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JP6691305B2 |
To provide a solder material that is suppressed in viscosity rise over time and has excellent wettability and reliability, and to provide a solder paste and a solder joint.A solder material includes: Sn or Sn-based alloy; 40-250 mass ppm...
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JP6690112B1 |
To provide a solder composition for a jet dispenser which has sufficient coatability when applied by a jet dispenser and can sufficiently suppress solder scattering and flux separation. A flux composition containing (A) a rosin-based res...
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JP6688417B2 |
An Ag electrode joint having a high joint strength can be obtained by actively minimizing the particle size of an Ag-Zn intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, which compri...
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JP6690113B1 |
To provide a solder composition for a jet dispenser which has sufficient coatability when applied by a jet dispenser and can sufficiently suppress solder scattering and flux separation. A flux containing (A) a rosin-based resin, (B) an a...
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JP6690111B1 |
To provide a solder composition for a jet dispenser which has sufficient coatability and can sufficiently suppress solder scattering when applied by a jet dispenser. A flux composition containing (A) a rosin-based resin, (B) an activator...
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JP6691304B2 |
To provide a solder material that is suppressed in viscosity rise over time and has excellent wettability and reliability, and to provide a solder paste and a solder joint.A solder material includes: Sn or Sn-based alloy; 40-250 mass ppm...
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JP6687322B2 |
The invention relates to a multi-layered plain bearing (1) comprising a sliding layer (5) made from a tin-based alloy, which contains between 1 wt. % and 8 wt. % Sb, between 8 wt. % and 20 wt. % Cu and if necessary at least one of the el...
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JP6687081B2 |
A resin multilayer substrate includes a laminate including a plurality of resin layers and an interlayer connecting conductor which extends through at least one of the plurality of resin layers and is directly exposed to an outside of th...
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JP6680992B1 |
To suppress Fe erosion of a solder bath, to have high mechanical strength of a solder joint, and to prevent short circuit of a circuit, solder powder using this solder alloy, solder paste, solder balls, solder preform, And provide solder...
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JP6681566B1 |
To provide a solder paste and a flux which are excellent in suppressing corrosion of a metal surface, have an effect of suppressing thickening, are excellent in wettability, and have a small temperature difference between a liquidus line...
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JP6683244B2 |
The joining material of the present invention is a joining material which contains a first metal powder and a second metal powder having a higher melting point than the first metal powder, in which the first metal powder is formed of Sn ...
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JP6683243B2 |
A method of manufacturing a joined body which includes arranging a joining material containing a first metal powder and a second metal powder having a higher melting point than the first metal powder between a first member and a second m...
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JP6681567B1 |
To provide a solder paste and a flux which are excellent in suppressing corrosion of a metal surface, have an effect of suppressing thickening, are excellent in wettability, and have a small temperature difference between a liquidus line...
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JP2020055038A |
To provide a solder material that is suppressed in viscosity increase over time and has excellent wettability, and to provide solder paste and solder joint.A solder material includes: Sn or Sn-based alloy; 40 to 250 mass ppm As; and 20 m...
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JP6677869B2 |
To provide solder powders suitable for a paste for solder mounted with fine pitch, and excellent in meltability and wettability at reflowing after being made to be the paste.A method for production of solder powders comprises: adding an ...
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JP6676243B1 |
To provide a solder paste having an excellent effect of suppressing thickening. A flux containing a compound represented by the following general formula (1), rosin and a solvent, As: 25 to 300 mass ppm, Pb: 0 to 5100 mass ppm, Sb: 0 to ...
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JP6677668B2 |
To provide: a lead-free solder alloy capable of making compatible the suppression of a cracking progress of a solder junction and the suppression of an electrode separation phenomenon of an electronic part due to a solder junction even i...
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JP6678704B2 |
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JP6676242B1 |
To provide a solder paste capable of achieving both a thickening suppressing effect, reliability and wettability in a well-balanced manner. The solder paste of the present invention is composed of a solder material and a flux. The solder...
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JP6676244B1 |
To provide a solder paste having an excellent effect of suppressing thickening. A compound represented by the following general formula (1), a flux containing rosin and a solvent, As: 25 to 300 mass ppm, Bi: 0 to 25000 mass ppm, Pb: 0 or...
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JP2020049543A |
To provide a solder material where the variation of mechanical characteristics is small even in an ultra-low temperature.A solder material contains 0.5-less than 2.5% Ag (wt.%, hereinafter the same), 0.3-0.5% Cu, 5.5-6.4% In, 0.5-1.4% Sb...
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JP6674120B1 |
To provide a solder paste which is less likely to change with time, has excellent wettability, has high mechanical properties, and has good fluidity and shape retention. A solder paste containing a solder powder and a flux is adopted. So...
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JP6671013B2 |
To provide a solder material or solder joint that resists yellowing and has excellent wettability.A discoloration-resistant solder material contains Sn or an Sn alloy and 40-320 mass ppm of As and has an As concentrated layer.SELECTED DR...
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JP6654613B2 |
To provide a conductive paste enabling a conductive part to be firmly bound to a ceramic substrate.The conductive paste is prepared by combining a high melting point metallic particle having a melting point higher than a firing temperatu...
