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JP7099886B2 |
A system includes an abrasion component (202) containing an abrasion pad (208) configured to clean a faying surface (108) of a nutplate and a shaft (210) attached to the abrasion pad (208) and configured to rotate the shaft (210) and the...
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JP2022103609A |
To efficiently cool a polishing head against heat generated during polishing.A polishing head 200 for polishing a substrate 110 held with a polished surface up comprises: a shaft 240; a flange 210 fixed to the shaft 240; and a plurality ...
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JP2022103707A |
To provide a honing machine and a machining method using the honing machine which improves machining accuracy without damaging floating function of a tool.A plurality of supporting cylinders 20a to 20d, 20a' to 20d' in which the tube sid...
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JP2022104194A |
To provide a holding jig that is able to hold a disk-like workpiece more appropriately.A disk-like holding jig that is interposed between a workpiece and a chuck table when the disk-like workpiece is held by the chuck table, includes: a ...
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JP2022102287A |
To realize a transfer machine that can stably guide a substrate to an accommodation space and suppress the generation of cleaning residue.A transfer machine that transfers a substrate between the transfer position of a transfer path of a...
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JP2022101881A |
To provide a processing method which can efficiently process two or more workpieces different in remaining amounts of processing.A processing method includes: a step formation step of forming a step corresponding to a remaining amount of...
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JP2022100939A |
To provide a workpiece processing device which can prevent a process liquid supplied from a nozzle from entering an opening provided at a base plate by providing a first drip-proof mechanism and a second drip-proof mechanism.A workpiece ...
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JP7096674B2 |
In the grinding device, water seal forming and cooling the holding table are carried out by respective mechanisms, and the problems that the device becomes large and complex should be solved. The grinder/polisher (1) comprises a wafer ho...
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JP7096063B2 |
The present invention provides a pellicle frame having a high flatness and a method for manufacturing a pellicle frame, capable of manufacturing the pellicle frame. In the method for manufacturing a pellicle frame (1), a sintered body (3...
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JP2022099716A |
To provide a grinding device which can suppress a surface opposite to a released surface of a wafer from being ground.A grinding device 1 grinds a released surface of a wafer, which is generated by being released from an SiC ingot and ha...
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JP2022099939A |
To prevent the machining of a workpiece while a wrong holding table is installed to a machining device.A holding table 20 is equipped with a holding portion that has a holding surface 24a sucking and holding a workpiece, and a frame body...
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JP2022530857A |
[Task] Alleviate the demand for the accuracy of the movements performed by the robot. A machining head (33; 33a, 33b) coupled to a support plate (51) by a support plate (51), a motor (31), a linear actuator (2), and a linear actuator (2)...
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JP7094532B2 |
To provide a double-ended grinder which, eve if areas of both end surfaces of a work-piece are different from each other, can uniformly grind the both end surfaces.A pair of turntables 13 are so located on a same axis as to be respective...
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JP7094983B2 |
An apparatus for performing chemical mechanical planarization is disclosed. The apparatus includes a support, wherein an axis of rotation extends through the support. The apparatus includes at least one elongated member including a first...
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JP2022097831A |
To provide a grinding device capable of preventing grinding of workpiece to which an inappropriate tape is stuck.A grinding device grasps a value of a thickness of a workpiece unit before carried in a chuck table after carried out from a...
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JP2022098244A |
To provide a dicing device and an inspection method of the dicing device, which can reduce labor required for the inspection.A dicing device 1 includes a holding table mechanism 10, a dicing mechanism 20, and a controller 100. The holdin...
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JP2022097332A |
To provide a deburring machine which is less likely to get dirty, enables easy cleaning, and can prevent failure of the machine caused by accumulated chips by arranging a holding part for holding a workpiece and a processing tool for pro...
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JP2022095412A |
To easily manufacture a holding table that can be efficiently self-ground by a grinding device.A manufacturing method for a holding table comprises: a first groove forming step of forming a plurality of first grooves on front surfaces of...
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JP2022094649A |
To provide a resin composition that is easily removed after forming a protective layer, and a new processing method using the resin composition.A liquid UV curable heat release resin composition includes (meth) acrylate, a photopolymeriz...
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JP7090372B1 |
To improve the centering property of a shaft after tilting, to have smooth operation, to have accuracy, to cope with a heavy load from a small amount, to fix a tilting direction, and to wear a tilting support mechanism. We provide machin...
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JP7089456B2 |
To provide a processing device that can easily fasten a tool holder to a rotating shaft by hand without a double shear and reduce wind noise.The processing device comprises: a rotating shaft 2 having a female screw 21 formed at a tip in ...
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JP7089457B2 |
To provide a processing device that can easily fasten a tool holder to a rotating shaft by hand without a double shear and reduce wind noise.The processing device comprises: a rotating shaft 2 having a female screw 21 formed at a tip in ...
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JP7087840B2 |
To provide a grinding processing method that performs grinding processing while conveying a work piece, which can maintain processing accuracy to improve quality even if a grindstone is worn.The grinding processing method includes a conv...
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JP7086350B2 |
This production method for a plate glass comprises a transport step for transporting a plate glass G in a predetermined transport direction. In the transport step, when the plate glass G is moved from a first waiting position WP1 to a pr...
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JP2022090797A |
To provide a processing method for a wafer capable of easily removing a reinforcement part remaining in an outer peripheral part of the wafer.The present invention relates to a processing method for a wafer for processing the wafer compr...
