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WO/2011/148559A1 |
Disclosed is a method for separating semiconductor wafers, wherein the wafers after being cut can be reliably separated one by one, and the wafers are not broken when the wafers are being separated. Since a separating liquid containing f...
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WO/2011/144270A1 |
Machine (100) for machining materials in blocks or slabs (200) comprising: a) a tool-holder unit (10) displaceable above an external working surface (102), in a parallel and orthogonal directions with respect to the working surface (102)...
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WO/2011/145005A1 |
A cutting device for a machine tool, suitable for mounting on the spindle support structure of a machine tool (200) for processing and cutting materials (224), incorporates sucker means (44a,b,c,d,e,f; 64a,b,c) able to cause said device ...
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WO/2011/145270A1 |
Disclosed is a drill bit which maintains dust attraction performance and has increased rigidity at a connection portion between a bit tip portion and a bit shaft portion; wherein the drill bit (1) comprises the bit tip portion (3) arrang...
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WO/2011/141543A1 |
The present invention relates to a wire sawing device (10) for producing wafers, in particular for the semiconductor and photovoltaic industry, wherein the wire sawing device (10) comprises a wire field (18) of a sawing wire (16) that ca...
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WO/2011/142464A1 |
Provided are a cutting method and a cutting device which achieve improved heating efficiency and cutting accuracy and can easily correspond to the design change of a planned cut line. Specifically provided is a cutting method for cutting...
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WO/2011/132133A1 |
The aim of the invention is to provide a solution for guiding the cutting of a piece of plasterboard, which can be rapidly implemented, and does not require any finishing step for refilling the surface of the piece of plasterboard. To th...
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WO/2011/129731A1 |
The present invention relates to a core drilling machine (100). The core drilling machine (100) includes a front housing part (102) including a protruding nose. The drilling machine (100) includes a front handle assembly (118) and an out...
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WO/2011/129751A1 |
A coupling device for coupling together a tool holder (3) with a rotatable spindle (2) of a machining machine. The coupling de- vice comprises: - a female-shaped coupling part (10) with an internally cone- shaped section (11) and a male-...
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WO/2011/129745A1 |
A machining assembly (1) comprising a drive unit (2) with a drive motor and a drive member rotatable by the drive motor, which drive member is rotatably arranged in a housing (6) of the drive unit, and a transmission unit (4) which is at...
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WO/2011/129732A1 |
According to an embodiment, a leveling aid (102) for a drilling tool (100) is disclosed. The leveling aid (102) includes a mounting means adapted to be attached to the drilling tool (100). The leveling aid (102) further includes a level ...
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WO/2011/128447A1 |
The invention relates to a device for artificially ageing stones (2), in particular concrete stones, clinker tiles and natural stones, comprising a support (1) on which the stones (2) can be placed such that a side surface (2e) of the st...
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WO/2011/129265A1 |
Disclosed is a glass sheet processing apparatus, which relatively moves a cutter (30) and a glass sheet (40), said cutter being connected to one end of an air cylinder (10) with a holder (20) therebetween, in a state wherein the cutter (...
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WO/2011/124143A1 |
A bridge cutting saw includes a trolley (1), two vertical beams (2) provided with linear guide rails (21) and fixedly connected with two sides of the trolley (1), a beam (3) walking on the linear guide rails (21) of the vertical beams, a...
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WO/2011/122144A1 |
The disclosed main roller for a wire saw has wire grooves with increased rigidity, improves cutting precision, and can improve the yield of a product. As well as maintaining the rigidity of the partitions and a high level of yield, even ...
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WO/2011/123382A1 |
The invention is directed to a wall chaser (10) for producing slots or similar recesses in masonry or the like, wherein a drive section (1) having a drive motor (2) and gear unit (3) connected on the output side and a tool section (4) ha...