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JP6649596B1 |
To provide a solder alloy, a solder powder, and a solder joint which suppress a change with time of a solder paste, have excellent wettability, have a small temperature difference between a liquidus line temperature and a solid phase lin...
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JP6649595B1 |
To suppress a change with time of a solder paste, to have excellent wettability, to have a small temperature difference between a liquidus line temperature and a solid phase line temperature, to have high mechanical properties, and to ex...
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JP6649597B1 |
To provide a solder alloy or the like which suppresses a change with time of a solder paste, has a small temperature difference between a liquidus line temperature and a solid phase line temperature, and has high reliability. The solder ...
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JP6648468B2 |
A Pb-free solder includes a first metal including at least Sn and Bi, and a second metal including at least an Ni—Fe alloy. In the first metal, the sum of Sn and Bi is 90 mass % or more, and a ratio of Bi is 5 to 15 mass %. A ratio of ...
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JP6646241B1 |
To provide a solder paste which is less likely to change with time, has excellent wettability, has high mechanical properties, has good wettability and spreadability of solder, and suppresses the occurrence of dewetting. A solder paste c...
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JP6646010B2 |
A pane having an electrical connection element, said pane having: a substrate; an electrically conductive structure in a region of the substrate; and a connection element in a region of the electrically conductive structure, the connecti...
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JP6646242B1 |
To provide a solder paste which is less likely to change with time, has excellent wettability, has high mechanical properties, has good wettability and spreadability of solder, and suppresses the occurrence of dewetting. A solder paste c...
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JP6646243B1 |
To provide a solder paste which is less likely to change with time, has excellent wettability, has high mechanical properties, and suppresses printing sagging and heating sagging. A solder paste containing a specific solder powder and fl...
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JP6643749B2 |
Provided are: a soldered joint which suppresses detachment between a back metal and a solder alloy during formation of the soldered joint, and which offers higher reliability by suppressing non-wetting of the solder alloy, splashing of m...
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JP6643693B1 |
To realize soldering with less generation of voids without impairing production efficiency and storage stability, have an effect of suppressing thickening, have excellent wettability, and have a liquidus line temperature and a solid phas...
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JP6643691B2 |
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JP6642865B2 |
The present invention suppresses fracture at an interface between different materials, and provides a solder joining which includes: a solder joining layer 10 having a melted solder material, containing Sb at more than 5.0% by mass and 1...
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JP6643744B1 |
To provide a solder paste which is less likely to change with time, has excellent wettability of molten solder, has high mechanical properties, and has an increased wetting rate of solder. A solder paste containing a specific solder powd...
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JP6643745B1 |
To provide a solder paste which is less likely to change with time such as an increase in viscosity, has excellent wettability, has high mechanical properties, and has an improved wetting speed. A solder paste containing a specific solde...
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JP6643746B1 |
To provide a solder paste which is less likely to change with time such as an increase in viscosity, has excellent wettability, has high mechanical properties, and has an improved wetting speed. A solder paste containing a specific solde...
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JP6643692B1 |
To realize soldering with less generation of voids without impairing production efficiency and storage stability, have an effect of suppressing thickening, have excellent wettability, and have a liquidus line temperature and a solid phas...
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JP2020015926A |
To provide an intermetallic compound material containing a 4d transition metal element and/or a 5d transition metal element, a method for producing the same, and a superconductor material using the same.The intermetallic compound materia...
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JP6638180B1 |
To provide a flux or the like which sufficiently improves the wettability of a solder alloy containing no Ag. A flux containing chlorendic acid and / or chlorendic anhydride for soldering a solder alloy containing 0.1 to 3.0% by weight o...
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JP6638840B1 |
To provide a flux having excellent compatibility and excellent temperature cycle reliability, and a solder paste containing the flux and a metal powder. The flux contains an acrylic resin having a number average molecular weight of 500 o...
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JP6638845B1 |
To realize soldering with less generation of voids without impairing production efficiency and storage stability, have an effect of suppressing thickening, have excellent wettability, and have a liquidus line temperature and a solid phas...
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JP6638844B1 |
To realize soldering with less generation of voids without impairing production efficiency and storage stability, have an effect of suppressing thickening, have excellent wettability, and have a liquidus line temperature and a solid phas...
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JP6638179B1 |
To provide a flux or the like which sufficiently improves the wettability of a solder alloy containing no Ag. A flux containing an acid-modified rosin for soldering a solder alloy containing 0.1 to 3.0% by weight of Cu and 0.0040 to 0.01...
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JP6638841B1 |
To provide a flux having excellent compatibility and excellent temperature cycle reliability, and a solder paste containing the flux and a metal powder. Flux is an acrylic resin having a number average molecular weight of 500 or more and...
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JP2020011294A |
To provide a solder alloy which suppresses paste change over time and is excellent in wettability, in which a temperature difference between a liquidus line temperature and a solidus line temperature is small, and which has high and exce...
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JPWO2018174065A1 |
Provided is a conductive material capable of efficiently arranging solder on an electrode and improving the wettability of the solder even when the conductive material is left for a certain period of time. The conductive material accordi...
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JP2020011301A |
To provide a solder material, a solder paste and a solder joint which cause little increase in viscosity over time and are excellent in wetting properties and reliability.The solder material comprises Sn or an Sn-based alloy, 40 to 250 m...
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