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JP6788337B2 |
A composition for bonding includes tin, germanium, and nickel. A contained amount of germanium is less than or equal to 10 mass%. The contained amount of germanium and a contained amount of nickel satisfy a relation (1) Ni ¤ 2.8 × Ge...
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JP6780994B2 |
A solder material includes 25 to 45 mass % of Sn, 30 to 40 mass % of Sb, 3 to 8 mass % of Cu, 25 mass % or less of Ag, and 1.3 to 6 mass % of In.
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JP6777873B1 |
To provide a flux and a solder paste capable of improving the thickening suppressing effect. The flux of the present invention contains a metal inactivating agent and a resin, and the metal inactivating agent contains a melamine-based ni...
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JP6777872B1 |
To provide a flux and a solder paste capable of improving the thickening suppressing effect. The solder paste of the present invention contains 9,10-dihydro-9-oxa-10-phosphophenanthrene-10-oxide. [Selection diagram] None
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JP6773986B1 |
To provide a flux and a solder paste which are excellent in solderability and can enhance reliability. The flux contains a novel rosin compound having a high content of agacinic acids, and preferably further contains a thixotropic agent ...
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JP6773143B2 |
A lead-free solder has a heat resistance temperature which is high and a thermal conductive property which is not changed in a high temperature range. A semiconductor device includes a solder material containing more than 5.0% by mass an...
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JP6767506B2 |
A lead-free solder alloy comprising: from 8 to 15 wt.% antimony, from 0.05 to 5 wt.% bismuth, from 0.1 to 10 wt.% silver, from 0.1 to 4 wt.% copper, one or more of up to 1 wt.% nickel, up to 1 wt.% cobalt, up to 1 wt.% titanium, up to 1 ...
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JP6770323B2 |
To provide a novel manufacturing method of metal particles, which can obtain spherical metal particles having a small particle size, for example, a particle size of 10 μm or smaller with excellent production efficiency.A manufacturing m...
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JP6768392B2 |
To provide a sintered alloy having high mechanical strength (especially high toughness suitable for a sputtering target material) and a sputtering target material containing the sintered alloy.There are provided a sintered alloy containi...
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JP6762915B2 |
To provide a sliding member that can improve fatigue resistance, and to provide a sliding bearing.There are provided a sliding member and a sliding bearing in which a coating layer is laminated on a base layer. The coating layer includes...
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JP6761199B1 |
To provide a nuclear material or the like which is unlikely to be judged as defective in a visual inspection and can prevent the thickness of an oxide film thickness from becoming too thick. The core material is a core 12, a solder layer...
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JP6755546B2 |
To provide a jointing method for jointing to an object to be jointed using an Sn-Cu-based lead-free solder alloy.When soldering a copper substrate or copper plating substrate using an Sn-Cu-based lead-free solder alloy, a jointing method...
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JP6755837B2 |
To provide: a lead-free solder alloy capable of making compatible the suppression of a cracking progress of a solder junction and the suppression of an electrode separation phenomenon of an electronic part due to a solder junction even i...
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JP2020527665A |
The present invention relates to a piston for an internal combustion engine having a piston head (12) and a piston skirt (14). The piston head (12) has a closed circumferential cooling channel (22). The first coolant (24), which is a met...
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JP6751250B1 |
Provided are solder alloys, solder pastes, solder preforms, and solder joints, which suppress chip cracking during cooling, improve heat dissipation characteristics of solder joints, and exhibit high joint strength at high temperatures. ...
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JP6745453B2 |
There is provided a solder alloy in which 0.5 mass% or more and 1.25 mass% or less of Sb, In satisfying the following formula (I) or (II) when [Sb] is set as a Sb content percentage (mass%) and [In] is set as an In content percentage (ma...
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JP2020126821A |
To provide a protection element for an electric and electronic device in which there is no fear that a fuse element will remain unbonded between electrodes with the fuse element attached while complying with the chemical substance regula...
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JP6740635B2 |
To provide a terminal material without generating electric corrosion by using copper or a copper alloy substrate as a terminal crimped to a terminal of a wire consisting of an aluminum wire material.A ground layer consisting of nickel or...
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JP6744972B1 |
To provide a bonded structure portion which has higher heat resistance, bonding strength and mechanical strength than the prior art and can reliably bond elements and parts having different coefficients of thermal expansion while suppres...
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JP6737538B2 |
The present invention discloses a liquid metal thermal interface material having an anti-melt characteristic and a preparation method thereof. The liquid metal thermal interface material is characterized by comprising, In percentage by w...
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JP2020116637A |
To provide a paste for joining having a small amount of flux residue after reflowing or heating, hardly remelting, being excellent in long-term storage stability at a room temperature, being excellent in bump shape holding property and h...
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JP2020119955A |
To provide a connection structure capable of effectively increasing insulation reliability and conduction reliability even when electrodes are electrically connected.A connection structure comprises a first connection target member inclu...
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JP6734553B1 |
To provide a flux having improved wettability of solder and a solder paste using the flux. In the flux used for a solvent paste containing a flux and a metal powder, the flux is 0.5 wt% or more and 20.0 wt% or less for an isocyanuric aci...
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JP6736999B2 |
To provide means for improving the cycle durability of an electric device such as a lithium ion secondary battery.A negative electrode active material is used for an electric device, which comprises a silicon-containing alloy having a te...
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JP6730999B2 |
A SnAgCuSbBi-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a m...
