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WO/2014/000003A1 |
The invention relates to a cable saw (1) comprising a sawing device (2). Said sawing device (2) comprises a saw cable (3) provided, in particular with diamond sections, and a guide device for the saw cable (3) which can be driven by a dr...
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WO/2014/000005A1 |
The invention relates to a cable saw for extracting, for example, a block of stone from a mountain, comprising a sawing unit comprising a saw cable (1) which is provided with, in particular, diamond sections, and a guide device for the s...
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WO/2014/001428A2 |
The present invention relates to a crushing machine pulverizing the asphalt layer (RAP), which is desired to be recycled by being removed from the place thereof, in order to transform the RAP into recycled asphalt concrete (RAC).
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WO/2014/003157A1 |
An aqueous processing liquid to be used when cutting a fragile material with a wire saw incorporates a water-soluble polymer, and is characterized in that the mass average molecular weight of the water-soluble polymer is 3×103 to 6×105...
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WO/2014/000004A1 |
The invention relates to a device for quarrying solid workpieces such as stone or concrete foundations, comprising a milling cutter (1) with a milling head (7) and which can be driven by a drive cable (9) provided with diamond segments a...
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WO/2013/185952A1 |
The invention relates to a method for cutting a single crystal (1) having a first polar axis (P1) comprising the steps of arranging the single crystal (1) relative to a cutting tool (2) in such a way that the first polar axis (P1) is ori...
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WO/2013/183831A1 |
The present invention relates to a stone cutting machine and provides an ultra-slim stone cutting machine, comprising: a "U" shaped port frame (1) open at the bottom side thereof and mounted on the ground surface and including two column...
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WO/2013/179498A1 |
[Problem] To provide: a method for efficiently producing a resin-bonded wire saw that stabilizes the step of cutting an ingot and that obtains a smooth wafer in which the thickness of a damaged layer on the wafer surface caused by cuttin...
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WO/2013/176089A1 |
The invention sets cut plan lines (51, 52) for cutting an item to be processed (1) such that neither of said cut plan lines (51, 52) is parallel to an a-plane or an m-plane of a hexagonal crystalline compound. A laser beam (L) is irradia...
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WO/2013/175398A1 |
A cutting apparatus (1) for use in machines for cutting blocks (2) of schistose materials comprises: a cutting actuator unit (4) that exerts a pushing action in a pushing direction on a cutting blade (10) whose blade body has an overall ...
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WO/2013/166976A1 |
A method for manufacturing a resin diamond wire comprising viscose, carborundum, and a core wire. The method comprises the steps of: preparing a carborundum resin liquid comprising carborundum coated with metal, a resin adhesive, an orga...
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WO/2013/156606A1 |
The machine comprises a bearing structure (103), a first guide drum (109) for guiding at least one cutting wire (F) and a second guide drum (111) for the cutting wire. The first guide drum and the second guide drum are movable along the ...
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WO/2013/150428A1 |
An apparatus (12) for calibrating slabs of agglomerated or natural stone material comprises at least one calibrating unit (15) provided with a calibrating head which is rotatable about a first rotational axis (16) perpendicular to a work...
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WO/2013/151660A1 |
The disclosure is directed to a cutting process involving: (a) creating a starter crack (41-48) using a scribe wheel, (b) application of laser or electrothermal heating, and (c) subsequent cooling from a gas or an aerosol jet, as the las...
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WO/2013/151074A1 |
This glass film fracturing method involves a full body fracturing step in which an initial crack (8) is developed along a planned cutting line (4, 5) by heating the 200μm or thinner glass film (GF) with a laser (9) and performing coolin...
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WO/2013/150990A1 |
The present invention relates to a reinforced glass sheet-cutting method for cutting by irradiating a reinforced glass sheet (10) with laser light. This reinforced glass sheet-cutting method is provided with: a step for cutting out a fir...
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WO/2013/151075A1 |
A laminate body manufacturing step is carried out in which a glass film laminate body (3) is manufactured by placing in contact with one another the surfaces (1a, 2a) of a 200μm or thinner glass film (GF) and a support glass (GS) suppor...
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WO/2013/143844A1 |
Previously, in order to produce a dimensionally stable fused-quartz hollow cylinder, an output cylinder having a centre axis would have been prepared, said output cylinder being produced by means of a bore having a boring bar, said bore ...
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WO/2013/139668A1 |
In the case of a drilling tool (1), comprising a drilling stub (6), a cutting element attached to the drilling stub (6) and an attachment portion for attachment to a tool holder (3), wherein the attachment portion is divided into at leas...
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WO/2013/140198A1 |
A cutting blade includes a blade body 10 with one or more cutting elements 20/50 positioned along its periphery. The elements can be keyed to the blade core to help provide secure mounting onto the blade, and can include a polychrystalin...
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WO/2013/133030A1 |
The periphery of a scribing wheel (10) is polished in a V shape, and a diamond film (14) is formed on a polished surface. A polished surface (15) is then formed by rough polishing a band-shaped portion including a ridge line at the tip o...
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WO/2013/128688A1 |
[Problem] To provide a method that is for cutting a silicon ingot and that, without using an abrasive grit, can efficiently cut a silicon ingot by means of a simple process, and that can cause a silicon wafer to become a thin film and to...
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WO/2013/130581A1 |
Methods and apparatus for separating substrates are disclosed, as are articles formed from the separated substrates. A method of separating a substrate having a main surface, a tension region within an interior thereof, and a compression...
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WO/2013/128258A1 |
The invention relates to a holding device (1) for holding and rocking a work piece (2) in a cutting machine (20), the holding device (1) comprising: - a supporting part (9), - a rocking part (5), being movably mounted relative to the sup...
