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WO/2012/070989A1 |
A power cutter powered by a single cylinder internal combustion engine, the power cutter comprising: a tool unit having at least one tool, which can be rotated about an axis of rotation (108); a drive unit (104) comprising an engine, the...
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WO/2012/064274A1 |
The present invention relates to a saw blade for a sawing machine, said sawing machine (10) being arranged for cutting micro trenches by means of said saw blade (1), wherein said micro trenches are adapted for receiving at least one duct...
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WO/2012/062455A1 |
The invention relates to an interchangeable holder system (1) having a base part (2) and an interchangeable holder (3) that can be attached to the base part (2) for receiving a machining tool (4) for machining the floor, and a constructi...
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WO/2012/064273A1 |
The present invention relates to a control method in a system comprising - a server unit having computer means, communication means and a first data base, said first data base including positioning data and a plurality of work orders, wh...
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WO/2012/059287A1 |
A grinding and/or cutting tool for a machine tool with an oscillating drive has a holder part for connection to a tool shaft and a main removal element for machining a workpiece, which element is formed as a hollow body and a cavity of t...
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WO/2012/055052A1 |
The device (4) for clamping a fixture attachment (19) to a machine comprises tension rods (20) for fixing the fixture attachment to an adapter piece (21) attached to a machine part, whereby the adapter piece (21) is provided at one side ...
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WO/2012/056512A1 |
The purpose of the present invention is to provide: a polishing pad that improves dressing properties, and with which the surface of an object to be polished is not easily scratched; and a method for producing the polishing pad. This pol...
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WO/2012/056513A1 |
The purpose of the present invention is to provide: a polishing pad that improves dressing properties, and with which the surface of an object to be polished is not easily scratched; and a method for producing the polishing pad. This pol...
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WO/2012/052952A1 |
A cutting wire for stone material designed to be wrapped around a supporting and moving device thereof of the drum or pulley type. The wire comprises a plurality of diamond beads (5) and a plurality of polymeric beads (9) coupled in a re...
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WO/2012/053488A1 |
The present invention is a method for drilling a mother glass substrate for a plasma display panel, wherein a rotating drill is moved to the mother glass substrate side, and a hole is made in the mother glass substrate. The method has: a...
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WO/2012/050307A2 |
Provided are an apparatus and a method for sawing a single crystal ingot. The apparatus includes a wire saw sawing an ingot, a roller driving the wire saw, and a bath containing a liquid cooling the ingot before sawing the ingot.
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WO/2012/045686A1 |
The invention relates to a method and a device for producing disk-shaped elements (13) from a material block (2) by means of wire saw slicing with a processing wire (3), having a step for detecting an exact end of the process when the ma...
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WO/2012/047114A1 |
The present invention relates to a method for production of photovoltaic wafers and abrasive slurries for multi-wire sawing of wafers for photovoltaic applications, and more specific to abrasive slurries which are easy to remove from the...
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WO/2012/046439A1 |
This scoring and cutting device (100) is configured in such a manner that a scoring movable frame (21) moves from the downstream side of a scoring level block (40) toward the upstream side to longitudinally move longitudinally movable cu...
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WO/2012/045399A1 |
An abrasive cutting-off device has a tool holding fixture (2) for rotatably holding a cutting wheel (3) in a receiving space. Also provided is a deflecting element (5), which is arranged in an area around the receiving space, wherein a w...
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WO/2012/043951A1 |
Provided is a single crystal ingot sawing apparatus. The A single crystal ingot sawing apparatus includes a wire saw configured to slice an ingot, a roller for configured to drive the wire saw, and a slurry bath for configured to receive...
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WO/2012/038798A1 |
A support apparatus (1) of slab materials (L) is described, comprising: a support structure (2), defining a horizontal work plane (PL) of a slab (L); a plurality of first supporting and sliding rollers (3, 4) of the slab (L) on a first h...
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WO/2012/036524A2 |
A rock cutting apparatus includes a shaft having a hollow therein where high-pressure water is movable, the shaft being configured to be inserted into a hole, a moving unit for forcing the shaft to reciprocate, and a nozzle unit installe...
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WO/2012/031942A1 |
The invention relates to a method for producing piezoelectric actuators (1) from a material block, comprising firstly the provision of the material block (100) made of a plurality of piezoelectric layers (10) stacked one above the other,...
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WO/2012/032009A1 |
Chain for a rock cutter for making a cut (11) in a rocky mass (10), comprising a sequence of at least two active chain links (4) each bearing a cutting tool (22A, 22B, 22C,..., 22K) on a tool holder (16), in which chain the cutting tools...
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WO/2012/031828A1 |
The invention relates to a method for sawing a workpiece (10), in particular a silicone workpiece, in which a sawing tool (12) is moved along the workpiece (10), wherein the sawing tool (12) interacts with the abrasive grains (14) during...
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WO/2012/031900A1 |
The invention is directed to a method for loading and unloading at least one work piece (1) to and from a machine such as a wire saw cutting machine (20), whereby the workpiece is fixed to a fixture attachment (3, 41), the machine compri...
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WO/2012/030289A1 |
A track mounting bracket (130) is presented. The track mounting bracket (130) can included at least one first member (132) and at least one second member (134). The at least one first member (132) has at least one tab (135) at one end an...
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WO/2012/029666A1 |
The present invention is a hole boring drill for glass that bores holes by rotating while coming into contact with glass, and comprises: a tip that comes into contact with the glass, and has a curved surface at the outer peripheral edge;...
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WO/2012/030724A2 |
A countersink cutter or assembly and a method for countersinking to precise depths in various applications, including aerospace applications, using a pneumatically driven pistol grip motor attached to a countersink tool assembly. The cou...