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JP6731037B2 |
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JP6730833B2 |
To provide a solder alloy that can be suitably used even for the solder bonding of electronic components made up of Ni, nickel silver and the like, and solder bonding materials, while reducing the liquidus temperature of the solder alloy...
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JP6731034B2 |
There is provided a lead-free solder alloy comprising 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and...
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JP2020110843A |
To provide a solder material with which viscosity increase due to the lapse of time is suppressed, and which is superior in wettability and reliability, and to provide a solder paste, and a solder joint.A solder material contains an Sn o...
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JP6721849B1 |
To have a flak having excellent temperature cycle reliability.SuTo provide a solder paste having excellent temperature cycle reliability and thickening suppressing effect. Flux and metal powderConsists ofSolder paceToLeave, HuLux contain...
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JP6721850B1 |
To provide a solder paste capable of achieving both a thickening suppressing effect, reliability and wettability in a well-balanced manner. The solder paste of the present invention is composed of a solder material and a flux. The solder...
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JP6721851B1 |
To provide a solder alloy, a casting, a formation and a solder joint capable of casting a casting having a desired thickness. The solder alloy has an alloy composition in which mass is Cu: 0.1 to 2.0%, Ni: 0.01 to 0.4%, P: 0.001 to 0.08%...
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JP6722378B2 |
To provide a solder material that suppresses a viscosity increase with time and that is excellent in wettability, solder paste and a solder joint.A solder material, which has an As thickened layer, includes Sn or an Sn alloy, 40-250 mass...
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JP6719141B2 |
In the production of an internal-tin-processed Nb3Sn superconducting wire, the present invention provides a Nb3Sn superconducting wire that is abundant in functionality, such as, the promotion of formation of a Nb3Sn layer, the mechanica...
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JP6719443B2 |
To provide a lead-free solder alloy, an electronic circuit mounting board having a solder joining part formed by using the lead-free solder alloy and an electronic control device capable of restraining crack progress of the solder joinin...
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JP2020099950A |
To provide a solder material, a solder paste and a solder joint suppressing viscosity increase with time and being excellent in wettability and reliability.A solder material has an As concentrated layer containing Sn or an Sn-based alloy...
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JP6717559B2 |
To provide a novel solder alloy that can suppress especially a viscosity increase after paste production regarding a solder alloy for producing solder paste.The solder alloy includes one or more selected from the group consisting of Sn, ...
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JP2020097057A |
To provide a solder material or a solder joint, which is restrained from being subjected to yellow coloration and which is excellent in wettability.A discoloration-resistant solder material includes Sn or an Sn-based alloy and 40-320 mas...
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JP6713106B2 |
Provided are a lead-free solder alloy which consists of Sb in an amount of more than 3.0% but 10% or less by mass, and the balance including Sn, and others.
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JP2020089917A |
To provide a flux which sufficiently improves wettability of a solder alloy containing no Ag.A flux solders a solder alloy containing 0.1-3.0 wt.% Cu and 0.0040-0.0150 wt.% Ge, and the balance Sn, and contains an acid-modified rosin, in ...
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JP2020089918A |
To provide a flux which sufficiently improves wettability of a solder alloy containing no Ag.A flux solders a solder alloy containing 0.1-3.0 wt.% Cu and 0.0040-0.0150 wt.% Ge, and the balance Sn, and contains a chlorendic acid and/or ch...
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JP6707656B2 |
A thermoelectric generator includes a hot side heat exchanger, a cold side heat exchanger, a plurality of n-type semiconductor legs arranged between the hot side heat exchanger and the cold side heat exchanger, and a plurality of p-type ...
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JP6708942B1 |
To provide a solder alloy suitable for step soldering including soldering in a medium to low temperature range and having excellent mechanical reliability. Provided are solder pastes containing such solder alloys, preform solders, solder...
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JP2020084208A |
To provide an alloy with a novel composition.An alloy is represented by MLi, where M is one or more of Si, Ge, Sn, Sb, Bi and Al, when M is Si, Ge and Sn, 4
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JP2020082122A |
To provide a solder alloy that can improve mechanical characteristics and fatigue characteristics and has sufficient heat resistance and reliability.A solder alloy has an alloy composition that includes 5-10 mass% Sb, 0.05-0.25 mass% Ni ...
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JP2020084271A |
To provide a metal particle water dispersion in which metal particles containing iron are dispersed in water, and stable dispersion of metal particles and suppression of oxidation of iron are realized.Metal particles made of an alloy of ...
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JP6706351B2 |
A solder bonding method for bonding an electrode of a circuit board and an electrode of an electronic component by forming a solder joint that exhibits excellent connection reliability while reducing thermal damage to the electronic comp...
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JP6705110B2 |
The present specification relates to a metal nanoparticle. Specifically, the present specification relates to a metal nanoparticle having a cavity.
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JP6700568B1 |
To provide a solder alloy and a solder joint which have high tensile strength and can suppress Ni erosion and the generation of voids at a bonding interface. The solder alloy has Ag: 1.0 to 4.0%, Cu: 0.1 to 1.0%, Ni: 0.005 to 0.3%, Co: 0...
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JP6698367B2 |
To provide a metal powder excellent in various performances.A metal powder is an aggregate of many particles. A shape of each particle is spherical. The powder contains at least one kind of Ni, Ag, Cu and Sn. The total percentage content...
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