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JP2022007173A |
To provide a thermal conductivity variable material that has a relatively simple structure and can be produced relatively easily.A thermal conductivity variable material shows a two-dimensional crystal structure at a first temperature an...
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JP2022502265A |
It is a solder alloy, 40 ~ 65% by weight bismuth, 1 ~ 10% by weight indium, 0.1 ~ 5% by weight gallium, 0.1 ~ 5% by weight zinc, 0.1 ~ 2% by weight copper, 0.01 ~ At least one of 0.1% by weight alloy, 0.1-2% by weight silver, 0.005-0.05%...
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JP2021192923A |
To provide: a solder alloy which exhibits excellent pin contact performance and high bonding strength; a solder ball; and a solder joint.The solder alloy has an alloy composition that contains, in mass%, 0.8% to 1.5% of Ag, 0.1% to 1.0% ...
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JP2021192924A |
To provide: a solder alloy which exhibits excellent pin contact performance and high bonding strength; a solder ball; and a solder joint.The solder alloy has an alloy composition that contains, in mass%, 0.8% to 1.5% of Ag, 0.1% to 1.0% ...
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JP2021191622A |
To provide an antimicrobial substance having good flexibility and less likely to cause a crack in a copper-tin alloy layer even when bending processing or the like is carried out.An antimicrobial substance comprises a base material and a...
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JPWO2020158685A1 |
The Sn particles of the present invention contain 40% by mass or more of Sn and 0.55% by mass or less of oxygen (O), and have a BET specific surface area (m).2Ratio of O content (mass%) to / g) (mass% · g / m)2) Is 0.40 or less. It is a...
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JP6976029B2 |
The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering c...
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JP6974137B2 |
To provide a conductive material capable of effectively enhancing communication reliability between electrodes in a vertical direction.A conductive material according to the present invention is a conductive material containing a thermos...
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JP6976028B2 |
The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic ...
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JP6969070B2 |
To provide solder material capable of suppressing generation of electro-migration.Solder material comprises: a core 2A which is made of Cu or a Cu alloy; and a solder layer 3A which covers the core 2A. The solder layer 3A is a core ball ...
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JP6972174B2 |
A semiconductor device includes an insulating substrate formed by integrating a ceramic base plate and a cooling fin; a multiple of plate interconnection members; and a plurality of semiconductor elements. The one faces of the semiconduc...
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JP2021178336A |
To provide a solder paste which can be applied for connection of high melting point solder and has excellent heat resistance and heat cycle reliability.In a solder paste as the solder paste which includes solder powder and flux, the flux...
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JP2021178350A |
To provide a lead-free solder alloy having versatility which is excellent in a creep characteristic, and high in reliability, and solder joining, in joining of an electronic component or the like which is in a severe use environment.In a...
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JP6967726B2 |
Provided herein is a solder paste having low viscosity and easy coatability, and that provides high reinforcement for electronic components while satisfying both high room-temperature adhesion and high repairability, and forming a cured ...
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JP6956365B2 |
Provided herein are a solder paste and a mount structure having excellent repairability while maintaining high adhesion at the operating temperature of a semiconductor component. The solder paste is configured from a solder powder and a ...
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JP6959165B2 |
To provide a solder material including Sn, Sb, Cu, Ag and In and capable of reducing a variation amount between frequencies before and after sealing when using the solder material as the hermetic sealant of a crystal oscillator.An object...
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JP2021171825A |
To provide: a lead-free and antimony-free solder alloy which has a medium to low melting point and of which the soldering properties can be secured even after being retained at a high temperature for a long period; a solder ball; a ball ...
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JP6953565B2 |
A lead-free and copper-free tin alloy has 3.0-5.0 wt % (weight percentage) silver, 0.01-3.5 wt % bismuth, 0.01-3.5 wt % antimony, 0.005-0.1 wt % nickel, 0.005-0.02 wt % germanium and tin of a residual weight percentage. The lead-free and...
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JP6951438B2 |
A SnBiSb series low-temperature lead-free solder and a preparation method thereof, which belongs to the technical field of low-temperature soldering. The lead-free solder includes by weight the following composition: 32.8-56.5% of Bi, 0....
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JP6944019B2 |
To provide a slide member and a slide bearing capable of improving fatigue resistance.A base layer, a middle layer and a coating layer are laminated in a slide member in this order, the coating layer consists of Sn as a first metal eleme...
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JP6936926B1 |
To provide a solder alloy, a solder powder, a solder paste, and a solder joint which are excellent in mountability, exhibit high strength, and further excellent in heat and fatigue characteristics because the liquidus line temperature is...
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JP6938496B2 |
A novel solder alloy is provided which contains Sn, Bi and Zn, with Bi 42-62 mass%, Zn 0.2-3.6 mass%, and the remainder Sn and unavoidable impurities; this solder alloy can be used in a low temperature range.
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JP2021141119A |
To provide a composition for electromagnetic wave shield capable of forming a sintered compact for electromagnetic wave shield excellent in electromagnetic wave shield effect.A composition for electromagnetic wave shield includes: a meta...
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JP2021139014A |
To provide a metal foil useful as a sealing member of an electronic device.A multilayer metal foil comprises a first metal layer 10 and a second metal layer 20. When a thermogravimetric analysis or a mass analysis is performed, a fragmen...