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WO/2012/030288A1 |
A saw attachment mechanism (600) includes at least one guide roller (605) configured for releasable engagement with a track, a guide roller shaft (610) and a guide roller pivot (115), each coupled to the guide roller, at least one pushro...
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WO/2012/030290A1 |
A blade guard (120) for a circular saw blade. The blade guard includes at least two pieces (242) coupled together. The blade guard also includes at least one bottom plate (230) having a slot formed therein for accommodating the circular ...
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WO/2012/026437A1 |
A silicon wafer processing solution for use in a silicon wafer processing method contains a friction modifier comprising a nitrogenated compound, wherein the nitrogenated compound can exhibit a pH value of 2 to 8 inclusive when mixed wit...
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WO/2012/022993A1 |
The subject of the invention is method for preparing flexible stone claddings having natural surface, which method makes it possible, that thin and flexible stone claddings can be created, which are of identical surface shaping with ston...
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WO/2012/020330A1 |
The invention proposes a solution for cutting a sheet of gypsum board quickly and allowing a flat cut edge to be obtained. The invention relates to a carriage comprising a chassis (101) fitted with: - means (102) for collaborating in a s...
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WO/2012/020947A2 |
A wire tool includes a wire including a metal, a plating layer disposed on a surface of the wire, a plurality of diamond particles disposed over the plating layer, and a protection layer each covering the diamond particles and including ...
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WO/2012/019332A1 |
A mortar feeding device with a pressure regulating structure includes a motor (27) and a pump. An outlet of a pump body is connected to a tank body (31) by connection pipes (33). A mortar outlet (37) and a mechanical pressure automatic r...
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WO/2012/017989A1 |
A cutting device that is capable of a sufficiently flat cutting plane is provided. One embodiment of this cutting device is provided with: an annular saw band (12); a saw-band-driving unit (20) that causes the saw band (12) to circulate ...
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WO/2012/017947A1 |
It is possible to control thickening of the processing solution contaminated by scraps by means of at least one water-soluble polymer selected from a copolymer containing (A) polyvinylpyrrolidone and vinylpyrrolidone and in addition by m...
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WO/2012/017988A1 |
The disclosed method for cutting a glass film (G) involves: continuously cutting the glass film (G) along an intended cut line (8), which extends in the feed direction (a) in which the glass film is fed, and thereby splitting the glass f...
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WO/2012/018295A1 |
A rotatable grading pick has a head portion, a shank portion extending rearwardly from the head portion, and a polygonal portion on the rotatable grading pick. At least a portion of the outer perimeter of the polygonal portion can be eng...
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WO/2012/011445A1 |
Disclosed is a glass film cutting device (1) that uses thermal stress generated by local heating and cooling of the heated area along a planned cutting line (7) in a glass film (G) to move an initial crack (10) formed in the end section ...
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WO/2012/011446A1 |
Disclosed is a laser processing method for cutting out at least a first effective section and a second effective section from a plate-shaped object to be processed. The method comprises a first step and a second step. In the first step, ...
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WO/2012/007381A1 |
A carrier (13) for a silicon block (31) is designed to be firmly connected as part of a carrier arrangement (11), together with a lower carrier part (25), to the silicon block (31), and to be moved together therewith for machining by saw...
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WO/2012/007275A1 |
The invention relates to a sawing apparatus (4) for producing a scintillator (2), which is structured into scintillator elements (1), for a radiation detector (3). Said sawing apparatus further comprises a rotatably mounted saw blade (5)...
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WO/2012/007956A1 |
Laser fire protection system used to prevent the diamond break due to fire on any unwanted focal point inside the diamond. Graphite layer is creates on the diamond surface before sawing process by applying high temperature of 800°c to 1...
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WO/2012/004052A1 |
The carrier device (10) is used for fixing a material block (13) in a cutting device during cutting into wafers. The material block (13) is fixed on a surface (2) of the carrier device (10) so as to be secure against slippage. A pluralit...
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WO/2012/000986A1 |
The invention relates to a cutting tool, in particular cutting wheels, and a method for producing the same. For the purposes of smoothing the surfaces (6a, 6b) and of sharpening the cutting edge (4), use is made of a method in which at l...
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WO/2012/001698A1 |
Multiple Diamond planning and Brating Machine is used to scan the multiple diamond on the single machine so, it reduce the labor and production cost. The invention mainly comprised in two parts; Flat scanner setup, Multi bruit machine wh...
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WO/2012/001235A1 |
The invention relates to a loudspeaker enclosure consisting of stone, including a front cover (3), a back cover (5) as well as an edge (4,6) circulating the borders thereof and connecting them to each other to form a substantially sealed...
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WO/2011/162392A1 |
Disclosed is a cutting method whereby a board to be processed can be accurately cut with a simple configuration. In the cutting method, an irradiation region (101) of a laser beam (100) is relatively moved along at least a part of a scri...
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WO/2011/158672A1 |
In a modified-region formation step, a element-array-bearing substrate (20) comprising a plurality of semiconductor light-emitting elements (21) formed on the front surface (11a) of a wafer substrate (11) is irradiated with laser light (...
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WO/2011/155314A1 |
Provided is a method for cutting a glass sheet, which makes it possible to perform cutting appropriately even for a thin glass sheet having a thickness of 1 mm or less. A scribe line (20a) is formed along part of a planned cutting line (...
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WO/2011/151022A1 |
The invention relates to a method for monitoring for wire breaks while hard solids are cut by means of a span of wire, wherein the solid is guided through the span of wire, and a direct current is conducted by the span of wire. The direc...
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WO/2011/152230A1 |
Provided is a laser processing method capable of increasing splitting force according to the required quality. By irradiating an object to be processed with laser light (L) having a pulse waveform with a half-value width and a bottom wid...
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