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JP7273818B2 |
A process for producing a solder product and a copper product from a first lead-tin based metal composition having at least 40% wt of copper and at least 5.0% wt together of tin and lead. The process includes the steps ofpartially oxidiz...
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JP7273049B2 |
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be p...
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JP2023061626A |
To provide a solder joint material having a function for improving high frequency property; a solder joint material using the solder joint material; and an electronic component.An element and/or a material having Mohs hardness of 5.0 or ...
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JP2023060639A |
To provide a solder composition that is suitable for high-density mounting, and to provide an electronic component.A solder composition includes Sn. The composition includes 1.0-5.0 mass% Cu, 0.1-0.5 mass% Ni, and more than 0.01 mass% an...
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JP7262695B1 |
A solder alloy containing Bi and capable of forming a joint that has heat cycle resistance, drop impact resistance, and suppresses the occurrence of lift-off, comprising 35% by mass or more and 65% by mass or less of Bi, and 0.1% by mass...
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JP7262343B2 |
To provide a flux for molding solder that enables solder to be molten, while preventing substances in the flux from inhibiting joining of an electronic component and a substrate and without generating excessive heat, when melting the sol...
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JP2023514930A |
A silver sintering composition is disclosed that contains a copper alloy that can be stably sintered with good adhesion and sintering strength on various metal substrates such as copper, gold or silver. [Selection drawing] Fig. 1
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JP2023044347A |
To provide a solder alloy and a solder joint of high general applicability, wherein the solder alloy is a low-melting-point Sn-Bi solder alloy containing a large amount of Bi, but does not cause a deterioration in the mechanical properti...
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JP7248774B2 |
In an embodiment a method includes providing a semiconductor chip, applying a solder metal layer sequence on the semiconductor chip, providing a substrate, applying a metallization layer sequence on the substrate, applying the semiconduc...
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JP2023512826A |
lead free solder foil The present invention relates to a lead-free solder foil for connecting metallic and/or metal-coated components. It is an object of the present invention to provide a high temperature resistant solder connection tha...
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JP7241716B2 |
To provide a lead-free solder alloy, a solder welding material, an electronic circuit mounting substrate and an electronic control device capable of suppressing propagation of cracking generated on a solder joint part in such a state tha...
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JP7239835B2 |
[Problem(s)] An object of the present invention is to provide a car window glass equipped with lead-free solder join parts, which passes the VDA test.[Solution] A car window glass includes a glass plate having a conductor layer, a connec...
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JP2023510987A |
SUMMARY Methods and applications for making powder materials are provided. The fabrication method comprises solidifying an alloy melt to obtain an initial alloy strip containing a matrix phase and a dispersed particle phase, removing the...
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JP7229220B2 |
To provide a method for manufacturing a molding solder capable of changing a melting temperature of a molding solder(a solder joint part) after solder joining by easily dispersing metal powder made of metal having a high liquidus tempera...
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JP7216419B2 |
The lead-free solder alloy according to the present invention is a Sn-Ag-Cu-based lead-free solder alloy that is used for soldering a member to be joined that contains Al at least in the surface layer thereof, the lead-free solder alloy ...
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JP7212300B2 |
The present invention uses a solder alloy that has an alloy composition containing less than 5 mass ppb of U, less than 5 mass ppb of Th, less than 5 mass ppm of Pb, less than 5 mass ppm of As, 0-0.9 mass% of Bi, and 0-0.3 mass% of Sb, t...
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JP7209126B1 |
Kind Code: A1 A metal particle for a bonding material capable of overcoming the brittleness of an intermetallic compound and maintaining excellent bonding strength and mechanical strength even against severe temperature fluctuations in e...
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JP7208912B2 |
Disclosed is a pyrometallurgical process for producing a crude solder comprising at least 9.5-69% wt of tin and at least 25% wt lead, at least 80% tin and lead together, 0.08-12% wt of copper, 0.15-7% wt of antimony, 0.012-1.5% wt of bis...
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JP7197423B2 |
To provide an inexpensive sputtering target suitable for obtaining an In alloy film.A sputtering target 100 includes a backing plate 130, a first target material 110 joined onto the backing plate 130 through a first solder material 120, ...
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JP2022180676A |
To provide: a conductive body having a conductivity higher than those of the conventional conductive bodies made of silver; a substrate with a conductive film; a method for producing a conductive body; and a method for producing a substr...
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JP7183313B2 |
To provide a solder paste that can prevent viscosity from increasing.A solder paste contains: solder powders composed of solder alloys containing 90.0 to 99.8 wt% Sn, 0.1 to 6 wt% Ag, by a mass ratio, 30 ppm to 100 ppm As, and the balanc...
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JP7183314B2 |
To provide a solder paste that can prevent viscosity from increasing.A solder paste contains: solder powders composed of solder alloys containing 90.0 to 99.8 wt% Sn, 0.1 to 6 wt% Ag, by a mass ratio, 30 ppm to 100 ppm As, and the balanc...
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JP7182753B1 |
A solder alloy capable of forming joints having heat cycle resistance and drop impact resistance, comprising 45% by mass or more and 63% by mass or less of Bi, 0.1% by mass or more and less than 0.7% by mass of Sb, and 0.05% by mass or m...
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JP2022549450A |
A solder material for use in an electronic assembly, the solder material comprising a solder layer, a core layer comprising a core material, the core layer sandwiched between the solder layers, the core material A solder material whose t...