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WO/2011/116827A1 |
A segmented cutting disc, in particular a diamond cutting disc, having a disc body 1 and having cutting segments 2 distributed over the circumference of the disc body 1, wherein the disc body 1 defines a central cutting plane 4, and wher...
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WO/2011/117050A2 |
The invention concerns a process for measuring and/or controlling a polishing process of an ophthalmic element (1) comprising the steps of -manufacturing at least two cavities (2, 3) on the surface of the element to be polished, the dept...
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WO/2011/118864A1 |
The present invention relates to a method for slicing an ingot that can reduce slicing time and wire consumption when slicing a synthetic corundum single-crystal ingot having an R-axis direction. According to the present invention, the m...
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WO/2011/110430A1 |
Method for machining a semiconductor wafer (11), comprising a) providing a wafer (11) which is divided off from a crystal of semiconductor material by means of a wire saw and which has a laser marking (7) and a sawing substrate (12) in t...
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WO/2011/107818A1 |
The invention relates to a method of cutting a foundation element (1 ) in the ground, characterised in that it comprises the steps of: (a) drilling at least two borings (B1, B2) in the ground around the foundation element (1 ), (b) wire ...
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WO/2011/107872A1 |
The machine (1) for the mechanical machining of plate- shaped elements, particularly tiles and slabs of ceramic material, natural stones, glass or the like, comprises: a base frame (2); forward movement means (3) for at least a plate-sha...
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WO/2011/106203A2 |
A method for spalling a layer from an ingot of a semiconductor substrate includes forming a metal layer on the ingot of the semiconductor substrate, wherein a tensile stress in the metal layer is configured to cause a fracture in the ing...
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WO/2011/105930A1 |
The invention relates to the field of mining and processing various hard materials by cutting. The technical result is an increase in the service life of the working member and a reduction in the energy intensity of the cutting process. ...
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WO/2011/105655A1 |
The present invention relates to an apparatus for dismantling a structure using a wire saw and a dust collector, and more particularly, to an apparatus for dismantling a structure using a three-dimensional bead and a cyclone dust collect...
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WO/2011/104097A1 |
A method for producing a plurality of optoelectronic semiconductor chips is specified, comprising at least the following method steps: a) providing a carrier wafer (1) having a first surface (11) and a second surface (12) lying opposite ...
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WO/2011/105450A1 |
Provided is a method for designing a resin-coated saw wire such that when a workpiece is cut off using a resin-coated saw wire formed by coating the surface of a steel wire with resin, the depth of a machining-altered layer is shallow, a...
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WO/2011/105339A1 |
Provided is a base wire that is used as a coated saw wire having an organic film on the surface, wherein the base wire is able to minimize the peeling of the organic film. Furthermore, the base wire for the coated saw wire provides the c...
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WO/2011/096619A1 |
The present invention relates to a wire saw with 3D-shaped beads. More particularly, the wire saw includes: a wire; first beads inserted on the wire and formed curvedly; second beads inserted on the wire to be adjacent to the first beads...
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WO/2011/095664A1 |
The invention relates to the sawing of granite, to a demonstration and to improvements, consisting of a method of demonstrating the improvements to the sawing of granite to the potential users in their own factory. Said method is charact...
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WO/2011/096018A1 |
Provided is a method of cutting a workpiece efficiently and with high accuracy in such a way that by using tension adjusting devices, only the tension in the portion of the wire on the winding side is effectively reduced, said tension ad...
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WO/2011/096388A1 |
Provided is a breaking method by which an end surface strength can be stronger. A method for breaking a brittle material substrate comprises a step for forming a scribe line on the brittle material substrate, and a breaking step for brea...
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WO/2011/096019A1 |
Provided is a wire saw which uses a cutting wire to cut a workpiece, this wire saw being such that wire tension can be adjusted with high responsiveness. The wire saw has first and second workpiece cutting sections (1A, 1B). The workpiec...
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WO/2011/093482A1 |
Provided is a method for producing a member having a bottomed hole wherein a two-point supported cutting wire is used to form a hollowed out bottom portion, so that yield of a material is good, durability as a cutting blade can be increa...
