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WO/2013/082830A1 |
A cutting device and method for a glass substrate. The cutting device for a glass substrate includes a laser emitting device (20, 60) and a cutting device (30, 70). The laser emitting device (20, 60) emits a laser beam onto the surface o...
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WO/2013/079683A1 |
Systems (100) and methods are disclosed for controlling the surface profiles of wafers cut in a wire saw machine (103). The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an in...
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WO/2013/082107A1 |
Disclosed is a method of separating a glass sheet from a moving glass ribbon, wherein the glass ribbon comprises thickened bead portions. The method comprises weakening the bead portions of the ribbon using laser-initiated ablation at th...
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WO/2013/076403A1 |
The invention relates to a method for obtaining an ophthalmic lens, said method comprising: - the step of selecting a material that displays a threshold of pinhole formation during a machining step of a finished surface (20) in a materia...
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WO/2013/076905A1 |
The invention is a band saw cutting device that cuts an ingot by guiding a circularly driven blade using static pressure pads while propelling the blade downward relative to the ingot from above same. The band saw cutting device is chara...
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WO/2013/076166A1 |
The invention relates to a processing apparatus for processing an upper segment edge (8) of a tower segment of a concrete tower (102) in order to prepare the tower segment for the attachment of at least one further tower segment. Accordi...
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WO/2013/076319A1 |
The invention relates to the use of sodium bentonite as a fluid bed that supports the grit and debris resulting from sawing. The invention also relates to the use of vibrating tables for separating the debris resulting from bentonite saw...
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WO/2013/072419A1 |
The invention relates to a method for connecting functional elements (14) to a shaft (10), having the following steps: (a) forming elevations (12) for receiving the functional elements (14), said elevations (12) being machined out of the...
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WO/2013/073477A1 |
A glass plate cleaving device (100) according to the present invention is provided with a cleaving member (10) that applies a force to the principal surface (Ga) of a glass plate (G) which has the principal surface (Ga) and a principal s...
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WO/2013/072761A1 |
A saw system (100) in one embodiment includes a base (102) including a rail system (110), a table (140) positionable on the rail system (110) and including a work piece support surface (142) defining a support plane, and a roller system ...
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WO/2013/068152A1 |
The invention relates to a stone chisel (2) and to a method for producing a stone chisel (2). The stone chisel (2) comprises a shaft (3) and a head (5), said head (5) comprising a core (4) and a coating. The shaft (3) and the core (4) ar...
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WO/2013/069175A1 |
A method of manufacturing a cut-out sintered ceramic sheet for quickly processing a sintered ceramic sheet into a complicated shape, and a cut-out sintered ceramic sheet manufactured by the above method are provided. A method of manufact...
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WO/2013/064321A1 |
A method for the residue-free removal of mineral building materials, in particular for the cutting or drilling of mineral building materials, comprising the following steps: a laser beam is applied to a workpiece of a mineral building ma...
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WO/2013/060491A1 |
The invention relates to a drill (1) having a shaft (4) along an axis (2) between a drill head (3) and an insertion end (5). The shaft (4) is provided with at least two first grooves (34) extending along the axis (2) and at least one sec...
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WO/2013/060042A1 |
Disclosed are an LCD panel cutting chip suction and removal apparatus and a chip collection apparatus for a cutting mechanism. The chip collection apparatus comprises a collection hood (41) located to the rear of the direction of travel ...
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WO/2013/061519A1 |
The present invention is a slurry manufacturing method whereby a slurry is manufactured by re-pulverizing with a jet mill all or a portion of abrasive grains which have been pulverized with either a roller mill or a ball mill to achieve ...
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WO/2013/061695A1 |
Provided are: a water-soluble cutting fluid for a fixed abrasive grain wire saw, causing little foaming and attaining high cutting performance; a cutting method using the same; and a recycling method therefor. A water-soluble cutting flu...
