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JP6082439B2 |
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JP6065495B2 |
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JP2016210993A |
To provide a resin composition small in roughness of an insulation layer surface in a wet roughing process, capable of forming a plating conductor layer having sufficient strength and excellent in dielectric property and thermal expansio...
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JP2016203379A |
To provide an adhesive laminated film for an interlayer insulating layer which can sufficiently reduce a thermal linear expansion coefficient of a multilayer printed wiring board, and can enhance an adhesive force between the adhesive la...
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JP6034662B2 |
To provide a polyimide film in which generation of warpage is suppressed and twisting is reduced, used for an adhesive film for semiconductor assembly.A polyimide film is characterized in that a film production width is 1 m or more, that...
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JP6029839B2 |
A photosensitive adhesive composition comprising (A) an alkali-soluble polymer, (B) a thermosetting resin, (C) one or more radiation-polymerizable compounds and (D) a photoinitiator, wherein the 5% weight reduction temperature of the mix...
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JP2016536763A |
Structure and a manufacturing method of an ACF array which are transferred by the micro cavity array of the form and shape where especially un-random particles were decided beforehand, and size. This manufacturing method includes the flu...
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JP6030061B2 |
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JP6031877B2 |
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JP6031563B2 |
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JP6023506B2 |
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JP6024235B2 |
To provide an adhesive composition enabling to maintain sufficient connection reliability even in low pressure connection; and a circuit connection structure using the adhesive composition.This adhesive composition includes a resin havin...
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JP6024234B2 |
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JP6020520B2 |
To provide a method of manufacturing a semiconductor chip with a thin adhesive layer, capable of miniaturizing a semiconductor device.The method of manufacturing a semiconductor chip with an adhesive layer comprises: a coating step of ap...
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JP6015234B2 |
To provide a curable resin composition excellent in coating properties, conductivity, adhesiveness, and heat radiation, which produces a cured material excellent in heat resistance and durability with less secular change of these propert...
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JP6009505B2 |
Provided are two part hybrid adhesives that comprise an organoborane amine complex, a polyamine, a component polymerizable by free radical polymerization, and a polyisocyanate component. An isocyanate terminated prepolymer can advantageo...
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JP5998762B2 |
To provide an adhesive composition to form an adhesive layer in which re-adhering is easy, and peeling from an adherend can be easily performed after being added with heat.An adhesive composition includes: a base compound including a sil...
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JP5994266B2 |
To provide a photosensitive resin composition which is excellent in pattern formability, film stability and embedding properties when a film is formed and used, and sufficiently suppresses void formation when being bonded at high tempera...
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JP5989928B1 |
[Subject] While it is suitably used as an electric conduction jointing material when joining a semiconductor chip (especially power device) on the element support part of a leadframe, or the circuit electrode portion of an insulating boa...
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JP5977954B2 |
To provide a sheet for processing a semiconductor wafer which shows sufficient expandability even when a base material contains no DOP and is reduced in the chronological change of adhesive characteristics.The sheet for processing the se...
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JP2016148767A |
To provide a photosensitive resin composition that can be cured at a low temperature while maintaining photo-patterning property by an alkali developer and that excels in high-temperature adhesiveness, reflow resistance and insulation re...
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JP5971960B2 |
To provide: an uncuring adhesive resin excellent in alkali processability before curing and heat resistance after curing; a laminate obtained by laminating the same on a metal foil; and a method for manufacturing a printed wiring board u...
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JP5968773B2 |
A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperatu...
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JP5966966B2 |
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JP5963752B2 |
The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar module...
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JP5958518B2 |
A resin composition comprising a polyamideimide and a polyfunctional glycidyl compound, the polyamideimide having 2 or more carboxyl groups on at least one end of the molecular chain.
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JP2016132736A |
To provide a polyimide resin composition which can be cured with active energy rays in the absence of a photopolymerization initiator, and has excellent heat resistance and to provide an adhesive sheet containing the composition.A polyim...
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JP2016132735A |
To provide a liquid polyimide resin excellent in processability and heat resistance.A polyimide resin which is liquid at 25°C and has a maleimide group is obtained by reacting (A) a diamine represented by general formula (1), (B) a diam...
