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WO/2023/165767A1 |
Embodiments of present invention provide a method of forming an extreme ultraviolet (EUV) mask. The method includes subliming a radiation-sensitive material onto a surface of an EUV blank substrate; exposing the radiation-sensitive mater...
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WO/2023/165837A1 |
A reticle stage for a lithographic apparatus is disclosed. The reticle stage comprises a support for a reflective reticle, and at least one shielding element coupled to the support. The at least one shielding element is selectively confi...
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WO/2023/162574A1 |
Provided are: a composition capable of forming a film that exhibits excellent storage stability, excellent spectral characteristics, and excellent light resistance and moisture resistance; a film; an optical filter; a solid-state imaging...
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WO/2023/163008A1 |
This resist composition contains a resin component (A1) having constituent unit (a01) expressed by formula (a0-1) and constituent unit (a10) expressed by formula (a10-1). R and Rx1 represent a hydrogen atom or the like; Y01, L01, and Yax...
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WO/2023/162687A1 |
Provided are: a resin composition having excellent storage stability and excellent chemical resistance of the resulting cured article; a cured article obtained by curing the resin composition; a laminate including the cured article; a me...
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WO/2023/162718A1 |
Provided is a resin composition comprising a component (A) comprising at least one polymeric compound selected from the group consisting of polyamide, polyimide, polyamideimide and polybenzoxazole, a component (B) comprising a cationical...
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WO/2023/160924A1 |
Disclosed is an optical arrangement for reflecting pulsed radiation, comprising: an optical retarder and optical reflector. The optical retarder comprises a first axis coinciding with a first linear polarization state and a second axis, ...
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WO/2023/162889A1 |
The purpose of the present invention is to provide: a polymer which has a high development rate, can form a fine pattern, and can provide a cured product having excellent fine wire adhesion; and a photosensitive resin composition contain...
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WO/2023/160925A1 |
A system for cleaning contamination particles from a clamp of a lithography apparatus is described. The system includes a body configured to be inserted into the lithography apparatus, engaged by a tool handler of the lithography apparat...
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WO/2023/162905A1 |
A resin composition comprising a precursor of a cyclization resin, a base generator having a structure which generates a basic compound by the action of at least one of light, heat, an acid, and a base and having two or more polymerizabl...
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WO/2023/164090A1 |
Systems and methods for performing 3D photoresist profile generation for a semiconductor device fabrication environment are discussed. The methods comprise receiving in a virtual fabrication environment a top contour mask and a bottom co...
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WO/2023/163271A1 |
The present invention relates to a probe head for testing semiconductor elements, the central technical feature being a low-friction probe head comprising: a probe; a block provided with a receiving hole in which the probe is received; a...
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WO/2023/163111A1 |
The present invention addresses the problem of providing a polyether resin having exceptional dielectric characteristics. The solution to the problem addressed by the present invention is a polyether resin having a repeating unit represe...
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WO/2023/163209A1 |
The purpose of the present invention is to provide: a cured product which is obtained by optically and thermally curing a curable resin composition and exhibits optical characteristics such as a high total light transmittance, a low haze...
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WO/2023/162552A1 |
Provided is a chemically amplified positive photosensitive composition which forms a pattern to serve as a template in a process for creating a plated article on a substrate which comprises a metal layer on the surface thereof, said comp...
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WO/2023/163516A1 |
Provided are a curable composition, a film manufactured using same, and a display device comprising same, the composition comprising: (A) semiconductor nanorods; (B) a photo-curable monomer containing a compound having an unsaturated car...
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WO/2023/162565A1 |
Provided are: an actinic-ray-sensitive or radiation-sensitive resin composition capable of forming a pattern having excellent CDU in ultrafine pattern formation, and capable of forming a pattern having excellent CDU even after time has p...
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WO/2023/160896A1 |
First and second novel membranes for use in a lithographic apparatus are disclosed. The first membrane comprises a core substrate and a metal silicate layer. The metal silicate layer is an outermost layer of the first membrane. The secon...
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WO/2023/162836A1 |
The present invention provides: an active-ray-sensitive or radiation-sensitive resin composition comprising a resin (P) which can be decomposed by the action of an acid to increase the polarity thereof and a compound (Q) represented by a...
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WO/2023/162837A1 |
The present invention provides: a positive active-ray-sensitive or radiation-sensitive resin composition comprising (A) a resin having repeating units (a) represented by a specific general formula (a) and (B) a compound that produces aci...
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WO/2023/160935A1 |
A sample inspection tool is described. The inspection tool includes a light source configured to produce effective inspection radiation below 200nm, a sample holder, an imaging sub-system containing sub-system components that delivers li...
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WO/2023/162762A1 |
Provided are: an actinic-ray-sensitive or radiation-sensitive resin composition; a resist film; a pattern forming method; and an electronic device manufacturing method, wherein the resist film, the pattern forming method, and the electro...
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WO/2023/162551A1 |
The present invention provides a method for producing a plated shaped article, wherein: footing of a pattern is suppressed when the pattern, which is used as a mold for the formation of a plated shaped article, is formed using a photosen...
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WO/2023/162907A1 |
This resist composition includes a base component (A) and a compound (B0) represented by general formula (b0). In the formula, Ar0 is an arylene group or a hetero arylene group. Rm1 and Rm2 are substituents other than an iodine atom. L01...
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WO/2023/162838A1 |
The present invention provides: an active-ray-sensitive or radiation-sensitive resin composition comprising a resin (A) having repeating units (a) represented by a specific general formula (a); an active-ray-sensitive or radiation-sensit...
