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WO/2004/038065A1 |
A stabilized aluminum laminate (101) which comprises a thin film (102) composed of aluminum at least with respect to the surface thereof and, laminated on the whole surface thereof by the sputtering, vapor deposition or ion plating metho...
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WO/2004/038072A2 |
An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate sea...
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WO/2004/035860A1 |
A multiplicity of granules (1) comprising a thermoplastic resin having its surface clad with metal (4) are integrally joined to each other under pressure. Mass of joined granules (3) carries the metal (4) in matrix form in the three-dime...
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WO/2004/033763A1 |
Cup type plating equipment capable of applying plating of uniform film thickness on an entire plated surface while supplying plating fluid into a plating fluid bath, comprising a plated object loading part provided at the opening end of ...
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WO/2004/033764A1 |
A liquid treatment apparatus comprising diaphragm position change means capable of partially changing the position of diaphragm. This liquid treatment apparatus enables partially changing the position of diaphragm, so that the in-plane u...
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WO/2004/031454A2 |
The present application provides a cathode for use in an electroplating cell comprising a porous electrically non-conducting substrate having a first surface which is arranged, during operation of the plating cell, to be coated with depo...
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WO/2004/030907A1 |
A laminate having a stabilized silver layer, which comprises a surface of silver and, formed over the whole thereof, a stabilizing layer comprising at least one of gold, tin and an alloy containing gold or tin, and having a thickness les...
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WO/2004/022814A2 |
A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this pr...
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WO/2004/020704A1 |
The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, o...
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WO2003090257B1 |
The invention relates to a method for producing thin metal-containing layers (5C) having low electrical resistance, according to which a metal-containing initial layer (5A) having a first grain size is configured on a carrier material (2...
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WO/2004/019385A2 |
The invention relates to a coating support comprising numerous conductive tracks (12) which are associated with a shared addressing contact (18) and with means of selecting at least one track from said numerous tracks, which is to be ele...
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WO/2004/018739A1 |
A surface treated steep plate excellent in battery performance and a battery case comprising the same are disclosed. The battery case is produced by forming a surface treated steel sheet having an indium layer on the outermost side to se...
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WO/2004/018740A1 |
A surface treated steel plate for battery cases having an improved electrical contact with the battery positive electrode active material, its manufacturing method, a battery case, and a battery are disclosed. The surface treated steel p...
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WO/2004/017384A1 |
The invention relates to a device for etching semiconductors with a large surface area in a trough-shaped receptacle containing a liquid electrolyte. At least one sample head is mounted inside a displaceably mounted etching trough and sa...
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WO/2004/016829A2 |
Disclosed are copper electroplating solutions, methods for using the solutions and products formed by using such methods and solutions in which the solutions contain copper alkanesulfonate salts and free alkanesulfonic acids, wherein the...
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WO/2004/013381A2 |
Embodiments of the invention generally provide a method and apparatus for plating a metal on a substrate. The electrochemical plating system generally includes a plating cell (101) having an anolyte compartment (108) and a catholyte comp...
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WO/2004/011188A1 |
the invention relates to a brazing sheet product including a core sheet, on at least one >ide of the core sheet a clad layer of an aluminium alloy including silicon in an amount in the range of 4 to 14% by weight, and further including o...
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WO/2004/009879A1 |
A plating device has a plating vessel (40) for receiving plating liquid (10), an anode (56) installed so as to be immersed in the plating liquid (10) in the plating vessel (40), an adjustment plate (60) provided between the anode (56) an...
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WO/2004/009871A1 |
Automobile fuel line parts having a steel base material and, applied on the surface thereof, a multilayer plating layer having a chromate coating layer as an uppermost layer, characterized in that the multilayer plating layer comprises a...
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WO/2004/009878A2 |
Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially ho...
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WO/2004/009875A2 |
A method and apparatus for immersing a substrate for plating operations. The apparatus generally includes a plating cell configured containing a plating solution therein. The plating cell includes at least one fluid basin, a diffusion pl...
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WO/2004/007810A1 |
An electromagnetic wave shield material comprising a transparent substrate and, formed thereon, a thin line pattern characterized in that the thin line pattern is comprised of a metal plating film formed using, as catalyst nuclei, metall...
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WO/2004/007811A2 |
In manufacturing integrated circuits voids in the metal layer may readily form during electrolytic metal deposition. In order to avoid these faults which adversely affect the functionality of the circuits, the invention suggests to utili...
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WO/2004/007809A2 |
A plain bearing and method for making the plain bearing are described, the plain bearing having an overlay alloy layer at a sliding surface of the plain bearing, the plain bearing comprising a layer of a strong backing material, a layer ...
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WO/2004/003663A2 |
A process tool (200) for electrochemically treating a substrate (201) is configured to reduce the oxygen concentration and/or the sulfur dioxide concentration in the vicinity of the substrate so that corrosion of copper may be reduced. I...
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WO/2004/003935A2 |
The method generally includes filling features in a substrate by plating metal ions from a gap fill solution onto the substrate, reducing plating activity in the features in a polymer treatment step by conditioning the substrate surface ...
