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JP7126750B2 |
A cutting apparatus includes a cutting unit that cuts a workpiece included in a frame unit, an ultraviolet ray irradiation unit that irradiates the frame unit with ultraviolet rays, and a control unit. The control unit includes a process...
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JP2022123325A |
To make grinding marks of three or more grinding mechanisms provided in a grinder cross one another.A second grinding mechanism is arranged on a chuck table 50 such that a second grinding mark 452 of a wafer 5 generated by grinding with ...
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JP2022122763A |
To provide a technique for improving extensibility of a grinder.A grinder comprises a grinding block and a cleaning block. The grinding block includes: a holding part for holding a substrate; a tool driving part for driving a grinding to...
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JP7123917B2 |
A loading device for a plunge-cut grinding machine for centerless external cylindrical grinding includes a receiving frame, a support body, and a displacement actuator. The receiving frame is open in a gravitational direction and is for ...
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JP7121409B2 |
To provide a workpiece conveyance device which can supply and carry out a workpiece on a pair of rollers without being restricted in roller interval with respect to a centerless polishing device which mounts a workpiece on the pair of ro...
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JP7119567B2 |
The invention provides a grinding device having a static pressure supporting structure. In the grinding device (1), a plurality of static pressure grooves (42p) are arranged in the sliding surface ofa grinding wheel seat (42) along the r...
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JP7120778B2 |
To provide a polishing device which can polish an entire surface of a wafer uniformly.A polishing device 1 includes: a polishing head 10 having a polishing pad 30 which polishes an upper surface of a wafer W; a spindle shaft 22 which rot...
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JP7117996B2 |
To provide an aspect suppressing variation when polishing a bevel of a substrate.A transfer machine 80 transports a substrate W to a substrate adsorption holding portion 20 holding a back surface of the substrate W. The transfer machine ...
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JP2022118325A |
To provide a method capable of suppressing vibration generated in a chuck table during creep feed grinding, without providing a grinding device with a mechanism for fixing a spindle connected to the chuck table.A lower surface of a proje...
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JP2022118429A |
To provide a grinding device and a method for using the grinding device that are able to wash a wafer placing surface without obtaining a space to be newly provided.A grinding device comprises aligning means 9 comprising: a water reservo...
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JP7115850B2 |
A processing apparatus used in processing a workpiece having a device in each of a plurality of regions that includes a chuck table holding the workpiece, positioning means positioning the workpiece before grinding, resin coating means i...
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JP7114926B2 |
To provide a machine tool having a rotatable table which can automate accurate centering of a workpiece, and a processing method by the machine tool.A machine tool 10 having a rotatable table 30, includes: a table 20 or a wheel spindle s...
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JP7114176B2 |
To process a resin package substrate having warp and uneven surface after flattening the front surface side of the resin package substrate.A processing method of a resin package substrate includes: a step for pasting an adhesive tape on ...
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JP2022114176A |
To provide a grindstone holding device capable of grinding an end surface, etc., without machining a grindstone in advance corresponding to a curved shape of the end surface of an object to be ground or the like.A grindstone holding devi...
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JP2022113948A |
To provide a suction plate which can prevent damage of the suction plate at the time of drilling, and can reduce manufacturing cost, and a method for manufacturing the same.A suction plate 100 is configured to be mounted on a suction por...
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JP7111562B2 |
To provide a processing method in which a work-piece in a dome shape, constituted of brittle materials, which has a recess part therein is cut off.The processing method according to the invention, in which a work-piece 10 in a dome shape...
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JP7111604B2 |
To provide a wafer polishing device which eliminates destruction and wear of an in-table on which a wafer is mounted and a polishing head and stabilizes an operation by reducing influence on both of the in-table and a template retainer (...
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JP7111778B2 |
To provide a polishing robot device that is configured to employ a polishing unit as an end effector of a multi-joint type robot, so that the device can deal with multi-products and has higher versatility in comparison with a dedicated m...
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JP7110112B2 |
A hand-held machine tool, in particular a sanding machine, including a rod-type handle element for the user to grip and a processing head which is moveably mounted on the handle element by means of a joint assembly. The processing head h...
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JP7110426B1 |
A chamfering device capable of improving chamfering accuracy is provided. A first chamfered portion 5 and a second chamfered portion separated from each other are subjected to a chamfering process by polishing different target end portio...
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JP2022112009A |
To provide a compact, simple and effective method for adjusting a stroke of a machine based on a user's need.An adjustable stroke device 30 for a random orbital machine has a housing with a central axis and a wall defining a cavity. At l...
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JP7109769B2 |
To provide a machining device capable of realizing an appropriate movement with respect to a flat processed surface such as a vertical surface and performing the teaching efficiently.A machining device is a device for performing machinin...
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JP7110014B2 |
To form a device to the limit of the area of wafer.A processing method of a wafer having a notch becoming the mark of crystal orientation in the outer peripheral edge, and a device region where a device is formed and an outer boundary su...
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JP7108429B2 |
The present invention relates to a processing method for forming a work (W) which becomes a long piece using the surplus size of a plate-shaped object (10) having a product area (12). The purpose of the present invention is to prevent a ...
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JP7108414B2 |
To cause a table holding surface to be automatically switched to an area corresponding to a wafer size.A holding device 3 includes a suction source 39 communicating with a central suction area of a table 30 through a pipe 31; and a valve...