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JP6934878B2 |
A method for producing a multifilament NbsSn superconducting wire comprising:- packing a plurality of Cu encased Nb rods within a matrix which is surrounded by an intervening Nb diffusion barrier and a further matrix on the other side of...
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JP6936317B2 |
The invention relates to a multi-layer sliding bearing element (1) comprising a support layer (3) and at least one sliding layer (4) having a layer thickness (14) in the radial direction which is smaller in the region of at least one of ...
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JP2021133410A |
To provide a conductive joint material and a conductive joint body having excellent heat resistance and joint strength.A conductive joint material 10 has a first metal 1, and a second metal 2 that has a higher melting point than that of ...
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JP2021524543A |
The present invention is a copper strip 1 for manufacturing electrical contacts, which has a copper or copper alloy substrate 2 and tin coatings 3 and 4, and forms insoluble precipitates in the tin coatings 3 and 4. For copper strips, th...
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JP2021130136A |
To provide a flux which enhances wettability of a solder, is excellent in temperature cycle reliability, and can suppress scattering by heating during reflow, and a solder paste using the same.A flux contains an organic acid, an acrylic ...
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JP6928294B1 |
To provide a solder paste capable of suppressing an increase in viscosity of a solder paste over time, realizing soldering with less generation of voids, and suppressing the occurrence of soft errors. According to the present invention, ...
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JP6928284B1 |
To provide a lead-free and antimony-free solder alloy, a solder ball, and a solder joint capable of improving the shear strength by making the crystal grains at the bonding interface finer and suppressing unfusion. A lead-free and antimo...
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JP6928296B1 |
To provide a solder paste capable of improving the wettability of solder, suppressing an increase in viscosity of the solder paste over time, and suppressing the occurrence of soft errors. According to the present invention, U: less than...
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JP6928295B1 |
To provide a flux capable of realizing soldering with less generation of voids, improving the wettability of solder and suppressing missing, and a solder paste using this flux. The present invention is a flux used for a solder paste, whi...
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JP6916243B2 |
To provide: a lead-free solder alloy that suppresses cracking propagation at a solder joint part even in an environment where variation in temperature is extreme and vibration is applied, and restricts voids at the solder joint part whic...
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JP2021116460A |
To provide a method for making a metal particle for efficiently producing a nano-sized metal particle having a diameter of 1 μm or smaller.A method for making a metal particle is to make a nano-sized metal particle by pouring a suspensi...
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JP6915556B2 |
Provided is a joining layer (13) of a semiconductor module (10) that is provided between an electronic component (14) and a substrate (15), and consists of a CuSn intermetallic compound. This joining layer (13) is configured such that th...
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JP6912742B1 |
To provide a lead-free and antimony-free solder alloy, a solder ball, and a solder joint capable of improving the share strength by making the crystal grains at the bonding interface finer and suppressing unfusion. Lead-free and antimony...
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JP6912519B2 |
A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.
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JP6903037B2 |
To provide a flux and a solder paste that have an improved effect of preventing a viscosity increase.A solder paste comprises a flux containing a metal deactivator, the metal deactivator containing a hydrazide nitrogen compound.SELECTED ...
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JP6898509B1 |
To provide a bonding layer structure portion capable of maintaining excellent bonding strength and mechanical strength even with severe temperature fluctuations in an extremely high temperature or extremely low temperature environment. T...
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JP6899275B2 |
To provide an inexpensive silver alloy powder that makes it possible to obtain a highly conductive film even at a relatively low firing temperature when used as a material for a firing conductive paste, and a method of producing the same...
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JP6895131B2 |
A lead-free solder has a heat resistance temperature which is high and a thermal conductive property which is not changed in a high temperature range. A semiconductor device includes a solder material containing more than 5.0% by mass an...
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JP6895800B2 |
There is provided a thermoelectric material including a compound which is formed of an element R belonging to alkaline earth metal and lanthanoid, and an element X belonging to any of Group 13 elements, Group 14 elements, and Group 15 el...
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JP2021097229A |
To provide a magnetic calorific composite material in which a decrease in thermal conductivity and a decrease in the magnetic calorific effect are suppressed, and a method for manufacturing thereof.There is provided a magnetic calorific ...
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JP6892621B1 |
To provide a nuclear material or the like which is difficult to determine a defect in a visual inspection, prevents an oxide film thickness from becoming too thick, and can suppress a bonding defect. The nuclear material includes a nucle...
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JP6892568B2 |
To provide an Sn-based solder alloy having excellent wet spreadability, bondability and high joint reliability, minor in quality variation and secular change of various characteristics, and excellent in storability.In the display of a me...
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JP6888900B2 |
This Au-Sn alloy solder paste includes an Au-Sn alloy powder that includes Sn at a level within a range of 61-70 mass%, with the remainder being Au and unavoidable impurities, and a flux. The oxygen concentration in the Au-Sn alloy powde...
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JP6889387B1 |
To provide a solder alloy or the like capable of preventing adverse effects on acoustic quality by suppressing dispersion of a compound in an alloy when a joint is remelted or a high temperature load is applied while achieving higher hea...
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JP2021086665A |
To provide a method for producing a preferred Si-containing negative electrode active material.A method for producing a negative electrode active material is provided that includes a step of mechanically mixing Si and metal M (M is selec...
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JP6879512B2 |
A sealing composition which can be handled in a semi-cured state and can obtain a sintered body having excellent joining strength and sealing performance is provided. A sealing composition including a solder powder, coated silver particl...
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