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JP2022145055A |
To provide processing method for a metal tube by which a metal tube can be stably fixed when a groove is formed in the metal tube, thus improving productivity.A processing method for a metal tube includes: a first half-cut groove formati...
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JP7123915B2 |
A process for automated sanding of a vehicle component surface is provided and includes providing a sanding mechanism having a sanding head engaged with a housing, a rotary motor contained within the housing, the rotary motor having a dr...
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JP2022116208A |
To provide a method for automated sanding of a vehicle component surface.A method for automated sanding of a vehicle component surface includes the steps of: providing a sanding mechanism having a sanding head 12 engaged with a housing 1...
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JP2022110511A |
To provide a wafer division method capable of suppressing chipping on front and back surfaces.A wafer division method includes a holding step 1001 of holding a tape side of a wafer to a holding table, a first cutting step 1002 of cutting...
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JP2022110834A |
To provide a grinder which can accurately perform continuous rotation processing and rotation stop processing on workpiece having a large inertial moment using a motor having a small capacity.A grinder includes a storage part 40 for stor...
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JP7107005B2 |
To provide a tire processing device and a tire processing method for processing an inner surface of a tread portion uniformly.The tire processing device is used for processing an inner surface Ta of a tread portion T1 of a pneumatic tire...
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JP7103277B2 |
To provide a grinding method capable of performing OF (orientation flat) notch grinding with high accuracy when defection of a grinding surface and defection of diameter occur, in particular when silicon single crystal becomes off-center...
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JP7100864B1 |
To provide a method and an apparatus for manufacturing a semiconductor crystal wafer capable of easily and surely manufacturing a high-quality semiconductor crystal wafer. A method for manufacturing a SiC wafer, which is a semiconductor ...
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JP3238212U |
To provide a plastic bottle print peeling device which scrapes a print from a bottle surface and reproduces it in an original color in order to recycle a plastic bottle. A support 2 that is pressed from both a mouth portion 2a and a bott...
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JP7085251B1 |
To provide a grinding device capable of easily exchanging a general grindstone without using a special grindstone when grinding a groove, and capable of extremely accurately machining a groove. A rotating shaft 11 penetrating a disk-shap...
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JP7079079B2 |
To reduce the tool cost and improve the processing quality and yield of an inner peripheral surface processing device for processing an inner peripheral surface of each cylinder part of a workpiece having a plurality of cylinder parts ar...
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JP7072364B2 |
A grinding arm for grinding workpieces with an inner profile with a grinding wheel. The grinding arm has a tube-shaped base body with a longitudinal axis, in which the grinding wheel is supported at one axial end region. A first drive fo...
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JP2022075252A |
To provide a manufacturing method for a tray corresponding to a standard wafer, which enables proper processing in a processing device even if a wafer is smaller than a standard wafer corresponding to the processing device.A manufacturin...
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JP2022075461A |
To provide a continuous terminal polishing mechanism.A continuous terminal polishing mechanism comprises a lower frame 1 and an upper frame 2, a transport groove 3 is provided in the lower frame 1, a conveyor belt is installed on an inne...
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JP2022074526A |
To provide a magnetostrictive member having a high magnetostrictive constant and a parallel magnetostrictive amount and having little variation in the magnetostrictive constant and the amount of parallel magnetostriction between members,...
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JP2022075460A |
To provide a terminal detection and polishing composite machine which can realize continuous consistent processing such as detection, polishing and so on.A terminal detection and polishing composite machine comprises a lower frame 1, an ...
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JP2022064277A |
To provide a finish grinding tool which can improve productivity of a female screw member, and can ensure good property of a female screw member.A finish grinding tool 3 comprises a thread part 5 in which a thread is spirally formed on a...
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JP2022053835A |
To provide a wafer separation method capable of stably separating a wafer whose outer periphery is chamfered.Prior to forming a separation initiation point inside a wafer, the wafer is processed so that a portion of the wafer is removed ...
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JP2022050990A |
To provide an orbital plane grinder capable of griding highly accurately by measuring a dimension of a workpiece accurately.An orbital plane grinder 100 includes a grinder 108 for forming an orbital plane of a rolling element on a workpi...
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JP2022043853A |
To provide a new wafer processing method for forming a chip of a desired thickness from a wafer.A wafer processing method includes a groove forming step of forming a groove (cutting groove 141) having a depth 140 which is equal to or mor...
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JP7033627B2 |
The invention provides a polishing device and a polishing method which can eliminate deviation caused by manual operation and can expose a longitudinal cross section in a short time. The present invention is a polishing device for polish...
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JP2022029258A |
To adjust the position of a cutting blade by detecting the position of a cutting groove in a step cut.A wafer processing method includes a groove formation step of forming a first groove (first cutting groove 61) having a first width alo...
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JP7020840B2 |
A surface treatment support structure assembly for treating a contoured surface includes a support structure array formed from a plurality of base structures, each base structure being operably coupled with respect to one another and con...
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JP7019312B2 |
To improve workability in polishing a polygonal blade for cutting of a tatami facing which is removed from a tatami manufacturing machine.A polygonal blade polishing machine 1 has a slide base 5 on which cutter fitting means 9 is loaded,...
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JP7017651B2 |
Provided is a lapping technique with which it is possible to carry out lapping with a whole form processing tool through flexible adjustment of a retention orientation of a ball screw nut. This lapping jig is provided with: a jig base wh...
