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WO/2024/123156A1 |
The present invention relates to a fabric-based anode current collector, a manufacturing method therefor, and a secondary battery comprising same, wherein the anode current collector comprises: a surface-treated fabric support; and a cop...
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WO/2024/122893A1 |
The present invention relates to a copper foil attached to a carrier foil having good peel strength under high-temperature pressing conditions. The present invention provides an ultra-thin copper foil attached to a carrier foil, comprisi...
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WO/2024/120826A1 |
The present invention relates to a method for phosphating metal surfaces, preferably alloy-galvanised steel strip surfaces, by treating them by dipping or spray-dipping with acidic, aqueous solutions which may contain magnesium ions, pho...
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WO/2024/115805A1 |
The invention relates to a method for the manufacture of a corrosion-inhibiting coating (3) for metals (1), comprising the steps of: i) diluting a surfactant (4); ii) adding a metal precursor (5); iii) reducing the metal precursor (5); i...
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WO/2024/115192A1 |
The disclosure relates to a distribution system (1) for an electrolyte and an electric current for chemical and/or electrolytic surface treatment of simultaneously at least two substrate surfaces (51) of at least two different substrates...
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WO/2024/116049A1 |
The invention relates to a device (D) and a system for electrochemical surface treatment of an inner surface of a longitudinal tubular element (T) made of electrically conductive material, the device (D) comprising: a frame assembly (1);...
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WO/2024/116940A1 |
[Problem] To provide a silver coating material which has favorable peeling resistance of a silver coating layer in a severely bent part and also has favorable durability against fine sliding wear. [Solution] This production method for a ...
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WO/2024/117706A1 |
The present invention relates to a selective electrochemical additive manufacturing (S-ECAM) printing device which can selectively deposit a metal raw material onto a substrate by using an electrochemical additive manufacturing (ECAM) me...
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WO/2024/116475A1 |
[Problem] To provide a surface-treated copper foil which has excellent anchoring effect with respect to an insulating resin base material and is capable of maintaining high adhesion to a low dielectric resin base material that has a high...
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WO/2024/109746A1 |
Pre-plated nickel battery shell steel, comprising a steel plate as a substrate, and an Fe-Ni diffusion alloy layer formed by alloying a nickel-plating layer covering a surface of the substrate and the steel plate, wherein surface iron co...
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WO/2024/111158A1 |
Provided is a surface-treated steel sheet that can be produced without using hexavalent chromium and has excellent sulfide stain resistance, excellent coating secondary adhesion, and an excellent appearance. Specifically provided is a su...
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WO/2024/111159A1 |
The present invention provides a surface-treated steel sheet which can be produced without the use of hexavalent chromium, and which has excellent adhesion with BPA-free paint. Provided is a surface-treated steel sheet comprising, on at ...
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WO/2024/111156A1 |
Provided is a surface-treated steel sheet that can be produced without using hexavalent chromium and has excellent sulfide stain resistance, excellent coating secondary adhesion, and an excellent appearance. Specifically provided is a su...
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WO/2024/111157A1 |
The present invention provides a surface-treated steel sheet which can be produced without the use of hexavalent chromium, and which has excellent adhesion with BPA-free paint. Provided is a surface-treated steel sheet comprising, on at ...
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WO/2024/111773A1 |
The present invention relates to a device for fabricating a metal layer, comprising: an electrolytic cell for accommodating an electrolytic solution to be used for plating; a cylinder mold which is provided to be partially immersed in th...
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WO/2024/107909A1 |
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set o...
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WO/2024/102557A2 |
The present disclosure relates to systems, non-transitory computer-readable media, and methods for applying controllable current to portions of an electrodeposition device via a series-in-parallel-out rectifier circuit. In particular, th...
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WO/2024/100998A1 |
The purpose of the present invention is to provide: a chromium plated component which exhibits excellent corrosion resistance even if an upper layer is composed of a trivalent chromium plating layer, while having good appearance; and a p...
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WO/2024/100999A1 |
The purpose of the present invention is to provide: a chromium-plated component which exhibits excellent corrosion resistance even when the upper layer thereof is a trivalent chromium plating layer, in which corrosion of copper or a copp...
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WO/2024/102569A1 |
Novel methods for activating and electroplating a non-conductive carbon fiber composite part are provided. An exposed surface of the CFC part is mechanically activated followed by creating a relatively thin nickel strike layer in a contr...
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WO/2024/095404A1 |
A masking jig 100 comprises: a prevention unit 110; and a support unit 160 supporting the prevention unit 110 in a manner that the prevention unit 110 can move to the shaft center direction. The prevention unit 110 has: a cylindrical par...
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WO/2024/094402A1 |
A method of forming a plating is specified, including the steps of: a) providing a first electrically conductive pattern (1) and a second electrically conductive pattern (2) electrically insulated from the first electrically conductive p...
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WO/2024/090569A1 |
The present invention provides a surface-treated steel sheet including a steel sheet and an Fe-Ni diffusion layer that is formed on at least one outermost surface of the steel sheet, wherein the ratio IB/IA of the maximum diffraction int...
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WO/2024/089029A1 |
The invention relates to a method for producing a functional structure, having the steps of: providing a main part of the functional structure; and applying at least one metal layer onto a surface of the main part, wherein the surface of...
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WO/2024/087141A1 |
The present application belongs to the technical field of automobile plastic parts electroplating. Disclosed is an electroplating device for automobile plastic parts. The electroplating device comprises an automobile plastic parts electr...
