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JP7289247B2 |
To restrain chipping of an obverse surface and a reverse surface.A manufacturing method of a chip has a member preparation step ST1 of preparing a support plate and a cover plate, a workpiece unit forming step ST2 of forming a workpiece ...
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JP2023079530A |
To provide a grinder capable of more effectively suppressing occurrence of an eccentricity and an eccentric phase in a circular part.A control device of a grinder has an eccentricity storage part, an interpolation eccentricity calculatio...
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JP2023077946A |
To provide a grinder capable of improving circularity generated at each position in an axial direction on a grinding outer peripheral surface of a circular part.A control device of a grinder has a correction amount storage part, an inter...
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JP2023076942A |
To provide a processing device and a processing method, which reduce a use amount of a liquid.A processing device 1 comprises a processing part, a first accumulation part 61, and a first supply part 62. The processing part includes: a ho...
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JP2023076933A |
To provide a vacuum device capable of sucking and holding a wrapped processed material.In a vacuum device 5, an ejector 40 generates suction force by using water as driving fluid. Therefore, even in the case where water is sucked by the ...
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JP2023076853A |
To provide a method for shaping a chuck table which can appropriately shape the whole of a holding surface compared to a conventional method.A method for shaping a chuck table includes: a first shaping step of relatively moving a chuck t...
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JP7286246B2 |
To provide a chuck table that can suppress damages caused in chips, in cutting a work-piece to form the chips.A porous chuck table 8, which suctions and supports a work-piece 1 when cutting the work-piece with a cutting blade 18b, compri...
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JP2023076058A |
To promptly detect whether presence or absence of a work-piece received in a reception region of a cassette regardless of a shape of the work-piece and a surface state of a side surface thereof.A processing device, which processes a work...
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JP2023076260A |
To provide a wafer holder with a simple structure, which is used when a warped wafer is held.A wafer holder includes a holding base which has a circular holding surface, in which an annular first groove and an annular second groove surro...
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JP7284535B1 |
The present invention reduces the work load of holding and releasing a polishing holder to and from an apparatus for polishing the end face of an optical fiber ferrule, which is repeated in each polishing process, by placing an offset ri...
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JP7283918B2 |
An objective of the present invention is to shorten waiting time of a processing device. Before the processing of all the wafers (W) accommodated in a first cassette (51) is finished, for example, an early notification setting unit (31),...
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JP7282458B2 |
To provide a holding table in which a tape can be peeled off easily.A holding table, which is used in holding a work-piece, comprises a holding member which has a front surface and a rear surface at the opposite side of the front surface...
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JP2023072880A |
To provide a technology that can suppress adhesion of grinding debris to semiconductor wafers after grinding.A semiconductor manufacturing equipment has a chuck table 2 on which a semiconductor wafer 5 is placed with the grinding surface...
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JP7278584B2 |
To provide a grinding device which has high versatility and can easily change an axial center position of a spindle.A grinding device 10 comprises: a chuck table 50 having a holding surface 51 for holding a work-piece W; a grinding part ...
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JP2023070301A |
To provide a processing device configured to enable an inclined attitude of a spindle to change, which enables the inclined attitude of the spindle to be changed with high response and with high accuracy.A control device 3 of a processin...
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JP7276048B2 |
To provide a cylinder grinding device that can accurately support a work-piece at a rotation center regardless of weight of the work-piece to secure safety in processing accuracy.A cylinder grinding device 1 comprises: a data base 391 th...
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JP2023068917A |
To make partial information included in a display image non-display when storing the display image displayed on a display unit.A processing device comprises: a chuck table which holds a workpiece; a processing unit which processes the wo...
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JP7276246B2 |
The present invention is a method for manufacturing a carrier for a double-side polishing device that has an upper surface plate and a lower surface plate with polishing cloths adhered thereto, said carrier having a carrier base material...
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JP2023069261A |
To provide a work-piece transport device and the like which can clamp a work-piece between a spindle unit (spindle mouthpiece) and a tail unit (tail mouthpiece) in the state that a central axis of the work-piece is coincident with a rota...
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JP2023068368A |
To provide a small grinding device capable of performing creep feed grinding of a plurality of work pieces to give them different thicknesses.A grinding device includes: a holding unit that holds a plurality of work pieces placed on a ho...
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JP2023067630A |
To provide a polish device which includes a small and highly efficient index mechanism and enables downsizing and improvement of productivity of the device.A polish device includes: a polishing table 2 which rotates holding a polishing c...
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JP7274278B2 |
To provide a work-piece processing system provided with an exchanger that performs exchange of a processing tool, a nozzle and a work-piece, between a processing machine and a stocker.The work-piece processing system is provided with: a ...
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JP7273610B2 |
To prevent, in a spindle unit, processing water (processing waste liquid) containing processed waste from entering a space between a spindle and a housing.A spindle unit 62 comprises: a spindle 621 on one-end side of which a mount 65 for...
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JP2023065933A |
To provide a grinding device that grinds a wafer held on a holding surface of a chuck table, which can prevent machining chips from adhering onto an upper surface of the wafer, when separating the wafer from the holding surface.The grind...
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JP2023064886A |
To create a log which is easy to utilize for a worker in the case of analysis in ex post way by suppressing data capacity of the log.The present invention relates to a processing device comprising a chuck table and a processing unit for ...