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JP7016329B2 |
To provide a method for manufacturing an eccentric oscillation type speed reducer in which process tolerance of a crank shaft is high, and transmission loss and oscillation can be so suppressed as to be smaller.A method for manufacturing...
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JP7002449B2 |
Provided are a quartz glass member with an increased exposure area, which has an increased exposure area to a film formation treatment gas as compared to a member having a flat surface and has the increased exposure area controlled so th...
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JP7015807B2 |
To improve accuracy in prediction of grinding quality.A grinding quality prediction device acquires information indicating transition of a power value that drives a grinding wheel and quality of a grinding object when the grinding object...
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JP7010137B2 |
To provide a single-row deep groove ball bearing capable of suppressing a falling speed of an inner ring falling from an elevator conveyor, to prevent damage of the inner ring, and a manufacturing method thereof.An inner ring 12 has an a...
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JP6997997B1 |
To provide a capillary polishing device capable of forming a tip portion of a thin capillary having a diameter of about 300 μm into a tapered shape having a considerably small tip angle without any trouble. A capillary polishing device ...
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JP6999263B2 |
To provide a method for manufacturing multiple ball screws in which wobble errors are rotationally synchronized.A manufacturing method according to one embodiment of the present invention comprises the steps of: mounting a first ball scr...
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JP6967258B2 |
By removing burrs of the pin of the card clothing used in the slicker brush, and by giving a rounded distal ends, the feeling of use and safety of the slicker brush are improved, and removal of hair after use is facilitated. The method i...
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JP6964754B2 |
In a polishing apparatus an optical connector polishing jig holds the MT ferrule provided at the connection end portion of the optical connector, the optical connector polishing jig includes: a cylinder base; a cylinder shaft held on the...
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JP6964544B2 |
In the present invention, a shaped article W is produced, the shaped article including: a plurality of blades provided around a shaft, with an interval disposed therebetween in the circumferential direction; and curved surface-shaped rec...
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JP2021171872A |
To provide a polishing device suitable of taper-polishing a rod stock comprising a raw material which is easily damaged such as a breakage, a crack, etc.A polishing device is assembled with a pair of abrasive materials 3,3 which have sym...
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JP3234577U |
To provide a gear honing machine capable of efficiently performing honing processing of a plurality of gear workpieces. A plurality of work shafts 24 for supporting a gear work W are supported on a rotatable table 23. The rotation of the...
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JP2021526980A |
The multi-tool positioning and manufacturing system moves the workpiece between a number of tools, such as grinding wheels, each performing the workpiece manufacturing operation. The system automatically, quickly, repeatably and accurate...
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JP2021142606A |
To provide a method for manufacturing raceway rings capable of shortening the time required for forming a grindstone and improving the forming accuracy of the grindstone.The method for manufacturing raceway rings comprises the steps of: ...
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JP2021137889A |
To provide a workpiece machining device and a method, which can perform grooving on a surface of a workpiece with high accuracy on the workpiece having the convex curve-shaped surface outside.A workpiece machining device (1) machines a w...
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JP2021130187A |
PURPOSE: To provide practical means with high productivity as means that performs flat-processes of an end face of a small-diameter straight pin with high efficiency and with high accuracy in length and means that performs hemisphere-fac...
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JP2021122938A |
To provide a fixture for a workpiece and an improved system and method for performing a machining operation by using the fixture.Each holder is configured to receive and secure one workpiece 200. Each holder is rotationally coupled to a ...
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JP2021109270A |
To provide a new technique for reducing occurrence of poor products by improving a processing quality, in a processing method that applies grooving processing in a specific direction to a work-piece using a cutting blade.A processing met...
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JP2021107099A |
To provide a laminate processing method by which in a laminate in which a plurality of thin plates are laminated, an open hole can be easily and certainly formed in only a prescribed thin plate.A laminate processing method for processing...
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JP6911547B2 |
To provide a method for applying high-accuracy superfinishing by one process on a surface of a groove which is formed by combining a plurality of curved face parts having circular arc cross section shapes.A grinding stone 11 is pressed a...
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JP6867759B2 |
In a method of producing a toothed workpiece having a modified surface geometry by a diagonal generating method by means of a modified tool, a tool may be used whose surface geometry comprises a modification which can be described at lea...
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JP6867277B2 |
To provide a pin polishing method by which a pin can be stably polished in a punch die to/from which a pin can be attached/detached.A pin polishing method in a punch die. The punch die comprises a lower die, plural pins, and an upper die...
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JP6861027B2 |
To improve taper accuracy of a work-piece inner surface at an inexpensive price without depending on rigidity of a grinding stone shaft in inner face grinding of a non-perfect circle.An inner surface of a work-piece is ground by rotating...
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JP6861695B2 |
A method for producing one or more bearing components along a production line, comprising honing the bearing components along the production line, cleaning the bearing components along the production line, grinding the bearing components...
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JP6855123B2 |
To provide a cutting device which does not require complicated work in correcting an end surface of a mount flange.A cutting device includes: a chuck table which holds a workpiece unit structured by supporting a workpiece by an adhesive ...
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JP6852099B2 |
A polishing device includes shape following sections opposing a workpiece with a polishing body interposed between the shape following sections and the workpiece, and each including a displaceable shaft section. At least two of the shaft...
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