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WO/2013/058201A1 |
[Problem] To provide a glass cutting device capable of cutting a glass substrate even when the force applied in the direction of the thickness of a glass substrate is relatively weak. [Solution] A glass substrate cutting device (100) acc...
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WO/2013/057091A1 |
Device for the artificial ageing of stones with at least an ageing channel (3) arranged on a support (1), a vibration device (5) to set the support (1) in motion, and a conveying device (8) t o move the stone (2) through the ageing chann...
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WO/2013/053545A1 |
The invention relates to a hammer core bit (1) for the rotary or rotary percussive drilling of reinforced concrete or other reinforced materials or stone materials, comprising a clamping shaft (2), a drill sleeve (3) having a drill sleev...
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WO/2013/050352A1 |
The invention relates to a method for performing at least one mechanical operation on a structure (10) comprising at least one first layer (12) stacked on top of at least one second layer (14), said first layer being formed by at least o...
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WO/2013/051183A1 |
The present invention is a workpiece cutting method having a wire wound around a plurality of grooved rollers and moving reciprocatingly in the axial direction, the wire supplying a slurry whilst a workpiece is pushed downward relative t...
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WO/2013/052350A1 |
Systems and methods are disclosed for connecting an ingot (102) to a wire saw (103) with an ingot holder (110), a bond beam (130), and a bar (150). The bar (150) has an angled mating surface (160) that engages a recessed surface (140) fo...
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WO/2013/047678A1 |
The present invention is equipped with: a fine division step wherein a cutting or grinding device (1) equipped with a fixed abrasive grain wire (2) to which abrasive grains are adhered, a support unit (8) that supports an material (10) t...
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WO/2013/041140A1 |
A method of cutting a semiconductor workpiece with a wire saw is described. The method includes applying a tension of at least 150 newtons to a wire (10); moving the wire (10) substantially along its length; and contacting the wire to th...
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WO/2013/041886A1 |
A composition which effervesces when added to water, comprises diamond particles with a median equivalent volumetric diameter (Dv50) of less than 40 μm. The compositions are useful as cleaning compositions, particularly for cleaning dia...
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WO/2013/042055A1 |
The invention relates to a sacrificial substrate (1) having a mounting surface (2) for holding a piece of material (3), such as an ingot, brick or core, for cutting a plurality of wafers from the piece of material (3), wherein the sacrif...
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WO/2013/039162A1 |
In the present invention, when forming modified spots in a workpiece with said spots exposed to the surface upon which laser light is incident, the aberration of said laser light is corrected such that the focal point of the laser light ...
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WO/2013/038059A1 |
The invention relates to a tool for a breaking hammer, a breaking hammer, and the use of a breaking hammer. The breaking hammer comprises a percussion device (5), the percussion piston (9) of which provides impacts to the tool (6) for br...
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WO/2013/039150A1 |
In the present invention, laser light is focused onto a quartz-crystal workpiece from the top surface thereof so as to form a modified region along a planned-cut line near the roughened bottom surface of the workpiece, thereby preventing...
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WO/2013/039006A1 |
In the present invention, laser light (L) is focused onto a quartz-crystal workpiece (1) such that a modified region (7) containing a plurality of modified spots (S) is formed in the workpiece (1) along a planned-cut line (5). To do so, ...
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WO/2013/036977A1 |
In order to produce a edge cutout (3), in particular a edge cutout (3) in the shape of a segment of a circle (3) in a glass pane (2), a cutting tool having a small cutting wheel (13) is used to produce a circular arc-shaped score line (1...
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WO/2013/039012A1 |
In the present invention, laser light (L) is focused onto a quartz-crystal workpiece (1) such that a modified region (7) containing a plurality of modified spots (S) is formed in the workpiece (1) along a planned-cut line (5). To do so, ...
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WO/2013/035373A1 |
In a method for producing a III-nitride crystal substrate according to the present invention, a saw wire (22) which comprises a steel wire having a carbon concentration of 0.90 to 0.95 mass%, a silicon concentration of 0.12 to 0.32 mass%...