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WO/2023/162653A1 |
[Problem] To provide a resist underlayer film formation composition having thermal resistance for use in a lithography process in semiconductor device production. [Solution] Provided is a resist underlayer film formation composition that...
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WO/2023/161555A1 |
According to an embodiment, a stamp for imprint lithography defines a desired shape for a curable resin, wherein the stamp is at least partially transparent to electromagnetic radiation used to cure the curable resin, and wherein the sta...
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WO/2023/162853A1 |
The present invention addresses the problem of providing: a composition for producing a semiconductor by which silicon can be selectively removed when applied to an article to be processed containing silicon-germanium and silicon; a meth...
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WO/2023/162780A1 |
The purpose of the present invention is to provide: a semiconductor substrate production method using a composition from which a film having excellent etching resistance and heat resistance can be formed; and a composition. This semicond...
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WO/2023/162968A1 |
Provided is a material that, in the manufacture of a semiconductor device, can be used to form a protective film having sufficient etching resistance required to protect the edges of a substrate for manufacturing a semiconductor. [Soluti...
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WO/2023/157801A1 |
[Problem] The present invention addresses the problem of providing: a photosensitive resin composition which has excellent volatility regarding a solvent therein and from which it is possible to produce a resist coating film in which the...
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WO/2023/156482A1 |
The invention relates to a photopolymer composition comprising a) matrix polymers, b) writing monomers, c) at least one photoinitiator system, d) optionally at least one non-photopolymerisable component, e) optionally catalysts, radical ...
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WO/2023/157888A1 |
This exposure method includes: using an exposure device that uses a mask, to form a first exposure pattern in a first region in each of a plurality of pattern formation regions on a substrate, using exposure light via a first mask, and t...
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WO/2023/157713A1 |
The purpose of the present invention is to provide a resin composition that enables the formation of a gray partitioning wall having both of high reflectivity of entire visible light and high light-blocking properties even under a low-te...
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WO/2023/157456A1 |
A radiation-sensitive composition contains: (A) a polymer including a structural unit (U) represented in formula (1); and (B) a radiation-sensitive acid generator composed of an onium cation having at least one group Rf1 selected from th...
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WO/2023/157655A1 |
The present invention provides a composition for semiconductor devices, the composition having excellent removability of residues, while being suppressed in dissolution of tungsten. This composition for semiconductor devices contains a r...
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WO/2023/157605A1 |
This holding apparatus comprises: a holding unit that holds an object; a phase change material that is provided inside the holding unit or on the object-holding surface and that exhibits phase change between an amorphous phase and a crys...
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WO/2023/157918A1 |
The present invention is a production method for a hollow structure (100) that comprises a cavity (15) and a top plate part that closes the opening of the cavity (15). The production method for the hollow structure (100) involves: using ...
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WO/2023/157772A1 |
Provided is a protective film forming composition for forming a protective film that protects, from wet etching, an inorganic film of a semiconductor substrate on the surface of which the inorganic film is formed, said composition contai...
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WO/2023/158201A1 |
A pattern processing device for processing a pattern on a substrate, according to one embodiment of the present invention, comprises: a mold fixing unit for fixing a mold at a position at which the mold makes contact with the substrate s...
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WO/2023/157741A1 |
Disclosed are: a coloring composition comprising a coloring agent, a resin, and a solvent, wherein the coloring agent comprises a compound Y in which a compound represented by formula (1) is coordinated to a metal atom; a film; an optica...
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WO/2023/156297A1 |
There is provided a metal oxide photoresist composition comprising electron scavenger particles selected to scavenge electrons having electron kinetic energies of 20 eV or less. Also provided is a method of improving the performance of a...
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WO/2023/155492A1 |
Provided in the embodiments of the present disclosure are an optical fiber bundle for lithography and a lithography machine. The optical fiber bundle for lithography can at least receive an exposure Gaussian beam and a de-excitation Gaus...
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WO/2023/157635A1 |
The present invention provides an actinic-ray-sensitive or a radiation-sensitive resin composition having excellent roughness performance and roughness performance after the passage of time. This actinic-ray-sensitive or radiation-sensit...
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WO/2023/157740A1 |
Disclosed are: a coloring composition comprising a coloring agent, a resin, and a solvent, wherein the coloring agent contains a compound A in which a compound represented by formula (1) is coordinated to a metal atom; a film; an optical...
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WO/2023/156182A1 |
Selecting one or more lists (700; 702) of fields of view (704-712) of a pattern layout for scanning electron microscope measurement and/or other inspection is described. A set of candidate fields of view is determined based on pattern gr...
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WO/2023/157919A1 |
This infrared pass filter contains a colorant, indium tin oxide, and a polymer. The infrared pass filter has: an average transmittance of 30% or less in a first wavelength range from 400 nm to 800 nm; an average transmittance of 75% or m...
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WO/2023/156143A1 |
Disclosed is a method for determining a parameter of interest relating to at least one structure formed on a substrate in a manufacturing process. The method comprises: obtaining layout data relating to a layout of a pattern to be applie...
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WO/2023/156149A1 |
Disclosed is a supercontinuum radiation source comprising a pump laser arrangement for generating pump radiation and comprising a plurality of pump laser heads; a radiation combiner for combining the respective pump radiation from each p...
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WO/2023/157943A1 |
The present invention provides a silicon-containing resist underlayer film forming composition for forming a silicon-containing resist underlayer film that is positioned between a metal-containing resist film and a substrate, the composi...
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