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JP2022546078A |
A lead-free solder alloy containing 2.5-5 wt.% silver, 0.01-5 wt.% bismuth, 1-7 wt.% antimony, 0.01-2 wt. % indium, max 0.5 wt % titanium, max 0.5 wt % germanium, max 0.5 wt % rare earths, max 0.5 wt % cobalt, max 5.0 wt % aluminum, max ...
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JP7161134B1 |
A solder alloy, a solder ball, a solder preform, a solder paste, and a solder joint having excellent wettability and high reliability by suppressing breakage of the solder joint are provided. [Solution] The solder alloy is Ag: 1.0 to 3.8...
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JP7161140B1 |
A solder alloy, a solder ball, and a solder joint having a low melting point, high hardness in a high temperature environment, heat cycle resistance, and electromigration resistance are provided. [Solution] The solder alloy contains, in ...
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JP7161133B1 |
An object of the present invention is to provide a solder alloy and a solder joint having excellent wettability and high reliability by suppressing breakage of the solder joint. [Solution] The solder alloy is composed of Ag: 1.0-3.7%, Cu...
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JP7158744B2 |
Disclosed herein are multiphase metal anodes useful in non-aqueous batteries. The anodes include at least one active metal and at least one conductive metal.
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JP2022161719A |
To provide a negative electrode active material particle, a negative electrode, and a battery, capable of establishing both of high discharge capacity and excellent capacity retention rate.A negative electrode active material particle co...
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JP2022161166A |
To provide a solder coating method for uniformly and flatly coating solder on the surface of a metal material of a metal circuit including a circuit of small size and narrow pitch, and prevent the occurrence of solder bridges between the...
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JP7155677B2 |
To provide a solder joint electrode capable of reducing cost for coated film formation compared to a sputtering deposition using an alloy target mainly containing silver, and capable of providing sure solder joint without exposure of bac...
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JP7148636B2 |
A compound containing Sn, Te and Mn, and further containing either one or both of Sb and Bi.
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JP7148760B1 |
A solder alloy having a liquidus temperature of 170°C or less and capable of forming joints having heat cycle resistance and drop impact resistance, comprising 45% by mass or more and 63% by mass or less of Bi and 0.1% by mass or more1 ...
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JP2022146285A |
To provide a lead-free solder alloy having high joint reliability with superior impact resistance, and a solder joint.A solder composition comprising Ag of 0.1-4.0 mass%, Cu of 0.1-2.0 mass%, Bi of 0.1-5.0 mass%, Sb of 0.01-4.0 mass%, Co...
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JP7148761B1 |
A solder alloy capable of forming joints having heat cycle resistance and drop impact resistance, comprising 45% by mass or more and 63% by mass or less of Bi, 0.1% by mass or more and 1% by mass or less of Sb, and 0.05% by mass or more1...
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JP7148103B2 |
The present invention addresses the issue of providing: a precursor for an Nb3Sn superconductive wire material that is used in the internal tin process, promotes generation of Nb3Sn, and has a high critical current density; a production ...
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JP7148635B2 |
A compound containing Sn, Te and Mg, and further containing either one or both of Sb and Bi.
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JP7145855B2 |
A micro/nanoparticle-reinforced composite solder for low-temperature soldering and a preparation method thereof belong to the manufacturing field of lead-free low-temperature soldering solders. Micro/nanoparticle-reinforced tin-based all...
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JP7144708B2 |
The present invention employs a lead-free and antimony-free solder alloy which has an alloy composition that contains from 1.0% by mass to 4.0% by mass of Ag, from 0.1% by mass to 1.0% by mass of Cu, from 0.1% by mass to 9.0% by mass of ...
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JP2022140162A |
To provide a lead-free solder alloy having high joint reliability with superior impact resistance and a solder joint.A lead-free solder alloy comprises a solder composition consisting of Ag of 0.1-4.0 mass%, Cu of 0.1-2.0 mass%, Bi of 0....
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JP2022140163A |
To provide a lead-free solder alloy that allows for solder joint at low temperatures and also has high reliability, featuring general applicability, and a solder bonding method.A solder alloy is used to join together an electrode of a su...
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JP2022140161A |
To provide a lead-free solder alloy that is used to join a communication device, a power module and the like with high joint reliability and a solder joint.A lead-free solder alloy is mainly composed of Sn-Cu, whose composition also incl...
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JP7141042B2 |
A conducting shear thinning gel composition and methods of making such a composition are disclosed. The conducting shear thinning gel composition includes a mixture of a eutectic gallium alloy and gallium oxide, wherein the mixture of eu...
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JP7135171B2 |
A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.
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JP7133397B2 |
To provide lead-free solder alloy capable of, even under severe environment in which temperature difference is large and vibration is loaded, suppressing a crack generated on not only a solder joint part on but also an electrode of a chi...
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JP7133739B1 |
A solder alloy, a solder joint material, a solder paste, and a semiconductor package capable of suppressing delamination at the interface between a solder joint and a semiconductor element are provided. [Solution] 1.1% by mass to 8% by m...
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JP7131956B2 |
To provide a conductive bonding paste material that has high bonding reliability and excellent conductivity capable of bonding even at a low temperature, can be suitably used in bonding a member having low thermal expansion coefficient b...
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JP2022130498A |
To provide a lead-free and antimony-free solder alloy that has a melting point of around 230°C and a tensile strength of 50 MPa or more, and a solder ball and a solder joint.A lead-free and antimony-free solder alloy is employed that ha...
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JP7126235B2 |
To provide a superconducting wire junction structure obtained by joining superconducting wires made of different superconducting materials without intervening a normal conducting material.A superconducting wire junction structure includi...
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