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JP6880438B2 |
To provide solder paste that can make both viscosity-increase restraining effect and reliability compatible with good balance.The solder paste according to the invention is made of a solder material and a flux. The solder material contai...
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JP6880960B2 |
To improve the performance of an Mg-based thermoelectric material.A method of producing an Mg-based thermoelectric material is provided in which an Mg-based thermoelectric material 1 having Mg deficiency is heated in the presence of meta...
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JP2021079443A |
To provide a soldering flux that inhibits residue cracking of a flux residue and has excellent solder wettability.The invention provides a flux composition containing one or more selected from the group consisting of a maleic acid-modifi...
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JP2021079442A |
To provide a soldering flux that inhibits residue cracking of a flux residue and has excellent solder wettability.The invention provides a flux composition containing one or more selected from the group consisting of a maleic acid-modifi...
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JP2021070840A |
To provide a method for manufacturing a slide component with a coating film including an alloy of zinc and tin, and graphite dispersed in the alloy.A method for manufacturing a slide component includes the steps of: forming a coating fil...
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JP2021070057A |
To provide a solder paste containing a flux component which has good physical property during storage and soldering.A solder paste contains solder powder, and a flux component containing a compound having at least one carboxyl group prot...
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JP2021053704A |
To provide a lead-free solder alloy composition having excellent wettability and joint strength, and a method of preparing a lead-free solder alloy.The lead-free solder alloy composition includes a ceramic powder added to a solder alloy ...
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JP6853995B2 |
To provide a thermoelectric transducer consisting of a sintered body of a MgSi-based polycrystalline body which is a material with low environmental burden, high in antioxidation resistance and high in strength after a heat treatment.The...
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JP6855614B2 |
To provide a sputtering target material comprising a sintered alloy having high mechanical strength (in particular, high toughness suitable for a sputtering target material).The sputtering target material comprises a sintered alloy conta...
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JP6849933B1 |
To provide a flux capable of improving the wettability of solder, excellent temperature cycle reliability, and suppressing scattering due to heating during reflow, and a solder paste using the same. A flux containing an organic acid, an ...
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JP6849923B2 |
To provide solder paste that can make both viscosity-increase restraining effect and reliability compatible with good balance.The solder paste according to the invention is made of a solder material and a flux. The solder material contai...
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JP2021045791A |
To provide: e.g., an Sn-Bi-Cu-Ni based solder alloy which has a low melting point, excellent ductility and high tensile strength, where a solder joint formed by soldering the solder alloy onto a Cu electrode that has been undergone an el...
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JP2021045792A |
To provide: a solder alloy which has excellent heat cycle characteristics and inhibits copper leaching, yellowing, and a viscosity rise of a solder paste over time; and a solder paste, a solder ball, a solder preform, a soldered joint, a...
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JP6848859B2 |
In order to improve the strength and elongation of a solder and improve the reliability of a joining portion joined by the solder, the present invention provides a solder alloy that comprises 2.0 to 4.0 mass % of Ag, 0.5 to 1.0 mass % of...
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JP2021042435A |
To provide a slide member capable of reducing a friction and maintaining its state for a long time, and a manufacturing method of the same.A slide member 10 includes a base material 1 composed of steel, and an alloy layer 2 formed on a s...
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JP2021041463A |
To provide a flux and a solder paste which can improve a thickening suppression effect.The solder paste is a flux containing a metal deactivator, in which the metal deactivator contains a hydrazide-based nitrogen compound. A content of t...
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JP6842500B2 |
This invention relates to a lead-free solder alloy composition and a method of preparing a lead-free solder alloy, wherein the lead-free solder alloy composition includes a ceramic powder added to a lead-free solder of Sn-(0.1 to 2) wt% ...
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JP2021037546A |
To provide a solder alloy which exhibits excellent temperature cycle characteristics, suppresses yellowing, maintains excellent wettability and can suppress an increase over time in the viscosity of a solder paste; and a solder paste, a ...
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JP2021037548A |
To provide a solder alloy which exhibits excellent temperature cycle characteristics and drop impact resistance, suppresses yellowing, maintains excellent wettability and can suppress an increase over time in the viscosity of a solder pa...
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JP2021037547A |
To provide a solder alloy that has not only a long-term ability to withstand severe temperature cycle properties such as low temperatures of -40°C and high temperatures of 125°C, but also a long-term ability to withstand force from the...
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JP6836006B1 |
To provide an electronic device substrate in which a conductor having a low electric resistance and a dense structure is provided in a minute space in the electronic device substrate without breaking wiring or the like. An electronic dev...
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JP6836091B1 |
To suppress an increase in viscosity of solder paste over time, to prevent short circuit of a circuit, to increase mechanical strength of a solder joint, and to suppress the occurrence of soft error, this solder. Provided are a solder po...
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JP6836040B1 |
To provide a solder alloy having excellent creep resistance and good workability. The solder alloy is, in mass%, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001. It has an alloy composition of ...
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JP2021027178A |
To provide an electronic control unit that has high bonding reliability regardless of a component shape and can suppress thermal fatigue fracture and void fracture that becomes apparent in high temperature regions.The electronic control ...
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JP6828880B2 |
To provide a solder paste capable of performing solder joining at a comparatively low reflow temperature in a solder paste using solder alloy powders containing Sb.In a solder paste made by mixing solder alloy powders and a flux, the sol...
