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JP7123912B2 |
A process for the production of a metal mixture composition containing lead and tin, and comprising by weight at least 10% tin and 45% lead, at least 90% of tin and lead together, more lead than tin, from 1-5000 ppm of copper, at least 0...
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JP7116946B2 |
To provide a method for manufacturing copper-tin alloy, which makes it possible to reduce occurrence of voids.A method for manufacturing copper tin alloy includes: obtaining a laminate by bringing a copper tin containing layer into conta...
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JP7115591B2 |
A lead-free solder has a heat resistance temperature which is high and a thermal conductive property which is not changed in a high temperature range. A semiconductor device includes a solder material containing more than 5.0% by mass an...
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JP2022113418A |
To provide a resin flux solder paste which is excellent in applicability to a high melting point solder, and has both excellent connection stability (solder melting property) and excellent shear adhesion force, and a mounting structure m...
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JP7108907B2 |
To provide a joint material having high heat radiation properties and high reliability, comprising a solder alloy mainly made of tin.A joint material includes at least one element of 0.1 wt% to 30 wt%, the element being capable of formin...
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JP2022533718A |
A method of manufacturing a solar module by interconnecting multiple photovoltaic (PV) cells, in which at least the first PV cell is the first, using a conductive adhesive containing or consisting of a solder paste. How to interconnect t...
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JP7104353B2 |
The present invention uses a solder paste that contains a specific solder powder and a specific flux. This solder powder contains a solder alloy which has an alloy composition comprising not less than 10 ppm by mass and less than 40 ppm ...
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JP7100283B1 |
An alloy composition consisting of Ag: 1.0 to 4.0% by mass, Cu: 0.1 to 1.0% by mass, Bi: 0.1 to 9.0% by mass, Ni: 0.005 to 0.3% by mass, Ge: 0.001 to 0.015% by mass, and the balance of Sn. Uses a lead-free and antimony-free solder alloy.
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JP7087732B2 |
To further improve wear resistance, to suppress the increase of electric resistance, and to securely prevent the generation of peeling upon bending or the like.A Cu-Sn intermetallic compound layer is formed on a base material made of Cu ...
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JP7084022B2 |
To provide a superconductor that exhibits sufficient superconductivity while realizing low cost and processing simplicity.The superconductor comprises a constituent A and a constituent B such that superconductor layers 10 exhibiting supe...
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JP7082995B2 |
The present disclosure relates to a lead-free solder alloy composition in which a nanosized ceramic powder additive is added to a lead-free solder alloy of Sn—Cu—Bi, Sn—Ag—Bi or Sn—Ag—Cu—Bi, and a method for preparing the s...
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JP7082641B2 |
Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zi...
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JP7079889B1 |
To provide a solder alloy, a solder joint material, a solder paste and a semiconductor package capable of suppressing peeling of both at an interface between a solder joint portion and a semiconductor element. Cu is 1.1% by mass or more ...
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JP7073701B2 |
To provide an Au-Sn alloy solder paste capable of suppressing deterioration of an object to be joined due to heat at the time of reflow while offering an excellent heat resistance property as an Au-Sn solder, and a joining method using t...
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JP2022074048A |
To provide a conductive adhesive that is able to satisfactory solder wettability and conductivity and to provide an anisotropic conductive film, a connection structure, and a method of manufacturing the connection structure, which can ob...
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JP7068370B2 |
Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass%, Ag: 0.8 to 1.5%, Cu: 0.1 to 1....
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JP7066806B2 |
To provide a lead-free solder alloy, a solder paste, an electronic circuit mounting substrate and an electronic controller where both of the crack propagation inhibiting effect of a solder joint under the circumstances of large temperatu...
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JP2022523203A |
Highly reliable lead-free solder alloys for harsh usage conditions are disclosed. In some embodiments, the solder alloy is 2.5-4.0 wt% Ag; 0.4-0.8 wt% Cu; 5.0-9.0 wt% Sb; 1.5-3.5 wt% Bi; 0.05-0.35 wt% Ni. Includes; and the rest of Sn. In...
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JP7057997B2 |
To provide a Sn-Ag-Cu-based lead-free solder alloy and a solder joint having an improved mechanical characteristic.Mg is added as much as 2 wt% or less to a Sn-Ag-Cu-based lead-free solder alloy. Further, a solder joint is manufactured b...
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JP7057533B2 |
The present invention uses a solder paste that contains a specific solder powder and a specific flux. This solder paste contains a solder powder that includes a solder alloy which has an alloy composition comprising not less than 10 ppm ...
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JP2022058311A |
To provide a lead-free solder alloy which keeps a melting point of an Sn-Bi solder alloy low, which has physical characteristics proper than ever, and which can form a joint improving ductility, distortion characteristics and the like an...
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JP7050019B2 |
To provide a protective element for electrical/electronic apparatus, for assisting dissolution of a fuse element attached between electrodes and improving breaking stability during fuse operation so that there is no concern that a fuse e...
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JP2022519457A |
The process of producing soft lead (27), hard lead (28) and tin (20), a) producing a first lead overhead (7) and a first tin bottom (8), Pb + Sn. First distillation (200) of solder (6) containing + Sb, b) First bottom (8), optionally pro...
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JP7041477B2 |
A conductive ball includes a copper ball, a nickel layer formed with being patterned on an outer surface of the copper ball, and a tin-based solder covering each outer surface of the copper ball and the nickel layer.