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WO/2004/004418A1 |
A metal based resistance heating element, which comprises a core material of a platinum group metal or a refractory metal and, formed on the surface thereof, a coating film having at least two layers, wherein the film has an inner layer ...
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WO/2004/003259A1 |
A method of forming a dielectric layer containing dielectric filler, which is excellent in film thickness uniformity, from a polyimide electrodeposition liquid containing dielectric filler. In particular, a method of forming a polyimide ...
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WO/2004/001823A1 |
A method for manufacturing a semiconductor device capable of operating at high rate and having a high quality and a high reliability. The method in which a barrier film (7) having a copper diffusion preventive function is formed on a met...
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WO/2004/001813A2 |
The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of it easily and securely, and also a plating apparatus provided with the...
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WO/2004/001100A1 |
The invention relates to a process for forming coatings or free-standing deposits of nano-crystalline metals, metal alloys or metal matrix composites. The process employs drum plating or selective plating processes involving pulse electr...
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WO/2004/001102A1 |
A process for in situ electroforming a structural reinforcing layer of selected metallic material for repairing an external surface area of a degraded section of metallic workpieces, especially of tubes and tube sections, is described. P...
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WO/2004/001178A2 |
A downhole pipe or casing repair method and apparatus (10) includes a corrosion monitoring tool adapted for examining an interior of a pipe or tubing or casing (16) to create a record of the condition of said interior of said pipe, a sur...
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WO/2003/106739A1 |
A Cu-Sn-O based alloy plating comprising 0.3 at % to 50 at % of oxygen, 20 at % to 80 at % of copper, and 10 at% to 70 at % of tin. The Cu-Sn-O based alloy plating provides a copper-tin alloy excellent in the adhesion of a plating and in...
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WO/2003/106740A1 |
A method for manufacturing a plated film by bringing a film having a conductive surface into electrical contact with a cathode roll with a liquid film interposed between the film and the cathode and forming a metal plating on the conduct...
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WO2003027011B1 |
A method is described for catalyst-induced growth of carbon nanotubes, nanofibers, and other nanostructures on the tips of nanowires, cantilevers, conductive micro/nanometer structures, wafers and the like. The method can be used for pro...
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WO/2003/105200A1 |
A substrate processing apparatus has a processing tank (10) for plating a substrate (W) in a plating solution (Q) holds therein, a cover (40) for selectively opening and closing an opening (11) of the processing tank (10), a spraying noz...
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WO/2003/104532A1 |
Electrical connector or electrical switching element comprising a metallic core and a galvanically deposited metal containing coating layer, whereby the metal containing coating layer is deposited by electrolytic composite plating and th...
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WO/2003/105545A1 |
A flexible printed circuit board that exhibits extremely high adherence and realizes superfine patterning by etching; and a process for producing the same. In particular, a flexible printed circuit board produced by forming a copper thin...
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WO/2003/102277A1 |
A surface treatment copper foil that can satisfactorily ensure an adhesive strength with a low dielectric substrate for use in the constructing of a printed wiring board for high-frequency use and that can minimize transmission loss. In ...
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WO/2003/103025A2 |
The present invention provides a wafer carrier that includes a plurality of concentric sealing members that provide a seal, with the outer seal independently movable to allow cleaning of a peripheral backside of the wafer to occur while ...
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WO/2003/099490A1 |
The invention relates to a method for the galvanic coating of a continuous casting mould (2), according to which the inner surfaces (4) of said continuous casting mould (2) that delimit a mould cavity (3) are coated with a coating materi...
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WO/2003/100138A1 |
The copper laminate is produced by rolling a copper ingot down to a thickness equal or higher than 105 m, and then electroplating the rolled copper sheet with copper. The composite lamellar material, intended in particular for printed ci...
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WO/2003/095714A1 |
A process for producing a high temperature heat resisting carrier foil clad electrolytic copper foil from which detachment of a carrier foil is easy even after press working at 200ºC or higher. In particular, for example, a process for ...
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WO/2003/093524A2 |
A method and apparatus for providing a uniform current density across an immersed surface of a substrate during an immersion process. The method includes the steps of determining a time varying area of an immersed portion of the substrat...
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WO/2003/092911A1 |
The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are essentially free of compressive stress or are predominantly in a predetermined crystal ...
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WO/2003/094246A1 |
The invention concerns a method for making thin-film CIGS which consists in: electrochemically depositing on a substrate a layer of stoichiometry close to CuInSe2; then rapidly annealing said layer from a light source with pulses of suff...
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WO/2003/090965A1 |
A polishing method capable of energizing a polished object to the end of polishing with a stable current density distribution and allowing to use the other equipment such as conventional plating equipment and washing equipment and to per...
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WO/2003/092344A1 |
A flexible circuit printable board (1) can be favorably produced by a process composed of steps of forming in a polyimide film (4) having a metal coat (2, 3) on each surface side a via hole (6) penetrating at least one metal coat (3) and...
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WO/2003/089679A1 |
Process of masking cooling holes (4) of a gas turbine component (1) with an external surface (6), comprising a cavity (2) and a plurality of cooling holes (4) before coating the gas turbine component (1), comprising the steps of first ap...
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