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WO/2015/172880A1 |
The present invention relates to a method for producing a piston (10, 110) for an internal combustion engine having at least two piston components (11, 18; 111, 118), wherein at least two piston components (11, 18; 111, 118) are connecte...
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WO/2015/174258A1 |
A terminal connection method that comprises: a step for positioning a conductive wire (11) and an earthing terminal (21); a step for winding a composite metal sheet (31), which comprises an Sn powder and a Cu-Ni alloy powder capable of r...
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WO/2015/151975A1 |
An aluminum alloy laminate wherein at least one lateral surface of a core material is clad with a sacrificial material. The core material contains 0.5-1.8% by mass of Mn, 0.4-1.5% by mass of Si, 0.05-1.2% by mass of Cu, while additionall...
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WO/2015/151942A1 |
Provided is an aluminium alloy laminated plate having a sacrificial material cladded to at least one side surface of a core material, wherein the core material contains specified amounts of Mn, Si, Cu, Mg, Fe, and Ti, the balance is Al a...
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WO/2015/145509A1 |
A joining device of the invention of the present application has: a unit-form device body (10) including a direct current-type power supply circuit, a control circuit, a variety of drive circuits, etc., therein; a joining head (12) for c...
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WO/2015/147684A1 |
The invention relates to construction, and specifically to welding above-ground and below-ground pipelines from high-strength pipes with controllable heat input. Use of the invention will increase the bearing capacity of pipelines man...
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WO/2015/141284A1 |
The purpose of the present invention is to provide: a small-sized lightweight semiconductor module unit which can be easily assembled, while having excellent heat dissipation performance and high rate of acceptable products; and a semico...
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WO/2015/141802A1 |
Provided are: a method that is for producing a mounting structure and that can easily produce a mounting structure in which pins and other electronic components are mounted to the same surface; a mounting jig; a device for producing a mo...
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WO/2015/122185A1 |
A plate fin heat exchanger (1) comprises a corrugated fin (3) and a tube plate (2). A plurality of convex portions (34) that are more convex than the surface of the corrugated fin are arranged in a first direction on an intermediate port...
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WO/2015/114888A1 |
A method for manufacturing a heat exchanger is provided with: a forming step for forming a heat transfer tube (30) by rolling a metal sheet (31) into a roll shape; a diameter expanding step for inserting the heat transfer tube (30) into ...
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WO/2015/115432A1 |
A quality management device for controlling a surface mounting line including a solder printing device for printing solder onto a printed substrate, a mounter for disposing an electronic component on the substrate, a first inspection dev...
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WO/2015/111424A1 |
Provided is a method for estimating carboxylic acid gas concentration allowing safe measuring in real time of the carboxylic acid gas concentration of formic acid gas or the like inside the chamber (10) of a soldering device, and a solde...
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WO/2015/111363A1 |
The objective of the present invention is to provide a joined body of dissimilar metals, in which a flared joint is formed and which have a high joint strength. The present invention is provided with a first metal member (11) having a cu...
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WO/2015/104761A1 |
Provided are: a cladded aluminium-alloy material exhibiting high corrosion resistance and high mouldability, and a production method therefor; and a heat exchanger using said cladded aluminium-alloy material, and a production method ther...
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WO/2015/104760A1 |
Provided are: an aluminium-alloy clad material exhibiting high corrosion resistance and high mouldability, and a production method therefor; and a heat exchanger using said aluminium-alloy clad material, and a production method therefor....
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WO/2015/088599A1 |
Disclosed is the semi-amorphous, ductile brazing foil with composition consisting essentially of NibalCraBbPcSidMoeFef with approximately 24 atomic percent ≤ a ≤ approximately 31 atomic percent; b ≤ approximately 3 atomic percent; ...
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WO/2015/083602A1 |
Provided is a fluid-related function device capable of inhibiting deformation of a case component or a connective member which may occur due to expansion of a fluid accumulated in a space for trapping sputter during resistance welding. A...
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WO/2015/080161A1 |
A base plate in which a member to be joined is joined to one mounting surface via a joining material, wherein the joining position of the mounting surface, to which the member to be joined is joined, is provided with a concave for joinin...
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WO/2015/069145A1 |
The invention relates to a method and a device for manufacturing a monocoque construction in the form of a single continuous casing. The casing is produced by laser build-up welding on a target with the aid of a laser working head using ...
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WO/2015/064166A1 |
Provided are a soldering device and a decomposition method with which formic acid can be processed safely and quickly, corrosion of a vacuum pump does not occur, and the exhaust speed and the degree of vacuum in the vacuum chamber can be...
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WO/2015/064143A1 |
The present invention makes it possible to separate a gas that does not contain a flux component from a gaseous mixture that contains a flux component and recover the flux component. Water vapor that is generated within a separation unit...
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WO/2015/064142A1 |
The present invention makes it possible to separate a gas that does not contain a flux component from a gaseous mixture that contains a flux component and recover the flux component. This flux recovery device is provided with: a first wa...
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WO/2015/060379A1 |
The objective of the present invention is to provide a glycol-based cleaning agent for industrial use, which has excellent ability of removing various kinds of industrial dirt such as solder pastes, flux residues and various oils adherin...
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WO/2015/029552A1 |
The present invention is a method for brazing an aluminum alloy material without using flux, characterized in having the objective of forming a joint fillet having adequate joint strength, and in being "a method for brazing in which a me...
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WO/2015/025908A1 |
An oil cooler has: a core section (1) formed by stacking core plates (5); a bottom plate (2); a second bottom plate (3); and a top plate (4), and the above-described elements are brazed within a furnace. The core plates (5) each have an ...
