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WO/2022/196318A1 |
Provided are a production method for a textured plated steel sheet and a production device for a textured plated steel sheet that make it possible to suppress product defects resulting from the film thickness deficiency and poor appearan...
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WO/2022/195756A1 |
Provided is a feature making it possible to wash a contact member with a simple structure. In the present invention, a plating device 1000 is provided with a plating tank, a substrate holder 20, a rotary mechanism, a lifting/lowering m...
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WO/2022/189017A1 |
The disclosure relates to a distribution system (1) for a process fluid (28) for a chemical and/or electrolytic surface treatment of a substrate (4), comprising: a distribution body (3), and a substrate holder (2), wherein the substrate ...
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WO/2022/186324A1 |
The present invention correctly identifies the size and shape of a substrate in order to avoid damage to a substrate holder and wasteful disposal of a substrate. Provided is a semiconductor manufacturing device for processing a rectang...
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WO/2022/185523A1 |
Provided is a method for adjusting a plating module equipped with a substrate holder for holding a substrate, an anode disposed facing the substrate holder, and a plate that serves as a resistor and that is disposed between the substrate...
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WO/2022/184688A1 |
It is described a method of processing an etching waste medium from circuit board and/or substrate manufacture, the method comprising: i) providing a medium to be processed (11), being the etching waste medium, in particular from an etch...
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WO/2022/180332A1 |
The present invention relates to an in-line method for anodising an aluminium wire or an aluminium alloy wire, wherein the wire is continuously circulated along a processing line which comprises: - an electrical contact area, wherein the...
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WO/2022/173578A1 |
Systems and methods are proposed for controlling the electroplating of lithium metal onto negative electrodes to allow for more rapid recharging of lithium metal batteries while minimizing dendrite formation. Based on the power spectrum ...
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WO/2022/173763A1 |
A vacuum cell is described. The vacuum cell includes an inner chamber, a buffer channel, and a buffer ion pump. The buffer channel is fluidically isolated from the inner chamber and fluidically isolated from an ambient external to the va...
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WO/2022/166406A1 |
Disclosed in one embodiment of the present invention is an electroplating apparatus and an electroplating method. The electroplating apparatus comprises a plurality of blades arranged in parallel. The blades move in a direction parallel ...
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WO/2022/163866A1 |
The purpose of the present invention is to provide a method for removing an organic agent (organic additive and decomposition product thereof) from a used plating liquid by a technique that is easier and simpler, and a method for regener...
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WO/2022/165129A1 |
Methods, apparatuses, and systems for forming deposited features on workpieces are provided herein. Generally, the techniques herein employ a deposition head to define an electrical field that facilitates electrochemical deposition. Othe...
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WO/2022/157852A1 |
The present invention provides technology that makes it possible to measure the thickness of a film on a substrate during plating. This plating device 1000 comprises: a plating tank 10; a substrate holder 20; a rotation mechanism 30; a...
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WO/2022/155187A1 |
An electrochemical treatment system includes a treatment fluid supply manifold, a fluid return manifold, and an electrode section connected to the treatment fluid supply manifold, A plurality of treatment fluid supply ports feed fluid th...
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WO/2022/149257A1 |
The purpose of the present invention is to suppress or prevent a plating solution from intruding into a sealed space in a substrate holder, while detecting intrusion of the plating solution in an early stage. Provided is a substrate ho...
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WO/2022/138999A1 |
The present invention relates to a 3D printing device using selective electrochemical deposition and particularly to a 3D printing device capable of selectively depositing metal materials onto a substrate by using additive manufacturing ...
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WO/2022/137277A1 |
Provided is a technology for causing a plating solution to be stirred without using a paddle. This plating device 1000 comprises a holder cover 50 that is disposed on a substrate holder 30 and rotates with the substrate holder when the...
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WO/2022/137514A1 |
The present invention reduces the influence of shielding of the electric field by a paddle during plating. A plating apparatus for plating a substrate, said plating apparatus being provided with: a plating bath; an anode which is arran...
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WO/2022/139000A1 |
The present invention relates to a three-dimensional printing device using selective electrochemical deposition and particularly to a three-dimensional printing device capable of selectively depositing metal materials onto a substrate by...
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WO/2022/134491A1 |
Disclosed in the present invention are a device and method for preventing crystallization of a plating solution on a squeezing assembly of an electroplating apparatus in the technical field of electroplating copper film manufacturing. Th...
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WO/2022/129231A1 |
The invention relates to a method for applying a nanolaminate to a metal workpiece, wherein a coating of a nanolaminate is applied in a region exposed to a notch effect, for a example a weld seam, which nanolaminate consists of a sequenc...
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WO/2022/128482A1 |
The present application relates to a system for a surface treatment of a substrate with a fluid and a method for a surface treatment of a substrate with a fluid. The system for a surface treatment of a substrate with a fluid comprises a ...
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WO/2022/129461A1 |
The present invention relates to a process for stabilizing the electrolytic deposition of platinum from an electrolytic bath. The present invention particularly relates to a corresponding process in which the platinum electrolytic bath c...
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WO/2022/123648A1 |
Provided is technology that is capable of suppressing a degradation in wafer plating quality due to process gas retained on the bottom surface of a diaphragm. A plating apparatus 1000 comprises: a plating bath 10 in which an anode 11 i...
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WO/2022/119821A1 |
In some examples, an electroplating apparatus is provided for depositing a metal layer on a substrate. An example electroplating apparatus comprises a plating cell to receive a plating solution, an electrode, a counter electrode, a subst...