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JP2022108920A |
To provide a spindle device capable of reducing a load applied to a static pressure gas bearing.A spindle device includes a rotation shaft, a chuck table, a static pressure gas bearing, and a magnet coupling. The rotation shaft includes ...
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JP2022109236A |
To provide a lens support member for supporting a lens in surface machining of machining one side face in two opposite surfaces of a lens.A lens support member (100) includes a plurality of support elements (110) that are relatively mova...
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JP7106298B2 |
A chuck table includes a main part having a holding surface for holding thereon a workpiece through a dicing tape, and a frame holder disposed around the main part for holding the annular frame. The main part has a flat surface that func...
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JP2022107952A |
To provide an auxiliary device that can automatically carry an end face correction jig into a cutting device.An auxiliary device 2 that is connected to a cutting device comprises: an end face correction jig housing part 158 that houses a...
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JP2022106618A |
To provide a processing device which can drain water more strongly on a holding surface and can carry out a work-piece more reliably when carrying out the work-piece after processing, and a work-piece carrying-out method.A holding table ...
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JP2022106574A |
To provide a pad original fabric polishing device capable of highly accurately polishing a pad original fabric.The pad original fabric polishing device comprises: a rubber roll 122 formed into a cylindrical shape to rotate about a first ...
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JP7102157B2 |
The invention provides a cutting device that has a strong holding force on a working table even if the object is cut. In order to achieve the above-mentioned objective, the cutting device of the invention includes a working table (10), a...
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JP7100462B2 |
A water temperature setting method for a processing apparatus for processing a workpiece held by a holding table by rotating at a high speed a spindle with a processing tool mounted thereto and supplying processing water to the processin...
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JP7099757B1 |
To maintain high accuracy in polishing of an outer peripheral portion of a semiconductor wafer for a long period of time. A polishing apparatus 10 rotatably supports a column 17 provided with a chuck 21 for holding a semiconductor wafer ...
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JP7099886B2 |
A system includes an abrasion component (202) containing an abrasion pad (208) configured to clean a faying surface (108) of a nutplate and a shaft (210) attached to the abrasion pad (208) and configured to rotate the shaft (210) and the...
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JP2022103609A |
To efficiently cool a polishing head against heat generated during polishing.A polishing head 200 for polishing a substrate 110 held with a polished surface up comprises: a shaft 240; a flange 210 fixed to the shaft 240; and a plurality ...
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JP2022103707A |
To provide a honing machine and a machining method using the honing machine which improves machining accuracy without damaging floating function of a tool.A plurality of supporting cylinders 20a to 20d, 20a' to 20d' in which the tube sid...
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JP2022104194A |
To provide a holding jig that is able to hold a disk-like workpiece more appropriately.A disk-like holding jig that is interposed between a workpiece and a chuck table when the disk-like workpiece is held by the chuck table, includes: a ...
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JP2022102287A |
To realize a transfer machine that can stably guide a substrate to an accommodation space and suppress the generation of cleaning residue.A transfer machine that transfers a substrate between the transfer position of a transfer path of a...
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JP2022101881A |
To provide a processing method which can efficiently process two or more workpieces different in remaining amounts of processing.A processing method includes: a step formation step of forming a step corresponding to a remaining amount of...
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JP2022100939A |
To provide a workpiece processing device which can prevent a process liquid supplied from a nozzle from entering an opening provided at a base plate by providing a first drip-proof mechanism and a second drip-proof mechanism.A workpiece ...
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JP7096674B2 |
In the grinding device, water seal forming and cooling the holding table are carried out by respective mechanisms, and the problems that the device becomes large and complex should be solved. The grinder/polisher (1) comprises a wafer ho...
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JP7096063B2 |
The present invention provides a pellicle frame having a high flatness and a method for manufacturing a pellicle frame, capable of manufacturing the pellicle frame. In the method for manufacturing a pellicle frame (1), a sintered body (3...
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JP2022099716A |
To provide a grinding device which can suppress a surface opposite to a released surface of a wafer from being ground.A grinding device 1 grinds a released surface of a wafer, which is generated by being released from an SiC ingot and ha...
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JP2022099939A |
To prevent the machining of a workpiece while a wrong holding table is installed to a machining device.A holding table 20 is equipped with a holding portion that has a holding surface 24a sucking and holding a workpiece, and a frame body...
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JP2022530857A |
[Task] Alleviate the demand for the accuracy of the movements performed by the robot. A machining head (33; 33a, 33b) coupled to a support plate (51) by a support plate (51), a motor (31), a linear actuator (2), and a linear actuator (2)...
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JP7094532B2 |
To provide a double-ended grinder which, eve if areas of both end surfaces of a work-piece are different from each other, can uniformly grind the both end surfaces.A pair of turntables 13 are so located on a same axis as to be respective...
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JP7094983B2 |
An apparatus for performing chemical mechanical planarization is disclosed. The apparatus includes a support, wherein an axis of rotation extends through the support. The apparatus includes at least one elongated member including a first...
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JP2022097831A |
To provide a grinding device capable of preventing grinding of workpiece to which an inappropriate tape is stuck.A grinding device grasps a value of a thickness of a workpiece unit before carried in a chuck table after carried out from a...
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JP2022098244A |
To provide a dicing device and an inspection method of the dicing device, which can reduce labor required for the inspection.A dicing device 1 includes a holding table mechanism 10, a dicing mechanism 20, and a controller 100. The holdin...
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