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JP2022519748A |
The present invention relates to niobium-tin compounds for producing superconducting components, particularly composition Nb.x xSny y[In the above formula, 1 x 6 and 1 y 5] powder, which is characterized by a low oxygen content, a method...
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JP2022519458A |
A first silver-enriched liquid drain product (9) at the liquid end of the crystallization step and the crystal end of the crystallization step by fractional crystallization (300) of a molten crude tin mixture containing lead and silver (...
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JP7041710B2 |
Provided are a lead-free and antimony-free solder alloy which has a medium-low melting point and ensures solderability even after being held at a high temperature for a long time, a solder ball, a ball grid array, and a solder joint. The...
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JP2022043722A |
To provide a Sn-In-based low melting point bonding member that is used for a Pb-free conductive bonding method in mounting a semiconductor component and can be bonded at a low temperature, and a manufacturing method thereof.A manufacturi...
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JP2022038434A |
To provide a sputtering target capable of performing a stable sputtering film deposition, the sputtering target having a sputtering target material surely bonding with a backing material through a heat-resistant solder layer.A sputtering...
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JP7032687B1 |
To provide a solder alloy, a solder paste, a solder ball and a solderp, which are excellent in mountability because the melting temperature is within a predetermined range, the tensile strength and the shear strength are high, the genera...
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JP7025679B2 |
Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint, which have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony...
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JP7025208B2 |
In order to improve the strength and elongation of a solder and improve the reliability of a joining portion joined by the solder, the present invention provides a solder alloy that comprises 2.0-4.0 mass % of Ag, 0.5-1.0 mass % of Cu, 0...
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JP7024670B2 |
To facilitate densification of a first and a second core-shell powder, and improve the initial bonding strength of a joint layer and the bonding reliability after cooling and heating cycles.A first core-shell powder 11 is constituted of ...
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JP7024671B2 |
To facilitate unification of neighboring core-shell powders, and improve the initial bonding strength of a joint layer and the bonding reliability after cooling and heating cycles.A first core-shell powder 11 is constituted of a first co...
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JP2022515254A |
Lead-free solder alloys, 1-9% by weight copper, at least one of the following: 0-> 1% by weight nickel,> 0-10% by weight germanium,> 0-> 1% by weight manganese. , 0 to 10% by weight aluminum, 0 to 10% by weight silicon, 0 to 9% by weight...
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JP2022027647A |
To provide a bonding material (active metal wax material or metal paste) which can effectively bond even a thick copper plate to a ceramic substrate at a low temperature, and can form a joint layer (or copper-pasted board) which has exce...
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JP7014991B1 |
To provide a preform solder in which the generation of voids is further suppressed at the time of solder joining, a method for manufacturing the same, and a method for manufacturing a solder joint using the preform solder. A preform sold...
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JP7013636B2 |
To provide a solder material or solder joint that resists yellowing and has excellent wettability.A discoloration-resistant solder material contains Sn or an Sn alloy and 40-320 mass ppm of As and has an As concentrated layer.SELECTED DR...
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JP7014535B2 |
A conductive ball includes a copper ball, a nickel layer covering an outer surface of the copper ball, a copper layer covering an outer surface of the nickel layer, and a tin-based solder covering an outer surface of the copper layer. A ...
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JP7014003B2 |
Provided are a solder joint electrode having a copper alloy coating film with excellent solder wetness to reduce a coating film reduction costs compared to a sputtering forming film comprising silver as a main component, and further, dis...
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JP7011208B2 |
Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint that have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-f...
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JP7011212B1 |
To provide a method for producing a flux and a bonded body, which can further suppress the precipitation of an activator in a flux residue after soldering. A flux containing rosin, a terpene phenol resin, and an activator is adopted. The...
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JP7006686B2 |
A semiconductor device comprising an assembly structure in which a semiconductor element (1) is mounted on a laminated substrate. The semiconductor element (1) and an electrode pattern (3) on the laminated substrate are bonded by means o...
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JP7007623B1 |
To provide a solder alloy and a solder joint having a narrow ΔT, suppression of bridges and icicles, a small amount of dross generated in a solder bath, suppression of Cu erosion, and higher strength. The solder alloy has an alloy compo...
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JP2022016280A |
To provide a flux and a solder paste containing the flux where the intermittent printability of the solder paste can be improved with good workability.A flux used for soldering contains a solvent containing at least one kind selected fro...
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JP7000556B2 |
Alloys comprised of a refined microstructure, ultrafine or nano scaled, that when reacted with water or any liquid containing water will spontaneously and rapidly produce hydrogen at ambient or elevated temperature are described. These m...
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JP6998557B2 |
A solder alloy, includes: about 3 wt% to about 15 wt% of Sb; about 0.01 wt% to about 1.5 wt% of Te; and about 0.005 wt% to about 1 wt% of at least one element selected from the group consisting of Zn, Co, and Cr; and a balance of Sn.
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JP6999066B2 |
The present invention pertains to: a Sn-Ti alloy powder for a superconducting wire rod, the Sn-Ti alloy powder making it possible to improve superconducting properties by minimizing the size of Sn-Ti particles dispersed in a Sn-based all...
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JP2022506217A |
The present invention comprises a first solder alloy powder having an amount in the range of 30% by mass to 95% by mass, the first solder alloy having a solid phase line temperature of 200 ° C to 260 ° C. The first solder alloy powder ...
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JP2022007121A |
To provide a lead-free solder alloy and a solder alloy joined body which are less likely to be reduced in bond strength, cause no generation of voids even when having been exposed at high temperature for a long time since it is used as a...
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