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WO/2020/211591A1 |
Disclosed in the present invention is an electrically conductive film, comprising a transparent carrier layer and an electrically conductive grid. The transparent carrier layer comprises a first side face and a second side face arranged ...
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WO/2020/213572A1 |
An electronic component module (10) includes a substrate (20), a highly pyrogenic electronic component (31), a heat release member (40), and a sealing resin (50). The electronic component (31) is mounted on the substrate (20). The heat r...
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WO/2020/207181A1 |
The present invention relates to the field of electronic communications, and specifically relates to a radiated emission positioning rectification method for a multi-user unit of a passive optical network. The method comprises the follow...
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WO/2020/203942A1 |
An impedance matching membrane 10 contains a metal element and a non-metal element. The impedance matching membrane 10 has a thickness of 10-200 nm. The impedance matching membrane 10 has a sheet resistance of 200 Ω/□ or more. In the ...
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WO/2020/200946A1 |
For an electronic circuit module (1), more particularly a circuit module that is used as an inverter for an electrical machine or as a converter, comprising at least one electronics unit (4), more particularly a power electronics unit, w...
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WO/2020/203696A1 |
An electromagnetic wave suppression sheet according to the present disclosure comprises, in the following order from the outside to the inside: an electromagnetic wave transmission layer having conductivity and transparency; a suppressio...
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WO/2020/204327A1 |
According to various embodiments, an electronic apparatus may comprise: a housing which includes a front cover, a rear cover facing the opposite direction as the front cover, and a side frame surrounding the space between the front cover...
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WO/2020/204416A1 |
A complex element according to embodiments of the present invention comprises: a laminate; a capacitor part provided in the laminate; a pair of discharge electrodes arranged at least partially opposite to each other such that a discharge...
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WO/2020/203325A1 |
A cover 1a is provided with a radiowave absorber 10. The cover 1a can be disposed along a plane, and can form a three-dimensional structure T composed of a plurality of flat surfaces 5. The three-dimensional structure T includes linking ...
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WO/2020/203109A1 |
Provided stably are: a metallized film which has low electrical resistance but allows transmission of a volatile component; and an electromagnetic wave shield film using the same. Provided are: a metallized film in which a metal film wit...
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WO/2020/202939A1 |
An objective of the present invention is to provide a 5G communication antenna array demonstrating excellent heat radiation and crosstalk suppression effect. To solve the problem, this 5G communication antenna array 1 comprises: a subs...
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WO/2020/204361A1 |
The present invention relates to a composite magnetic shielding sheet capable of shielding and absorbing electromagnetic waves that may cause harmful effects on the human body or the malfunction of other electronic equipment and promptly...
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WO/2020/196356A1 |
The present invention addresses the problem of providing a λ/4 type radiowave absorber capable of maintaining higher radiowave absorbability even in a use scene subject to condensation (preferably, a use scene in which droplets produced...
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WO/2020/194109A1 |
An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the firs...
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WO/2020/196131A1 |
An electronic component module (10) is provided with: a substrate (20); an inductor element (30); a one-side functional component (42); a sealing resin (80); and an electromagnetic shield (90). The inductor element (30) is mounted on the...
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WO/2020/196169A1 |
The present invention provides an electromagnetic wave shielding film having excellent gas permeability, and excellent shielding performance of high frequency band electromagnetic waves. This electromagnetic wave shielding film 1 of th...
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WO/2020/196420A1 |
The present invention addresses the problem of providing a λ/4 type radio wave absorber that has higher bending resistance at low temperatures. The problem is solved by a λ/4 type radio wave absorber that comprises a resistive film, a ...
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WO/2020/195990A1 |
[Problem] To provide: a substituted ε-iron oxide magnetic particle powder that has another metal element substituted at a portion of the Fe sites of ε-Fe2O3 and contains a reduced amount of non-magnetic α-type iron oxide; and a produc...
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WO/2020/198593A1 |
A flexible, foldable EM barrier attenuates electromagnetic radiation by at least 20 dB from 1 GHz to 30 GHz. The barrier comprises an LF layer that blocks EM radiation at least at low frequencies, laminated to a textile support layer tha...
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WO/2020/194652A1 |
A shield case according to the present invention is provided with: a case body that covers at least a portion of a circuit pattern provided on a mounting surface of a substrate; a flange section that extends from an outer peripheral edge...
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WO/2020/196368A1 |
The present invention addresses the problem of providing a λ/4 radiowave absorber that exhibits at least a certain radiowave absorption performance from low temperature to high temperature (particularly high temperatures of 100℃ or mo...
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WO/2020/190599A1 |
A device cooling system disclosed herein includes a ventilated shield can coupled to a printed circuit board assembly. The ventilated shield can includes a first side surface with input holes and a second side surface with output holes. ...
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WO/2020/188927A1 |
A magnetoplumbite-type hexagonal ferrite powder which comprises a powder of magnetoplumbite-type hexagonal ferrite represented by formula (1) and a powder of a compound represented by formula (2) and Hα of which satisfies 19 kOe/m≤Hα...
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WO/2020/189883A1 |
According to various embodiments, an electronic device may include: a housing including a first plate, a second plate spaced apart from the first plate, and a side frame surrounding a space between the first plate and the second plate; a...
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WO/2020/189686A1 |
Provided is a shield printed wiring board comprising: a substrate film having a printed circuit, including a ground circuit, formed on a base film; an electromagnetic-wave shield film including a shield layer and an insulating layer; and...
