after drying is minimized. A metho...
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WO/2021/095385A1 |
The present invention is a polyether-modified siloxane represented by average composition formula (1) of (R3SiO1/2)a(R2R'SiO1/2)a'(R2SiO2/2)b(RR'SiO2/2)b'(RSiO3/2)c(
SiO4/2)d. In formula (1), R is a hydrogen atom, a hydroxyl group, a mon...
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WO/2021/095413A1 |
Provided are a chemical mechanical polishing composition and a chemical mechanical polishing method with which a semiconductor substrate containing a conductive metal such as tungsten or cobalt can be flatly polished at high speed and su...
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WO/2021/095740A1 |
Provided are polyacrylate-based fine particles that have thickening properties enabling exhibition of high viscosity even when being added in a further less amount and that allows an aqueous solution to have excellent transparency. The p...
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WO/2021/095356A1 |
This sulfonium salt is represented by general formula (1). (In general formula (1), R1 to R3 are each independently an alkyl group having 1-30 carbon atoms, an aryl group having 6-30 carbon atoms or a heteroaryl group having 4-30 carbon ...
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WO/2021/095412A1 |
Provided are a chemical mechanical polishing composition and a chemical mechanical polishing method that can polish a semiconductor substrate containing an electric conductor metal, such as tungsten or cobalt, flat and at high speed, and...
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WO/2021/094641A1 |
The present invention relates to a method for polishing parts made of aluminum, and more specifically parts made of aluminum with a high content of silicon and produced by additive manufacturing.
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WO/2021/095414A1 |
Provided are a chemical-mechanical polishing composition and a chemical-mechanical polishing method capable of polishing a semiconductor substrate containing a conductive metal such as tungsten or cobalt flatly and at high speed as well ...
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WO/2021/091818A1 |
A disclosed laminated glazing comprises a first glass sheet, a first interlayer, a holographic film, a second interlayer having a light transmission of at least 70% at a light wavelength in the range of 250 nm to 400 nm, a second glass s...
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WO/2021/092055A1 |
A light-emitting carpet or light-emitting trim panel that employs a translucent polymer sheet that has a protective layer and a plurality of cavities configured to accept a plurality of light emitting diodes (LEDs) arranged to generate l...
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WO/2021/090814A1 |
The purpose of the present disclosure is to provide a film that has a high water-sliding property, and a substrate having a surface covered with the film. The present disclosure provides a film with the following properties: a sliding ...
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WO/2021/092521A1 |
A reactor system for decomposing at least one of a per- or polyfluoroalkyl substance (PFAS) is provided. The system includes a material having an interior surface that defines a compartment; a subaqueous liquid in the compartment; and an...
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WO/2021/090122A1 |
A polishing article includes a polishing layer having a working surface including at least one multi-cell structure disposed on the working surface. The multi-cell structure includes three cells, defined as a first cell, a second cell an...
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WO/2021/081571A1 |
The invention relates to a method (1) for producing abrasive particles (5), having the following steps: i) providing a starting mixture (2) which contains at least aluminum hydroxide and which can be converted at least into aluminum oxid...
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WO/2021/084386A1 |
An abrasive solution for finishing a metal part is provided. The abrasive solution includes abrasive particles suspended in a solution. The abrasive particles are configured to abrade a surface of the metal part. The abrasive particles a...
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WO/2021/085134A1 |
One of the embodiments of the present invention addresses the problem of providing a method for storing a composition containing 1-chloro-2,3,3-trifluoro-1-propene stably, or providing a composition that contains 1-chloro-2,3,3-trifluoro...
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WO/2021/086015A1 |
Provided are a CMP slurry composition for polishing a tungsten pattern wafer, and a method for polishing a tungsten pattern wafer by using same, the CMP slurry composition comprising: a polar solvent and/or a nonpolar solvent; an abrasiv...
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WO/2021/084963A1 |
This adhesive agent composition for a wet-type friction member contains a resol-type phenol resin, a polyvinyl butylal, and a solvent, wherein the weight average molecular weight of the resol-type phenol resin is 1200-2000.
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WO/2021/084706A1 |
This polishing solution contains abrasive grains, tetravalent cerium ions and water, and has a pH of less than 5.0. This polishing method includes a step for polishing a portion to be polished using this polishing solution. This semicond...
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WO/2021/081162A1 |
A chemical mechanical polishing composition for polishing a substrate having a silicon oxygen material includes a liquid carrier, cubiform ceria abrasive particles dispersed in the liquid carrier, and an organic diacid.
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WO/2021/079831A1 |
The present invention addresses the problem of providing a friction material which is capable of suppressing abnormal noises when the friction material gets wet with water without requiring a special step (for example, a coating step) du...
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WO/2021/079775A1 |
Provided is a liquid-repellent agent composition from which an article having excellent alcohol repellency is obtained. This liquid-repellent agent composition comprises a fluorine-containing polymer and an aqueous medium, wherein the ...
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WO/2021/081153A1 |
A chemical mechanical polishing composition for polishing a substrate having a silicon oxygen material comprises, consists of, or consists essentially of a liquid carrier, cubiform ceria abrasive particles dispersed in the liquid carrier...
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WO/2021/079331A1 |
A shaped abrasive particle is presented. The shaped abrasive particle has a first and second surface. The first and second surfaces are substantially parallel to each other and separated by a thickness. Each of the first and second surfa...
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WO/2021/079774A1 |
Provided is a waterproof, oilproof agent composition that has excellent stability under high alkali conditions. This waterproof, oilproof agent composition contains a fluorine-containing polymer and an aqueous medium, wherein the fluor...
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WO/2021/081145A1 |
The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising ceria particles, (b) a cationic polymer selected from a cationic homopolymer, a cationic copolymer comprising at least one cationic ...
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