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JP7085890B2 |
To provide a technique capable of suppressing abrupt bending of wiring or piping of which a part is fixed to a winding core and the other part is fixed to a stationary cylinder to suppress breakage of the wiring or the piping.A connectio...
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JP7083692B2 |
The present invention provides a cutting apparatus which can withdraw a wafer of a single body state as well as a frame unit after cutting to easily check machining results. The cutting apparatus comprises: a cassette arranging mechanism...
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JP7083232B2 |
To provide an automatic grinding device capable of automatically starting grinding processing by simple operation without performing teaching operation or the like by an operator.An automatic grinding device includes first detecting mean...
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JP7082505B2 |
To provide a processing device capable of being installed in a space-saving manner, and continuously performing grinding of wafers with a simple structure.A processing device includes: a plurality of zippers 22 absorbing and holding wafe...
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JP2022084209A |
To easily configure a turntable.A processing device 1 includes processing means 3 for processing workpiece 17, a turntable 5 having support tables 50 for supporting a chuck table 2, and an outer periphery for connection tool 52 and a cen...
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JP2022083672A |
To provide a SiC wafer processing method that can avoid the risk of damage or breakage to a SiC wafer.A method includes a step of arranging a protective member T1 on the surface of an SiC wafer 10, a step of holding the protective member...
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JP2022083252A |
To make it possible to perform processing along a scheduled processing line while the surface side of a workpiece having the scheduled processing line on the surface is held by a holding table.A processing device 1 includes a holding tab...
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JP2022083106A |
To allow a blade to cut an object whose cutting lines in adjacent dividing elements are set on different straight lines.A cutting device 100 that cuts an object W to be cut in which a plurality of dividing elements W1 and W2 are connecte...
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JP2022083118A |
To allow a blade to cut an object to be cut whose cutting lines in adjacent dividing elements are set on different straight lines.A cutting device 100 that cuts an object W to be cut in which a plurality of dividing elements W1 and W2 ar...
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JP2022083115A |
To allow a blade to cut an object whose cutting lines in adjacent dividing elements are set on different straight lines.A cutting device 100 that cuts an object W to be cut in which a plurality of dividing elements W1 and W2 are connecte...
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JP7079871B2 |
To provide a grinding device for dressing a ground surface of a grind stone into a curve surface, according to a desired wafer shape.A grinding device comprises: a wafer chuck 3; grinding means having a grind stone 21; and a dress unit f...
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JP2022082558A |
To propose a holder that satisfies favorable physical properties.The present invention discloses a holder for a substrate composed of fiber and resin. The holder is a substantially ring-shaped plate having an opening. The substrate is he...
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JP7079079B2 |
To reduce the tool cost and improve the processing quality and yield of an inner peripheral surface processing device for processing an inner peripheral surface of each cylinder part of a workpiece having a plurality of cylinder parts ar...
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JP7079170B2 |
To provide a grinding device which shortens a work-piece displacement time and improves production efficiency, and a grinding method with use of this grinding device.A first displacement position K1 and a second displacement position K2,...
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JP2022080925A |
To provide a cutting apparatus which can cleanse a holding surface of a chuck table without excessively increasing size of the cutting apparatus.A cutting apparatus includes a cleaning tool to cleanse a holding surface of a chuck table i...
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JP3237654U |
To provide a rust removing device for a collet for removing rust generated on an outer peripheral surface of a collet and an inner peripheral surface of a mounting hole of the collet. A collet rust removing device has an outer peripheral...
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JP7076557B2 |
This substrate processing system is equipped with a processing device for processing a substrate and a first transport device for transporting the substrate into and from the processing device, wherein the processing device is equipped w...
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JP2022079881A |
To provide a resin composition capable of suppressing stress generated internally when forming a coating layer on a plate and maintaining high productivity and a forming method for the coating layer on a plate using the resin composition...
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JP7076607B1 |
To provide a chamfering apparatus capable of improving the accuracy of chamfering. This is a chamfering apparatus 1 for performing chamfering by polishing the ends E1 and E2 of the coil spring C while conveying the coil spring C which ca...
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JP2022078505A |
To properly supply a lubricant.A machine tool includes: a headstock that rotates a workpiece; a tool that processes the workpiece; a feeder that moves the tool in a direction crossing a rotation axis of the workpiece; a rest device havin...
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JP2022078671A |
To provide a grinder configured so that a position of a shoe can be controlled in order to position a work-piece in a desired attitude, in grinding the work-piece while making the shoe support an outer peripheral surface of a journal par...
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JP7075268B2 |
An objective of the present invention is to prevent grinding fragments from being attached to a retaining surface of a chuck table retaining a wafer and prevent a lower surface of the wafer from getting dirty in a case where grinding wat...
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JP7074607B2 |
Provided is a jig for assisting the dismounting and mounting of a top ring.One embodiment provides a jig for mounting/dismounting at least a part of the top ring for holding a substrate. The jig comprises a movable plate for supporting a...
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JP7074254B1 |
To grind a sliding surface of a wide portion in a short time and to form a work space in a small space. A plurality of master jaws 10 before finishing are radiated in a radial direction so that a sliding surface 14 is located on a concen...
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JP2022077172A |
To provide a grinding device that allows omission of a process of manually removing grinding chips sticking to an annular frame.A grinding device includes: a chuck table for sucking and holding, via a protective tape, a workpiece stuck o...
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