PURPOSE: To reduce the pattern wiring density of a printed circuit board and to shorten the designing and manufacturing period, by connecting a part of a part lead to the printed circuit board directly under the lead, connecting the other part to the printed circuit board at a position, which is separated from a package.

CONSTITUTION: An inner short lead part 2b of a part lead, which is protruded downward from an electronic-parts package 1 is connected and fixed to a through hole 5a of a flexible printed circuit board 5. A wiring pattern 5b, which is connected to the lead part 2b, is connected to a lead part 7 at the outer end of the circuit board 5. A long outer lead part 2a is inserted in a through hole in a printed circuit board 3 and fixed by a solder 4. Said part is further connected to the wiring pattern of the circuit board 3. The lead part 7 of the flexible circuit board 5 is inserted in a through hole at a position separated from the package main body 1, and fixed and connected to the wiring pattern of the circuit board 3. The wiring patterns of the printed circuit board, which are concentrated at the part directly under the package main body 1, are dispersed, and the low density can be implemented.