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WO/2011/091650A1 |
A laser marking dust-removal device (100) includes a process unit (1), a dust suction unit (2), a first filter unit (3), a high-pressure exhauster (4), and a number of electrostatic dust-removal rods (8). The process unit comprises an in...
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WO/2011/089739A1 |
Provided are a tool wherein a super-hard tip, such as a cemented carbide tip, is fixed to a steel base, and which is suitable for use primarily for purposes such as opening a taphole; and a practical method of fixing the super-hard tip i...
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WO/2011/089610A2 |
This invention relates to circular chain saws and more particularly to improved circular chain saws for cutting hard materials such as concrete and reinforced concrete, bricks, stone and building materials, including chains that can be r...
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WO/2011/086170A1 |
In a method for providing wafers, in which a material block (11) sawed into wafers (22) is cleaned by means of a cutting suspension based on a suspending agent (17), good cleaning can be achieved, wherein the problems of "sticking" are s...
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WO/2011/086403A1 |
A pulley tire (450) is provided, for a pulley of a wire saw device having a wire forming a wire web, the pulley (700) comprising a wheel (410) and the tire (450). The tire (450) is essentially ring- shaped about an axis and has: a wire g...
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WO/2011/086736A1 |
A cutting machine configured in such a manner that, even if the depth to which the rotating blade cuts into a material to be cut is changed, the dust collection efficiency does not deteriorate. A cutting machine (1) configured in such a ...
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WO/2011/083203A1 |
The invention relates to a portable apparatus for cutting tiles (5) or the like. The cutting apparatus comprises a housing part (20), inside which there is fitted a carriage part (6), which is arranged to be moved in a power-driven manne...
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WO/2011/080581A1 |
Machine tool (10) for cutting stone materials, comprising an apparatus for opening one end of the rotational shafts (14a, 15a) of the roller (14) and the pulleys (15), said apparatus comprising a pair of frames (110) each of which is fix...
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WO/2011/081533A1 |
There is provided a method for cutting a block (13) of silicon into a multiplicity of wafers, by movement of a planar array (11) of parallel fast moving wires relative to the block (13) (or vice versa) in a direction perpendicular to the...
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WO/2011/081532A1 |
Process for cutting a block of material 12 into a multiplicity of wafers by movement of a planar array of parallel fast moving wires 14 relative to the block (or vice versa) in a direction perpendicular to the plane of the wires and appl...
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WO/2011/080009A1 |
The invention relates to a rock drilling tool comprising a drilling head provided with a cutting body (3), and a helix arranged between the drilling head and a shaft, the cutting body (3) extending continuously over a nominal diameter of...
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WO/2011/077559A1 |
Provided is a process for working rock by a laser, which is capable of achieving remarkably high working efficiency, a reduction in working time, and a reduction in working energy. By applying a laser (13) having a wavelength of 1.2 μm ...
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WO/2011/075020A1 |
A tool unit (3) for a cutting or sawing machine with a tool carrier (103) enabling especially deep cuts, comprises a first tool (1) and a second part (2, 50). The first tool (1) comprises a disk shaped cutting blade (10) and a first blad...
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WO/2011/074026A1 |
A diamond wire machine for cutting natural or artificial stone, comprising: water distribution system (12) for cooling within the cut made by the diamond wire in the stone; at least one closed loop diamond wire (3) which, following a clo...
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WO/2011/070410A1 |
A motor (100) that includes a stator (20) and a rotor (10) disposed inside the stator (20) and a cleft magnet (30) is disposed within the rotor (10), the motor (100) characterized in that a notch (31) is formed in an outer lateral face (...
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WO/2011/070386A1 |
A wire monitoring device for a wire saw device, a wire saw device and a method of monitoring a wire saw device are described. The wire monitoring device includes at least two sensors, adapted to provide a change of a sensor output signal...
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