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WO/2022/116509A1 |
Disclosed are a device and method for preventing a conductive roller from being plated with copper, belonging to the technical field of the manufacturing of electroplated copper films. The conductive roller and an electroplating anode ar...
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WO/2022/117737A1 |
A method of recovering metal from a chemical bath (100) for chemically treating a structure with metal, wherein the method comprises supplying a chemical composition comprising metal from the chemical bath (100) to a membrane distillatio...
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WO/2022/112015A1 |
The disclosure relates to a distribution system (1) for a process fluid (18) and an electric current for an electrolytic surface treatment of a substrate (9), comprising a distribution body (2), a primary cathode (30), and a secondary ca...
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WO/2022/110845A1 |
Embodiments of the present application provide an electroplating method and an electroplating device. The electroplating method comprises: before a wafer is placed in an electroplating solution to perform an electroplating process on sam...
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WO/2022/107551A1 |
Provided in a jet-type plating device is a plating process that sufficiently achieves the benefits of an insoluble anode. The present invention is a plating device comprising a plating tank that has an opening, a liquid feed tube, an ins...
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WO/2022/087933A1 |
A cleaning device based on an electroplating solution in an electroplating bath (1), which belongs to the technical field of electroplating and solves the problems of a poor impurity removal effect and a low working efficiency of an exis...
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WO/2022/086881A1 |
Electroplating systems may include an electroplating chamber. The systems may also include a replenish assembly fluidly coupled with the electroplating chamber. The replenish assembly may include a first compartment housing anode materia...
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WO/2022/087487A1 |
Solution electro writing systems, solution electrowriting methods, products made by the solution electrowriting systems or methods, and uses thereof. A solution electro written product can include one or more layer(s) of fibers in a pred...
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WO/2022/080735A1 |
The present disclosure relates to a metal air filter including: a filter which is formed of a metallic material by electrodeposition and has a nano branch structure; an ionizer which conducts particles to be captured by the filter with n...
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WO/2022/081386A1 |
Electroplating systems according to embodiments of the present technology may include a plating chamber configured to deposit metal material onto substrates positioned in the plating chamber. The plating chamber may include a rotor and a...
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WO/2022/061948A1 |
The present invention relates to an insoluble anode methyl sulfonic acid coating low-lead content tin plate production method. The method comprises the following steps: step 1: an alkaline washing process section, first performing electr...
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WO/2022/059554A1 |
A surface treatment device has treatment tanks (100A, 100B) in which a treatment liquid is stored, positive electrodes (142, 152) positioned in the treatment tanks, a jig (10) for hanging and retaining a workpiece (W) and setting the wor...
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WO/2022/057703A1 |
A diamond drill bit production electroplating device, comprising a bottom plate, an outer barrel being provided on the bottom plate, and an electroplating barrel being provided within the outer barrel; a circular first rotary disc which ...
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WO/2022/055860A1 |
A method of controlling a headroom voltage of a transistor stage of an electroplating system to maintain a target power dissipation across the transistor stage may include maintaining a headroom voltage in the transistor stage for a load...
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WO/2022/039060A1 |
Provided is a plating device for producing a highly precise plating layer. This plating device (10) is provided with a plating vessel (9), cathodes (1a to 1f), a holding mechanism (2), an anode (3), and a rotation mechanism (4). In the p...
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WO/2022/036237A1 |
An electrochemical deposition system configured for electrochemical plating of a substrate includes a chamber, an electrode, a plating cup and a controller. The chamber holds a plating bath. The electrode is disposed in the plating bath....
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WO/2022/020894A1 |
The present invention relates to a method for forming a multidimensional structure, comprising: providing an electrode and a substrate in a fluid, wherein the fluid comprises an electrolyte and a precursor agent dispersed therein; applyi...
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WO/2022/009675A1 |
A flexible printed wiring board according to an aspect of the present disclosure comprises a base film and a plurality of wires that are disposed on the surface of the base film, wherein each of the wires has an end surface along the lon...
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WO/2022/007505A1 |
Disclosed in the present invention is a cleaning method used for replacing phosphating for thermal diffusion electroplated wire, where a phosphorus-free cleaning solution is used to clean a steel wire, the phosphorus-free cleaning soluti...
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WO/2022/004608A1 |
Provided is a metal formed product manufacturing method which includes an electroforming process wherein with a substrate having electrically non-conductive masks partly formed on an electrically conductive surface being immersed in an e...
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WO/2021/259528A1 |
The invention relates to a shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, use of a shield body system, and a method for a chemical and/or electrolytic surface treatment of a subs...
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WO/2021/249230A1 |
The present invention relates to the field of electroplating, and specifically relates to a coating conductive mechanism (200), a coating apparatus (100), and a coating method for a conductive film (101). The coating conductive mechanism...
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WO/2021/250203A1 |
The invention relates to a method for monitoring a surface treatment process, wherein a workpiece (1) is transported in an installation for surface treatment between treatment stations (2a-c) for the surface treatment of the workpiece (1...
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WO/2021/250206A1 |
The invention relates to a method for monitoring a surface treatment process, wherein a workpiece (1) is transported in an installation for surface treatment between treatment stations (2a-c) for the surface treatment of the workpiece (1...
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WO/2021/227762A1 |
Provided is a spreader plate in an electrochemical deposition device. The spreader plate comprises: an accommodation housing, wherein the accommodation housing comprises a first wall, a second wall arranged opposite the first wall, and a...
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