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JP5955156B2 |
The purpose of the present invention is to provide: an adhesive film for electrical/electronic applications and a coverlay film, each of which enables the achievement of a lower dielectric constant and a lower dielectric loss in the freq...
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JP5953328B2 |
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JP2016124980A |
To provide an adhesive excellent in heat resistance and sticking property.The adhesive contains an adhesive component. The adhesive component contains, with respect to the total amount of the adhesive component, 50 wt.% or more of a benz...
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JP2016125054A |
To provide an adhesive composition allowing for formation of an adhesive layer having low glass transition temperature and enhanced heat resistance.There is provided the adhesive composition containing: specific diamine; specific tetraca...
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JP2016124982A |
To provide a crosslinked polyimide resin capable of forming an adhesive layer which has a stable coating performance even when producing in an industrial scale, is excellent in solder heat resistance and is capable of holding an excellen...
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JP2016114623A |
To provide a photosensitive resin composition that maintains pattern formability when used by forming a film on an underfill material that seals a conductive bump, and has high insulation reliability, and a film-like adhesive, an adhesiv...
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JP5935323B2 |
Provided is a photosensitive adhesive composition comprising (A) an alkali-soluble polyimide having particular structural unit(s) and having a particular structure at at least one end of the main chain, (B) a glycidylamine type epoxy com...
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JP5929419B2 |
To provide an adhesive composition which has adhesive force required when it is pasted on an adhered material, even in a high temperature environment of about 200°C, and decreases its adhesive force when it is heated at a prescribed tem...
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JP5931700B2 |
To provide a protective film for a semiconductor wafer, which can give little warpage and high flexural strength of a semiconductor wafer and can reduce fluctuations of the flexural strength, and to provide a production method of a semic...
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JP5925560B2 |
To provide a mask sheet capable of taping on a L/F (lead frame) at a lower temperature than a thermoplastic mask sheet, hardly causing such thermal deterioration that an adhesive deposit is generated at the separation of the mask sheet e...
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JP2016088959A |
To provide a positive photosensitive adhesive composition suitable as a film material to be used for a method for manufacturing a semiconductor device, the composition which exhibits excellent moisture resistance and flatness with little...
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JP2016088958A |
To provide a photosensitive adhesive composition suitable as a film material to be used for a method for manufacturing a semiconductor device, the composition which exhibits excellent moisture resistance and flatness with little level un...
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JP2016086158A |
To provide a laminate for wafer processing which allows for easy temporary bonding of a wafer and a support substrate, easy peeling of a processed wafer from the support substrate, and easy removal of bonding residue of the wafer after p...
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JP2016513093A |
The present application is a reaction product of an azide compound having two or more azide groups attached and an alkyne compound having two or more alkyne groups attached, wherein the azide group and the alkyne group are 1,3. -Reaction...
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JP5916634B2 |
Two-component epoxy resin composition comprises: an epoxy resin component (K1) comprising at least one epoxy resin (A) with an average of more than one epoxide group per molecule; and a curing component (K2) comprising an amino group ter...
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JP2016069651A |
To provide a polyimide resin composition having extremely low dielectric tangent and dielectric constant, and excellent heat resistance, and having high adhesion to both of a circuit wiring pattern such as a copper wiring, and an insulat...
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JP5902139B2 |
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JP5901349B2 |
To provide a reliable adhesive film applicable to a multiply-stacked semiconductor device, a method for producing the same, and a tape for processing a wafer using the same.An adhesive film includes at least one kind of thermoplastic res...
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JP2016041797A |
To provide a resin composition for an adhesive having excellent adhesive force and low water absorption, and also having high thermostability and a low dielectric constant-dielectric loss tangent; and to provide an adhesive sheet using t...
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JP5890253B2 |
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JP5887693B2 |
Disclosed is a photosensitive adhesive composition including: (A) an epoxy compound, (B) a soluble polyimide having a residue of the diamine represented by the general formula (2), (C) a photopolymerizable compound, and (D) a photopolyme...
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JP5886027B2 |
To provide a double-sided metal clad laminated sheet with high heat resistance, which suppresses microvoids generated between a metal layer and a polyimide resin layer, and suppresses circuit separation due to permeation of acid cleaning...
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