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WO/2024/089343A1 |
The invention relates to a method for forming a coating (50) on a surface of a metal substrate (10), the method (2000) comprising at least the following steps: a) depositing a hafnium layer (20), the thickness e1 of which is between 0.2 ...
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WO/2024/090570A1 |
The present invention provides an Ni-plated steel sheet which comprises a steel sheet and an Fe-Ni diffusion layer that is formed on at least one surface of the steel sheet, wherein: the average crystal grain size in the outermost surfac...
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WO/2024/082755A1 |
The present application relates to the technical field of alloy materials, and in particular, to a tin plate and a manufacturing method therefor. According to the provided manufacturing method for the tin plate, a component design of low...
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WO/2024/085554A1 |
Disclosed are a plating apparatus for manufacturing an integrated circuit (IC) chip, a plating method for manufacturing an IC chip, and an IC chip manufacturing method using same. The disclosed plating apparatus for manufacturing an IC c...
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WO/2024/081584A1 |
A copper electrolyte comprising a copper salt, a source of halide ions, and a reaction product of an amine or sulfur-containing compound with 2,3-epoxy-1-propanol for producing a nanotwinned copper deposit, optionally in combination with...
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WO/2024/077660A1 |
The present invention relates to the technical field of preparation of dividing lines for dividing semiconductor wafer rods into chips, and provides a pre-plating treatment process and apparatus for a raw material line of a semiconductor...
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WO/2024/081507A1 |
Examples are disclosed that relate to irrigating an ion exchange membrane in an electrodeposition system. In one example, the electrodeposition system comprises a fluid distribution system comprising a membrane assembly that comprises a ...
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WO/2024/075513A1 |
The present invention provides a nickel-plated aluminum member (plated member) which has improved uniformity and adhesion of plating and can be produced through a pretreatment for plating performed by a dry process. The present inventi...
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WO/2024/075698A1 |
A composite material obtained by forming, on a material, a composite film comprising a silver layer containing carbon particles, wherein the crystallite size of the silver in the composite film is greater than 40nm and no greater than 70...
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WO/2024/075533A1 |
Provided are a device for forming a metal coating and a method for forming a metal coating, the device and method making it less likely for tarnishing of a metal coating to occur. This device 1 for forming a metal coating comprises an el...
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WO/2024/070245A1 |
Provided is a surface-treated copper foil having a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The surface-treatment layer has a peak material volume Vmp of 0.010-0.080 µm3/µm2 and has a...
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WO/2024/070246A1 |
Provided is a surface-treated copper foil including a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The average depth Svk in valley parts in the surface-treated layer is 0.35 to 0.63 μm.
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WO/2024/067514A1 |
The present application relates to the technical field of photovoltaics, and discloses a solar cell electroplating device and a solar cell electroplating method. A first conductive assembly and a second conductive assembly are respective...
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WO/2024/070247A1 |
Provided is a surface-treated copper foil that has a copper foil and a surface-treated layer which has been formed on at least one surface of the copper foil. The peak material volume Vmp of the surface-treated layer is 0.022-0.060 μm3/...
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WO/2024/068704A1 |
An apparatus for electrolytically coating metal wires arranged in a web also called a 'plating section' is presented. Compared to prior art plating sections, the apparatus is provided with one or more ultrasound emission boxes that hang ...
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WO/2024/072389A1 |
A method of preparing a non-conductive substrate to allow metal plating thereon and a two-part gel coating composition. The method includes the steps of a) contacting the non- conductive substrate with a conditioner comprising: a high mo...
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WO/2024/070248A1 |
Provided is a surface-treated copper foil comprising a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The actual volume Vmc of a core portion of the surface-treated layer is 0.35 to 0.55 μｍ3...
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WO/2024/068552A1 |
Porous metal plate material and process for producing such a material. The material comprises a perforated metal base plate and an electrodeposited layer with pin-shaped protrusions on at least one side of the perforated base plate made ...
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WO/2024/062909A1 |
This terminal material comprises, in the following order, a base material which comprises copper or a copper alloy, one or more underlayers which are constituted by one or more element selected from the group consisting of Ni, Co, and Fe...
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WO/2024/053207A1 |
Provided is a steel sheet for hot pressing that has excellent rapid heating compatibility, that can prevent liquid metal embrittlement cracking, and that has excellent post-hot-pressing coating adhesion. The steel sheet for hot pressing ...
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WO/2024/051135A1 |
A method for improving a silicon-wafer cleaning effect. The method is characterized by comprising the following steps: step I, a pre-cleaned silicon wafer being put into a first feeding tank (1), wherein the silicon wafer is immersed und...
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WO/2024/046395A1 |
Embodiments of the present application provide a leveling agent, particularly a polypyridine compound. The polypyridine compound comprises a structural unit as shown in formula (I) or a protonation product of the structural unit as shown...
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WO/2024/049027A1 |
A surface-treated copper foil, which has an excellent adhesive strength with respect to a resin substrate and is suitable for application to a high frequency foil, is disclosed. The present invention provides the surface-treated copper f...
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WO/2024/042700A1 |
To measure the state of a substrate serving as an object subject to plating. This substrate state measurement device comprises: a stage constituted so as to support a substrate having a seed layer and a resist layer formed on the seed ...
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WO/2024/041062A1 |
Provided in the present invention is an electroplating process of a zinc-nickel alloy coating on the surface of a sintered neodymium-iron-boron material. By means of a multilayer electroplating method, bottom zinc is firstly electroplate...
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