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WO/2013/032374A1 |
A guide and control assembly of a battery driven portable handheld power tool (1) is provided, which guide and control assembly (10) comprises a main handle (20) of the tool, arranged to be gripped by a hand of an operator, in an operati...
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WO/2013/032372A1 |
A portable handheld power tool is provided, the power tool comprising a housing (10), an electric motor (11) accommodated in the housing (10), a battery pack (12) detachably connected to the housing, and a cooling fan (14) accommodated i...
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WO/2013/031778A1 |
The present invention relates to a cutting method for a reinforced glass plate (10). The reinforced glass plate (10), which has a front surface layer (13) and a back surface layer (15) having residual compressive stress and also has an i...
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WO/2013/027880A1 |
The present invention enables the sequential cutting, chamfering, and grinding of both side surfaces of a silicon ingot in order to achieve the objectives of improving the workability of the ingot and rationalizing the processing degree ...
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WO/2013/026594A1 |
The invention relates to a drill bit (1), in particular a ferroconcrete drill bit for rotary or rotary percussion drilling of ferroconcrete or other reinforced materials, wherein the drill bit (1) comprises a clamping shank (2), a drill ...
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WO/2013/029063A1 |
The invention provides an attachment (40) for a power tool (10) for use in cutting grooves in masonry, the attachment (40) comprising an elongated nose (14), with a shaft (16) locatabie through its front end, and including a pair of rota...
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WO/2013/027702A1 |
A wire (12) is passed multiple times around working rollers (11). A gripping mechanism (13) and a depression mechanism (25) are provided above the region through which the wire (12) is passed. The gripping mechanism (13) elastically grip...
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WO/2013/023945A1 |
The invention relates to an aqueous cutting solution, containing 80 to 99.5 wt% of water, 0.1 to 20 wt% of at least one glycol compound, and optionally one or more compounds selected from the group comprising pH-regulating compounds, sol...
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WO/2013/024900A1 |
The present invention provides a resin-coated saw wire that, when cutting a workpiece using the saw wire, has a shallow depth of the work-affected layer and can obtain a cut body having a smooth surface. The resin-coated saw wire, which ...
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WO/2013/024424A1 |
A drill bit for boring an undercut hole comprising a shaft, with at least one cutting edge on one end. The shaft of the bit further comprising a bearing surface located eccentrically to the shaft axis. During drilling the bit can produce...
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WO/2013/021327A1 |
A machine (12) for cutting blocks of stone material (14) into slabs by means of cutting wires (16) comprises a frame (22) on which the following are rotatablv mounted: a set of driving pulleys (18) suitable for rotation by first motor me...
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WO/2013/021945A1 |
The purpose of the present invention is to provide an acrylic adhesive composition for temporary fixing, which is suitable for suppressing chipping of a silicon wafer when the silicon wafer is processed from a silicon block. This adhesiv...
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WO/2013/018534A1 |
A method for manufacturing a group-III nitride crystal substrate of the present invention comprises a first step (S1) for preparing a group-III nitride crystal, and a second step (S2) for manufacturing a group-III nitride crystal substra...
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WO/2013/018556A1 |
The wire saw is provided with: multiple processing rollers (11A, 11B) across which the wire (12) for processing the workpiece is suspended; supply side bobbins (13A, 13B) that rotate to supply the wire (12) between the processing rollers...
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WO/2013/016818A1 |
A coloring system and a manufacturing process for coloring artificial covering stones are provided. A board layout represents a board of artificial covering stones. Several natural stone color patterns are provided, each being different ...
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WO/2013/013322A1 |
A saw-blade comprises a disc and a plurality of tooth holders. The saw blade disc has a plurality of receiving stations with at least one recess with an indentation extending tangentially from a radially inner leading edge portion thereo...
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