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WO/2020/189505A1 |
An electronic instrument 10 has a first substrate 12, a second substrate 13, a third substrate 14, a first plate 15, and a second plate 16. An electronic component 21 is mounted on the first substrate 12. An electronic component 23 is mo...
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WO/2020/189350A1 |
An electromagnetic wave absorber 1a that comprises a first electromagnetic wave absorption part 10 and a second electromagnetic wave absorption part 20. At the first electromagnetic wave absorption part 10, for incidence angles of 0°–...
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WO/2020/189524A1 |
Provided is a piece of electronic equipment comprising: a first substrate and a second substrate; a first metal sheet; and a second metal sheet. The first substrate and the second substrate have electronic components mounted thereon and ...
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WO/2020/189136A1 |
An electronic instrument has: a substrate; an electromagnetic wave absorption body that covers one main surface of the substrate; an elastic member disposed in a position sandwiching the electromagnetic wave absorption body against the s...
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WO/2020/184180A1 |
This electronic component manufacturing method enables more reliably forming a shielding resin layer. This electronic component manufacturing method involves: a step in which an electronic component main body 11 is temporarily fixed on...
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WO/2020/183939A1 |
An electromagnetic shield member 20 comprises: a case 30 which has groove sections 30a, 30b for accommodating two electric wires; a cover 40 which is attached to the case 30 and covers the groove sections 30a, 30b; and pressing mechanism...
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WO/2020/183940A1 |
An electromagnetic shield member 20 comprises: a case 30 for housing a first electric wire 10a and a second electric wire 10b extending side-by-side; a cover 40 for covering the case 30; and a pressing mechanism 50 that is housed inside ...
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WO/2020/180715A1 |
Electromagnetic interference (EMI) shields and methods for broadband EMI shielding are provided. An EMI shield disposed in a path of electromagnetic radiation blocks a broad range of frequencies (> about 800 MHz to < about 90 GHz) to a s...
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WO/2020/179756A1 |
The problem of the present invention is to provide an electromagnetic wave shielding means that can easily be applied to a target and that has a broad shielding band for radio waves, and the inventor of the present invention discovered t...
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WO/2020/179349A1 |
An aspect of the present invention provides an electromagnetic wave absorption film that is less susceptible to the surrounding environment. An electromagnetic wave absorption film 10 comprising: a planar base 20; a first electromagnet...
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WO/2020/174959A1 |
Provided are: a communication device reception sensitivity measurement method whereby the reception sensitivity of a communication device can be accurately measured with good reproducibility; and a communication device noise countermeasu...
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WO/2020/175021A1 |
Provided is an electronic device-protecting device. This electronic device-protecting device is equipped with a sensing unit, a response unit and an analysis control unit. The sensing unit is configured so as to detect incident rays whic...
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WO/2020/174941A1 |
Provided are an electronic device and a substrate that can be reduced in size and cost regardless of the necessity of a shielding function. The electronic device comprises: a substrate that has a first substrate part and a second substra...
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WO/2020/171504A1 |
An electronic device for improving heat transfer is provided. The electronic device includes a housing, a display mounted on at least one surface of the housing, a battery, a supporting member disposed adjacent to a back surface of the d...
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WO/2020/169000A1 |
Provided in the present application are a shielding and packaging structure and an electronic device; the shielding and packaging structure comprises a substrate, at least two stacked first grounding layers being disposed within the subs...
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WO/2020/170608A1 |
Provided are: an electromagnetic wave-absorbing material which can be used to obtain an electromagnetic wave absorber having a broader band with the same thickness as conventional materials; and an electromagnetic wave absorber containin...
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WO/2020/171993A1 |
In one embodiment, an optical module cage includes a first opening for slidably receiving an optical module, a second opening positioned adjacent to the first opening for slidably receiving a riding heatsink separate from the optical mod...
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WO/2020/170793A1 |
An electrical junction box 10 comprises: a substrate 21 having conductive paths 23A and 23B, and having electronic components 31 and 32 mounted thereon; a first shield case 12 covering one surface of the substrate 21 and electrically con...
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WO/2020/170730A1 |
A vehicular device (1) is provided with: connectors (4 to 10) to which communication lines are connected; a shield member (13) disposed around the connectors; a heat-generating component (12) disposed near the connectors; and a heat-diss...
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WO/2020/164494A1 |
Disclosed are an anti-interference circuit board and a terminal. The circuit board specifically comprises a substrate (10), wherein the substrate (10) has a first surface, and the first surface is provided with a first area (14) for plac...
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WO/2020/166584A1 |
Provided is a heat dissipater having excellent heat-dissipating properties and capable of suppressing radiation of unwanted electromagnetic waves. A heat dissipater 1 in use is directly or indirectly thermally connected to a heat source ...
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WO/2020/164497A1 |
Embodiments of the present application provide a packaging assembly and an electronic device. The packaging assembly comprises: a substrate, a packaged device, a support, and a cover plate. The substrate comprises a first surface and a s...
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WO/2020/166628A1 |
Proposed are a circuit substrate, an antenna element, a millimeter wave absorber for incorporation in a substrate, and a method for reducing noise in a circuit substrate which make it possible to reduce noise in a circuit substrate more ...
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WO/2020/162819A1 |
A transition for an optical fibre cable (11) through a partition. The optical fibre cable (11) is received inside a shield pipe (1, 4), which shield pipe (1, 4) is of an electrically conductive material. The shield pipe (1, 4) is receive...
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WO/2020/162173A1 |
This shield member 10 is provided with: a flexible conductor 12 which is conductive and covers the outer periphery of at least one coated wire W; at least one ground conductor 20 which electrically connects the flexible conductor 12 and ...
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