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JP7270919B2 |
To provide a processing head that can perform excellent polishing of a work-piece without causing kink and the like, in a small-amplitude vibration-type CARE device in particular.The processing head comprises: a first base plate 2 to be ...
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JP2023064318A |
To provide a measuring jig that makes it possible to easily measure a change in the height of a holding surface and a reference surface of a chuck table on a to-be-measured line by using a dial gauge without dropping a measuring element ...
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JP2023064317A |
To grind workpiece with high efficiency and high quality.A method for grinding workpiece for grinding workpiece using a grinding device including a chuck table, and a grinding unit for grinding workpiece held by the chuck table with a gr...
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JP7271619B2 |
To provide a wafer adsorption device and a CMP device capable of strongly adsorbing and holding the entire surface of a wafer.An air bag 62d expands and pushes the vicinity of the center of an adsorption member 64 downward, and therefore...
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JP7270373B2 |
A grinding apparatus and a grinding method of a composite substrate including resin, by which loading of a grinding wheel can be suppressed in grinding of a large-sized composite substrate including resin, and with which grinding can be ...
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JP2023062553A |
To provide a technique that can reduce burdens on a user who uses a processing apparatus.An exchange apparatus exchanges a holding part that is used in a processing apparatus. The processing apparatus comprises: the holding part that hol...
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JP2023061469A |
To provide a substrate treatment apparatus that can treat a substrate, while reducing deflection of the substrate caused by loads of treatment applied to the substrate such as a wafer.A substrate treatment apparatus comprises: a pluralit...
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JP2023061256A |
To enable a rotation of a spindle to be surely clocked by improving strength and durability in a lock mechanism.In a grinder 1, a tool body 1a is provided with a spindle 6 which a tip tool can be attached to and detached from, and a lock...
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JP2023060481A |
To provide a grinding device that can prevent a large difference from occurring between a thickness of a central part and a thickness of an outer edge part of a work-piece after grinding.A grinding device, which grinds a plate-like work-...
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JP7266369B2 |
To provide CMP device and method by which CMP polishing is performed for a wide variety of wafers.A polishing head 10 of a CMP device 1 comprises: a porous chuck 31 which is opposite to a top face of a wafer W; a vacuum source which supp...
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JP7265784B2 |
To provide a workpiece carrier device and the like, which enable central axes of cylindrical workpieces with various diameters and various lengths (lengths in a central-axis direction) to easily agree with a rotational axis possessed by ...
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JP7265858B2 |
To perform both buff cleaning of a substrate surface and cleaning of an edge part of the substrate, a cleaning module includes: a rotary table configured to support a circular substrate and have a diameter smaller than a diameter of the ...
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JP2023058925A |
To prevent a protective member from being brought into contact with a grindstone when the protective member is formed on a wafer, the protective member is sucked and held, and the wafer is ground and smoothed.A method for manufacturing a...
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JP2023057601A |
To provide a machine tool capable of acquiring information of a position which serves as a reference when a workpiece and a tool are relatively moved.A Z-axis motor 39 in a machine tool 1 moves a main spindle 37 in a Z direction. A Z-axi...
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JP7262902B2 |
To provide a grinding apparatus that is able to align the rotation center of a chuck table and the center of one surface of a work-piece with each other and is capable of grinding the work-piece without detaching a positioning jig.A grin...
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JP2023057458A |
To suppress falling of a substrate from a hand when the substrate is received from a top ring and to position the substrate in a prescribed seating region.The hand for holding a substrate comprises: a hand body 620; a plurality of seatin...
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JP2023057455A |
To improve accuracy in detecting that a substrate is seated.A hand for holding a substrate includes a hand main body 620 and a plurality of seating members 630 which is mounted to the hand main body 620, and on which the substrate is sea...
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JP2023516869A |
Apparatus for chemical-mechanical polishing (CMP) of substrates is described herein. The device includes an extension positioned between the retaining ring and the chuck membrane. The extension is positioned radially outward from the edg...
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JP2023057456A |
To more stably absorb compressing load applied from a top ring.A hand for holding a substrate includes a hand main body 620 and a plurality of seating members 630 which are mounted to the hand main body 620, and on which the substrate is...
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JP7258566B2 |
To provide a flat surface processing device which enables a grind stone to be attached to a spindle safely and easily.A flat surface processing device 1 includes: a suction holding mechanism which is provided at a spindle flange 26 conne...
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JP7258088B2 |
Provided are: a workpiece unit (10) that makes it possible to attach a holding member (1) to a workpiece body (1) at a suitable position and that minimizes displacement of the holding member (2) after attachment thereof; and a method for...
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JP7256685B2 |
Provided is a grinding device which appropriately transports a curved wafer including a modified layer. When the wafer (W) on a temporary placement table (61) is conveyed to a chuck table by a conveying mechanism (31), the center of the ...
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JP2023051946A |
To provide a method for manufacturing a semiconductor device which easily separates a temporarily fixed semiconductor member from a support member.A method for manufacturing a semiconductor device includes the steps of: preparing a lamin...
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JP2023052686A |
To provide a technology which properly holds a substrate according to a processing stage of the substrate.A substrate transport system includes: a transport passage in which a carrying-in part, a mount part, a carrying-out part, and proc...
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JP2023050718A |
To provide a chuck table and a processing device capable of suppressing the possibility that the direction (angle) of the chuck table is calculated at an erroneous angle.A chuck table 10 includes a holding portion 11 that holds a workpie...
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