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WO/2013/128653A1 |
[Problem] To provide a method that is for cutting a silicon ingot and that can, without using an abrasive grit, efficiently cut a silicon ingot (2) by means of a simple process and can cause a silicon wafer to become a thin film and to h...
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WO/2013/127847A1 |
The invention relates to a device and to a method for simultaneously cutting a plurality of slices from a workpiece by means of wire saws. The device comprises two groups of wire guiding rollers, wherein a first and a second wire grid ar...
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WO/2013/120404A1 |
A vibration damping element for the handle of a handheld rock drill, a handle for a handheld rock drill and a handheld rock drill having the same. The handle includes a hand shank, and a left handle frame and a right handle frame connect...
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WO/2013/120807A1 |
A pick tool for pavement degradation or mining, comprising an insert and a holder, the insert comprising a super-hard strike tip joined to a proximate end of an insertion shaft. The insertion shaft is secured by an interference fit withi...
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WO/2013/118645A1 |
The present invention secures the product rate and provides thin silicon substrates. The device: comprises a laser light source (150), a laser-focusing unit (160) that irradiates laser light (190) from the laser light source (150) toward...
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WO/2013/115352A1 |
The present invention addresses the problem of providing a production method for a monocrystalline substrate, the monocrystalline substrate, and a production method for a monocrystalline member having a modified layer formed therein, tha...
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WO/2013/115353A1 |
A thin silicon substrate is provided for which a product rate is maintained. A monocrystalline substrate (10) having a modified layer (14) having periodic structures having a different crystal orientation to the crystal orientation of th...
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WO/2013/115351A1 |
The invention addresses the problem of providing a processed monocrystal member and a manufacturing method therefor, the processed monocrystal member facilitating detachment when forming relatively large thin monocrystal substrates by de...
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WO/2013/108568A1 |
The present invention pertains to a device for cutting glass substrates, wherein a cutting roller provided with a first protrusion on the roller surface is made to rotate while a glass substrate is transported in a transport direction by...
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WO/2013/102939A1 |
A cutting system, which is able to prevent breakage of plates or slabs (1) subjected to expansions due to thermal stresses, provides for making, in correspondence with at least one hole or opening (2) of the plate (1), a thickness cut (3...
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WO/2013/102542A1 |
In a sawing cord the three constituting elements of steel cord, sawing bead and sleeve polymer in between the beads must work optimally together. In order to improve the injection moulding quality the inventors disclose an injection moul...
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WO/2013/101872A1 |
Methods are disclosed for determining mounting locations of ingots on a wire saw machine. The methods include measuring a test surface of a test wafer previously sliced by the wire saw machine from a test ingot to calibrate the system. A...
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WO/2013/098070A1 |
The separating device (100, 200) of the invention relates to a retaining device (110) having a retaining region (120) by means of which a metal or ceramic blank (10, 20) is directly or indirectly held to the retaining device (110). The s...
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WO/2013/100726A1 |
The present invention is a method for manufacturing a finishing decorative material for construction, comprising: a supply step (100) for cutting a highly-compressed board (B) and supplying the board to a transfer line (L); a surface tre...
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WO/2013/094117A1 |
The present invention is a method for cutting a work piece, comprising cutting the work piece into a wafer shape by winding a wire having abrasive grains fixed thereto around a plurality of grooved rollers, reciprocally moving the wire i...
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WO/2013/093041A1 |
Drill bit (10), which is rotatable about a drilling axis (23), having a drill shaft portion (12) with a first plug-in connecting element, a cutting portion (11) with a second plug-in connecting element, which forms a plug-in connection w...
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WO/2013/093938A1 |
An indexing unit (100) of a gemstone processing machine and a method for processing gemstones (105) is described herein. In an embodiment, the indexing unit (100) of the gemstone processing machine includes a base plate (115) having a pl...
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WO/2013/095928A1 |
A method of cutting bricks from a silicon ingot comprising a monocrystalline center region and a multicrystalline perimeter region is disclosed. A significantly larger number of substantially square bricks comprising at least 90% monocry...
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WO/2013/094809A1 |
Disclosed is an ingot slicing wire guide around an outer face of which wires are wound. The guide has a first end and a second end opposite to the first end, and the outer face of the guide has a tilted face tilted at a predetermined ang...
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WO/2013/094059A1 |
In the present invention, a first scribe line (52a) comprising a perpendicular crack (53a) and a second scribe line (52b) comprising a perpendicular crack (53b) are formed by laser beam (LB) irradiation and the spray of a cooling medium ...
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WO/2013/093191A1 |
A method for the removal of dust generated in the sawing of concrete, rock material, or other suchlike material, said method comprising sawing the material with a saw comprising a rotatable saw blade (1, 8), the dust being sucked through...
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WO/2013/093060A1 |
Drill bit (1), which is rotatable about a drilling axis (9), having a cutting portion with one or more cutting segments (6) and a first plug-in connecting element (13), and a drill shank portion (3) with a second plug-in connecting eleme...
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WO/2013/090533A1 |
A saw system (100) in one embodiment includes a base (110), a work support surface member (112) supported by the base (110) and including a work piece support surface defining a horizontal work piece support plane, and a plurality of whe...
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WO/2013/089570A1 |
The present invention refers to a method of chamfering panels with a core encased in a liner and a device for chamfering panels with a core encased in a liner. In the method according to the invention the previously cut panel (1) is cut ...
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WO/2013/084877A1 |
In a method for cutting toughened glass plates in one embodiment of the present invention, a toughened glass plate (10) provided with a front layer and a back layer that have residual compressive stresses and a middle layer that is forme...
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WO/2013/083838A1 |
Systems and methods are disclosed for controlling the surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot (30) by ...
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