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WO/2021/162326A1 |
A portable communication device is provided. A portable communication device includes a first nanofiber member having a first density, a second nanofiber member attached to the first nanofiber member and having a second density lower tha...
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WO/2021/162432A1 |
The present disclosure relates to an electronic device including a switch circuit. The electronic device according to an embodiment of the present disclosure comprises: a housing; a printed circuit board disposed inside the housing and i...
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WO/2021/162368A1 |
The present invention relates to a novel type of multifunctional composite film having heat dissipation and electromagnetic wave shielding/ absorption capabilities, and a production method therefor. More specifically, the present inventi...
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WO/2021/162209A1 |
According to various embodiments of the present disclosure, an electronic device may comprise: a housing including multiple light-transmitting regions provided on one surface thereof; a first circuit board received in the housing; a seco...
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WO/2021/157205A1 |
A power converter (1) includes a plurality of semiconductor modules (2), a smoothing capacitor (3), and a housing (5) accommodating the semiconductor modules (2) and the smoothing capacitor (3). The power converter (1) includes a conduct...
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WO/2021/157368A1 |
A module (101) comprising: a substrate (1) having a first surface (1a) and a second surface (1b) that face each other; a component (3) mounted on the first surface (1a); a sealing resin (6) that covers the first surface (1a) and the comp...
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WO/2021/157652A1 |
The present invention addresses the problem of providing a carbon fiber-reinforced composite material that, while having an electromagnetic shielding property in a high frequency band, allows electromagnetic waves in a low frequency band...
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WO/2021/157309A1 |
In order to provide a composite material and an electromagnetic wave absorber molded therefrom, whereby excellent electromagnetic wave absorption function can be exhibited, and in which a decrease in the mechanical characteristics of the...
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WO/2021/157206A1 |
A power conversion device (1) is provided with a plurality of semiconductor modules (2), a capacitor (3) connected to the semiconductor modules (2) in an energizable manner, and a control circuit board (4). The power conversion device (1...
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WO/2021/157876A1 |
A sub module is disclosed. The sub module according to an embodiment of the present invention comprises a printed circuit board connected to an IGBT in a manner capable of conducting electricity. The printed circuit board is accommodated...
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WO/2021/156095A1 |
The invention relates to a cover structure the SMC main body of which is simultaneously pressed and bonded with two additional layers in a bonding press.
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WO/2021/157835A1 |
An electronic apparatus including a heat-dissipating member according to various embodiments of the present invention comprises: a battery disposed inside the electronic apparatus; at least one FPCB disposed above the battery; a space fo...
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WO/2021/158358A1 |
In one example, a system includes a radio frequency port coupled to an external connector and a microstrip line coupled to the radio frequency port and one or more components mounted on a printed circuit board. The system further include...
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WO/2021/157901A1 |
An electronic device according to various embodiments of the present disclosure may comprise: a microphone module; and a printed circuit board on which the microphone module is disposed, wherein the printed circuit board may comprise: a ...
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WO/2021/158026A1 |
Provided is a heat dissipating apparatus for electronic elements which has the minimum size but has improved heat dissipating performance. To this end, the heat dissipating apparatus for electronic elements, according to the present inve...
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WO/2021/156094A1 |
The invention relates to a cover structure, an SMC mold and a method for producing a cover structure having an SMC main body which is pressed together with a flame-retardant coating in an SMC mold.
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WO/2021/152743A1 |
An electronic device (10) provided with: a first metal housing (1); a second metal housing (2); an electronic circuit board (3) held between the first and second housings (1, 2); and a shielding member (6) disposed at at least one of the...
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WO/2021/153995A1 |
The present invention relates to a multifunctional probe capable of shielding electromagnetic waves. More specifically, the present invention relates to a multifunctional probe capable of shielding electromagnetic waves, the probe enabli...
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WO/2021/154315A1 |
The present disclosure provides a method of protecting a component using a deliberately created impedance mismatch between conductive impedance transition elements and an electric power line. The method comprises coupling a plurality of ...
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WO/2021/153443A1 |
Provided is a vapor chamber configured so that it is possible to save space in and reduce the weight of a device in which the vapor chamber is mounted. A vapor chamber having a container in which a hollow section is formed from one pla...
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WO/2021/153692A1 |
Provided are electromagnetic wave absorbing particles containing a cesium tungsten oxide that is expressed by the general formula CsxW1-yO3-z (0.2 ≤ x ≤ 0.4, 0 < y ≤ 0.4, 0 < z ≤ 0.46) and has an orthorhombic or hexagonal crystal...
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WO/2021/152477A1 |
The present invention relates to a device suitable for neutralising the negative effects of electromagnetic radiation, wherein the device is internally provided with a grid, characterised in that the grid consists of at least two sub-gri...
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WO/2021/149393A1 |
An electronic control device comprises: a housing which is formed from a first housing that has an assembly opening and a second housing that covers the entirety of the assembly opening, and which has a communication opening that communi...
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WO/2021/149985A1 |
An electronic device comprises: a housing including a conductive member on which at least one power supply point and ground point are positioned; at least one ground member arranged inside the housing; a first ground path connecting the ...
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WO/2021/149970A1 |
The present invention provides a method for preparing a microcomposite of nickel-palladium and carbon nanotubes, the method comprising the steps of: preparing a carbon nanotube dispersion, a palladium-forming solution, and a nickel-formi...