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WO/2015/019602A1 |
Provided is a circuit substrate having high TCT reliability and a high degree of freedom in circuit design. The present invention is provided with: a ceramic substrate; a copper circuit board provided on a first face and/or a second face...
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WO/2015/015830A1 |
A flow rate detection unit (73) indirectly detects a flow rate of a solder to be jetted from a jet nozzle (22) by detecting a flow rate of a gas to be supplied to a solder storing tank (5). A pressure instruction unit (10a) and a pressur...
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WO/2015/015837A1 |
A jet orifice (22) projects a liquid that is supplied from a liquid supply device (1). A nozzle main unit (21) has, in the interior thereof, a passageway (4) which guides the liquid to the jet orifice (22). Air inlets (23) which provide ...
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WO/2015/015767A1 |
Provided are: an aluminum-alloy clad member that has high corrosion resistance and high moldability; and a heat exchanger using same. The aluminum-alloy clad member is provided with a core and a sacrificial anode member clad onto at leas...
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WO/2015/001725A1 |
This aluminum alloy brazing sheet comprises: a core material comprising an aluminum alloy; an Al-Si brazing filler cladded to one surface of the core material; and a sacrificial anode material cladded to the other surface of the core mat...
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WO/2014/203499A1 |
The purpose of the present invention is to provide a water vapor reflow device and water vapor reflow method that use superheated water vapor and that make practical use possible. A water vapor reflow device (1) provided with a heating f...
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WO/2014/199694A1 |
The top end (36a) of a return tube (36) is joined to the bottom of a partitioning plate (31) to enclose the entire lower portion of a communicating opening (33). Thus, even when a gas is supplied to a solder reservoir (5), the gas does n...
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WO/2014/181883A1 |
A solder joint layer has a structure in which a plurality of fine granular second crystal parts (22) are deposited at a crystal grain boundary between first crystal parts (21) dispersed in a matrix. The first crystal part (21) is a plura...
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WO/2014/157339A1 |
The present invention is a drift plate configured to allow improved convenience in inspection of parts, observation of dross deposition, etc. during maintenance. The drift plate is configured so that: multiple paired structures obtained ...
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WO/2014/156845A1 |
Provided is a brazing apparatus that uniformly raises the temperature of workpieces by means of a relatively simple structure, and is capable of high-speed brazing. This brazing apparatus (SB) is sequentially provided with an anterior ch...
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WO/2014/156846A1 |
Provided is a brazing apparatus that uniformly raises the temperature of workpieces by means of a simple structure, and is capable of high-speed brazing. This brazing apparatus (SB) circulates hot nitrogen gas by convection flow inside a...
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WO/2014/157716A1 |
Provided is a printed wiring board capable of heating and melting solder in a short amount of time without heating an electronic component, and a manufacturing method for a mounting substrate using the printed wiring board. This printed ...
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WO/2014/148724A1 |
A corrugated steel pipe is disclosed. The corrugated steel pipe comprises a plurality of unit steel pipes, which are continuous in the axial direction. Each unit steel pipe comprises a first cylindrical pipe obtained by bending a first u...
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WO/2014/148634A1 |
Space-saving soldering is performed allowing high-reliability soldering at a low cost and a high yield, using a soldering apparatus (100) having: a first process part (110) for setting a component (10) having an electrode (2); a second p...
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WO/2014/142153A1 |
An Ag electrode joint having a high joint strength can be obtained by actively minimizing the particle size of an Ag-Zn intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, which compri...
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WO/2014/129258A1 |
A solder composition containing Sn and Ge, the content of both Sb and Bi being less than 0.003 wt%.
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WO/2014/115584A1 |
Provided are a superb heat-bonding device and heat-bonded-article manufacturing method wherein, when cooling a workpiece after performing heat-bonding in a vacuum, target objects that were heat-bonded can be cooled in less time than with...
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WO/2014/115512A1 |
An inner post part (22) is brazed to the joint part (23) of a tube main body part (21) by means of brazing filler material (202). A flux (300) is provided on the brazed joint surface of the joint part (23) and the inner post part (22) to...
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WO/2014/115858A1 |
Provided is a wiring substrate provided with: an electrode containing Cu or a Cu alloy; a plating film having a film containing at least Pd, formed on the electrode; and solder which is bonded by heating onto the plating film and which h...
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WO/2014/115583A1 |
Provided are a superb heat-bonding device and heat-bonded-article manufacturing method wherein, when performing a heat-bonding process in a vacuum, e.g. soldering, the temperatures of target objects being heat-bonded can be brought to a ...
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WO/2014/115699A1 |
Provided is a lead-free solder for die bonding, which has high upper temperature limit and improved wettability characteristics. A solder alloy for die bonding, which contains 0.05-3.0% by mass of antimony with the balance made up of bis...
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WO/2014/107774A1 |
The present invention relates to a method for joining a gripper (2) to a hydraulic mandrel body (1). The mandrel body (1) is preferably made of a metallic material other than the material used to make the gripper (2). According to the pr...
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WO/2014/103946A1 |
In this gas-blowing-hole array structure, which makes it possible to blow a gas at the entire surface of an object being conveyed, such as a printed circuit board or a semiconductor wafer, in concentric shapes that are substantially circ...
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WO/2014/103945A1 |
In this gas-intake-hole array structure, which makes it possible to reduce temperature fluctuations that occur while a printed circuit board, semiconductor wafer, or the like is being conveyed and also makes it possible to heat and cool ...
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WO/2014/103262A1 |
When measuring the film thickness of a coating film (25a) which is made of a flux (25) serving as a bonding paste and is formed on a transfer stage (24) of a paste transfer unit (7), the film thickness of the coating film (25a) in a tran...
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