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JP6829272B2 |
To provide new solder alloy for manufacturing a solder paste, the solder alloy capable of suppressing viscosity increase after paste production.A solder alloy contains Sn and one or two or more kinds selected from the group consisting of...
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JP6826995B2 |
Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zi...
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JP6823287B2 |
To provide a method for forming a low resistance or a porous structure of tin alloy at low energy cost per formed object using a low power laser and galvanic substitution reaction.Provided are a method for forming a low resistance or por...
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JP2021502259A |
Lead-free tin-based solder alloys include silver, copper, cobalt, and optionally additional bismuth and antimony. The alloy may further contain nickel. Silver is present in an amount of 2.0% to 2.8% by weight of solder. Copper is present...
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JP6819822B2 |
Provided is a negative electrode active material which is excellent in capacity, capacity retention ratio, and a coulombic efficiency when charging/discharging is repeated. The chemical composition of the alloy particles of the negative ...
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JP6814744B2 |
The present invention relates to a process for preparing a tubular article, comprising (a) providing a carrier tube, (b) providing a metal coating on the carrier tube by applying a liquid metal phase onto the carrier tube and solidifying...
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JP6810915B2 |
Provided is a solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 5.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by m...
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JP6813443B2 |
To provide a method of producing an Sm-Fe-N based rare earth magnet in which excellent coercive force and residual magnetization can be obtained even if sintered at a relatively low pressure.A method of producing a rare earth magnet incl...
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JP6810373B1 |
A solder alloy that has excellent temperature cycle characteristics, suppresses yellowing, maintains excellent wettability, and can suppress the increase in viscosity of solder paste over time, solder paste using this solder alloy, and s...
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JP6810371B1 |
The subject of the present invention is that the Cu electrode having a low melting point, excellent ductility, and high tensile strength is soldered to a Cu electrode subjected to electroless Ni plating treatment, and the solder joint fo...
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JP6810374B1 |
Uses this solder alloy, which has excellent temperature cycle characteristics and drop impact resistance, suppresses yellowing, maintains excellent wettability, and can suppress the increase in viscosity of solder paste over time. Provid...
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JP6810372B1 |
Solder alloys, solder pastes, solder balls, solder preforms, solder joints that have excellent heat cycle characteristics, suppress Cu erosion, suppress yellowing, and suppress the increase in viscosity of solder paste over time. , And p...
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JP6810375B1 |
Not only can it withstand severe temperature cycle characteristics such as low temperature of -40 ° C and high temperature of 125 ° C for a long period of time, but it also resists external forces generated by riding on a curb or colli...
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JP6810049B2 |
in which C represents at least one of the elements Cu, Ni, Ag; S represents Sb and/or non-metal particles; B represents at least one of the elements Pb, Bi, Te, Tl; and ω represents the total content of each of the tin-based alloy compo...
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JP6804126B1 |
Bi is contained in an amount of 32% by mass or more and 40% by mass or less, Sb is contained in an amount of 0.1% by mass or more and 1.0% by mass or less, Cu is contained in an amount of 0.1% by mass or more and 1.0% by mass or less, Ni...
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JP6803975B2 |
The present application provides a method for manufacturing a metal alloy foam. The present application can provide a method for manufacturing a metal alloy foam, which is capable of forming a metal alloy foam comprising uniformly formed...
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JP6799790B2 |
A bonding material includes at least 0.1 wt% to at most 5 wt% of at least one element which may form a compound along with tin and carbon, and Sn as the main component of a remainder.
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JP6799649B1 |
To provide metal particles which have higher heat resistance, bonding strength and mechanical strength than the prior art and can reliably bond elements and parts having different coefficients of thermal expansion. An intermetallic compo...
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JP6799701B1 |
To suppress an excessive Sn diffusion phenomenon at any joint interface and overcome brittleness of an intermetallic compound even in a severe temperature fluctuation in an extremely high temperature or extremely low temperature environm...
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JP2020192600A |
To provide a solder alloy, solder powder and the like which suppress changes with time of a solder paste, are excellent in wettability, have a small temperature difference between a liquidus line temperature and a solidus line temperatur...
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JP2020192601A |
To provide a solder alloy and the like which suppress changes with time of a solder paste, have a small temperature difference between a liquidus line temperature and a solidus line temperature, and have high reliability.A solder alloy h...
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JP2020192604A |
To provide: a solder alloy which suppresses corrosion of Fe in a solder bath, exhibits high mechanical strength in a solder joint and does not cause short-circuits in circuits; and a solder powder, a solder paste, a solder ball, a solder...
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JP2020192599A |
To provide a solder alloy, solder powder and a solder joint which suppress changes with time of a solder paste, are excellent in wettability, have a small temperature difference between a liquidus line temperature and a solidus line temp...
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JP6795630B2 |
To provide a lead-free solder alloy, a solder paste composition, an electronic circuit board, and an electronic controller that can suppress cracking development of a solder joint part even in a severe environment in which differences in...
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JP6796108B2 |
Provided are: a lead-free solder alloy, which is a means that can achieve both of a cracking propagation prevention effect and resistance to impact associated with high-speed deformation at a solder joint part under an environment where ...
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