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WO/2021/150041A1 |
An electronic device according to various embodiments of the present disclosure comprises: a printed circuit board; at least one electrical element disposed on one surface facing a first direction perpendicular to the printed circuit boa...
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WO/2021/145370A1 |
Provided is a biological information monitoring device which suppresses the impact of electromagnetic waves on a fetus and/or a pregnant woman. This biological information monitoring device is equipped with: a fabric formed so as to be w...
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WO/2021/145055A1 |
The present invention addresses the problem of providing: a magnetic paint that exhibits excellent magnetic shielding characteristics for UHF band signals and that presents no impediments to the distribution process; a magnetic sheet; an...
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WO/2021/145012A1 |
Provided is an outer shell member that is for communication equipment, and that is capable of contributing to improving design quality of metallic gloss while suppressing generation of radio shielding that affects communication. A metall...
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WO/2021/141098A1 |
Provided is a shape transfer film with an uneven shape that is capable of imparting sufficient hiding power to a transfer object by transferring a shape derived from the uneven shape to the transfer object, said shape transfer film being...
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WO/2021/141067A1 |
Provided is an electromagnetic wave shielding film that exhibits a low electrical connection resistance value and an excellent transparency even when conductive particles are blended in large amounts into a conductive adhesive layer. T...
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WO/2021/139942A1 |
The invention relates to a housing device (1) for a power electronics system (2) of a motor vehicle, comprising a first housing (3), which provides a receiving space (13) in which th power electronics system (2) can be accommodated and b...
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WO/2021/139064A1 |
Disclosed is a low sidelobe antenna. The low sidelobe antenna has a target detection direction and can form a radiation space suppressed in an opposite direction of the target detection direction. That is, the generation of a sidelobe of...
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WO/2021/140850A1 |
This module (101) comprises: a substrate (1) having a first surface (1a); at least one first component mounted on the first surface (1a); a shield member (8) mounted on the first surface (1a) to cover the first component; and a first sea...
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WO/2021/134595A1 |
Provided in the present application are an optical port shielding and fixing apparatus, an optical module and a communication device, the optical port shielding and fixing apparatus being used mounted in an optical module, and the optica...
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WO/2021/135893A1 |
A hexahedral shielding device, comprising a box-like shielding body (10), a sheet-like shielding bottom cover (20), a first connecting terminal (30), a second connecting terminal (40), and a PCB (50). The second connecting terminal (40) ...
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WO/2021/136432A1 |
Provided in the present application are a shielding assembly, a vehicle-mounted device and a communication device. The shielding assembly comprises a wave-absorbing shielding structure and an insulating heat-conducting adhesive layer, wh...
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WO/2021/137393A1 |
Disclosed is an electronic device comprising: a housing; a PCB disposed inside the housing; a first shielding part on a first surface of the PCB and including a first shielding member which has a closed shape when viewed from above the f...
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WO/2021/131663A1 |
A module (101) comprises: a substrate (1) that has a first surface (1a) and a second surface (1b); a sealing resin (6) that is disposed so as to cover the first surface (1a) and an electronic component (3a); a shielding film (8) that cov...
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WO/2021/132384A1 |
The present invention addresses the first problem of providing a method for manufacturing a conductive substrate with a low defect rate. Further, the present invention addresses the second problem of providing a conductive substrate obta...
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WO/2021/131774A1 |
A module (101) comprising a main substrate (1) having a first surface (1a); a sub-module (81) mounted on the first surface (1a); a first component (31) mounted on the first surface (1a), separately from the sub-module (81); and a first s...
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WO/2021/131420A1 |
The purpose of the present invention is to obtain a measurement system and a radio wave blocking unit that use a radio wave absorbing member, wherein the radio wave absorbing member has a light-transmissive property to transmit light whi...
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WO/2021/131962A1 |
An electromagnetic shielding member (11) that comprises a substrate (12) that has a three-dimensional shape and a conductive layer member (13) that is provided on the substrate (12) and reflects electromagnetic waves in a wavelength sele...
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WO/2021/132389A1 |
The present invention addresses a first problem of providing a conductive substrate manufacturing method that exhibits a low defective rate. In addition, the present invention addresses a second problem of providing a conductive substrat...
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WO/2021/131244A1 |
Provided is an electromagnetic wave shielding film which exhibits excellent folding resistance, and excellent connection stability to a printed circuit board when adhered to a printed circuit board and/or adhesion between a protective la...
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WO/2021/132171A1 |
A cooling structure (50) is provided with: a body (10) including a base (11) and heat-dissipating fins (13) and a protrusion (13T) which protrude from a heat-dissipating surface (12); a lid member (20) disposed so as to cover the protrus...
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WO/2021/131599A1 |
The present invention suppresses external leakage of high frequency radiation noise emitted from a noise source. An electronic control device 1 is provided with: a printed circuit board 101 which has signal grounds 104a, 104b, 104c and a...
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WO/2021/132031A1 |
One embodiment of the present disclosure provides a wire harness that makes it possible to inhibit, via a simple configuration, the radiation of electromagnetic waves from the periphery of a connection part. A wire harness (11) according...
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WO/2021/131565A1 |
The present invention provides: a multilayer body which is able to be produced by a simple method without roughening the surface of a support, while exhibiting excellent adhesion between the support and a metal layer (a metal plating lay...
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WO/2021/131775A1 |
A module (101) is provided with: a main substrate (1); a sub-module (81) that is mounted on a first surface (1a) of the main substrate (1); a first component (31) that is mounted on the first surface (1a) separately from the sub-module; ...
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