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WO/2023/157526A1 |
Provided are an actinic ray-sensitive or radiation-sensitive resin composition and the like that can form a pattern in which occurrence of defects is suppressed. The present invention pertains to: an actinic ray-sensitive or radiation-se...
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WO/2023/157911A1 |
The present invention provides a resin composition which contains a resin and a metallocene compound, wherein: the metallocene compound comprises a metal atom, an optionally substituted cyclopentadienyl ligand, and an aromatic ring that ...
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WO/2023/157455A1 |
A radiation-sensitive composition contains: (A) a polymer; and (B) a radiation-sensitive acid generator composed of an onium cation having at least one group Rf1 selected from the group consisting of a fluoroalkyl group and a fluoro grou...
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WO/2023/156419A1 |
[Problem] A positive type lift-off resist composition is provided. [Means for Solution] A positive type lift-off resist composition comprising a polymer (A) having a certain structure and cLogP of 2.76 to 3.35, a photoacid generator (B) ...
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WO/2023/155491A1 |
A photoetching machine with optical fiber arrays, comprising a control device (1), an optical fiber transmission device (6), a light focusing array (7) and an electric drive workpiece table (8), and further comprising a photoetching ligh...
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WO/2023/157712A1 |
The present invention addresses a first problem of providing an actinic ray-sensitive or radiation-sensitive resin composition from which a pattern having an excellent resolution is formed. The present invention also addresses a second p...
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WO/2023/158544A1 |
A photocurable composition can comprise a polymerizable material, and a photoinitiator, wherein the polymerizable material can comprise at least one polymerizable monomer and at least one reactive polymer. The reactive polymer can have a...
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WO/2023/153295A1 |
Provided are a radiation-sensitive resin composition that has suitable storage stability and makes it possible to form a resist film with excellent sensitivity, LWR performance, water repellency, and development defect-suppressing perfor...
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WO/2023/154255A1 |
An overlay metrology system may include illumination sources configured to generate one or more pairs of mutually coherent illumination beams and illumination optics to direct the pairs of illumination beams to an overlay target at commo...
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WO/2023/153296A1 |
Provided are a radiation-sensitive resin composition capable of forming a resist film with excellent sensitivity, LWR performance, water repellency, and suppression of development flaws, and having good storage stability; and a pattern f...
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WO/2023/153390A1 |
The purpose of the present invention is to provide a photosensitive resin sheet in which the cross-sectional shape of a pattern is rectangular, a fine pattern can be formed and a pattern defect part can be identified easily, and through ...
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WO/2023/153103A1 |
This photosensitive resin composition comprises: (A) an acid-modified vinyl group-containing resin; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) an inorganic filler; and (E) a heat-curable resin, wherein co...
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WO/2023/153294A1 |
The purpose of the present invention is to provide: a radiation-sensitive resin composition which enables the formation of a resist film having excellent sensitivity, LWR performance, water repellency and development defect reducing prop...
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WO/2023/151891A1 |
The invention relates to a heating device (30), in particular for an EUV projection exposure system (1), for heating at least one element, wherein the heating device (30) has an illumination optics with a housing (31) and at least three ...
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WO/2023/151909A1 |
Disclosed is a method for determining a parameter of interest relating to at least one target on a substrate. The method comprises obtaining metrology data comprising at least one asymmetry signal, said at least one asymmetry signal comp...
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WO/2023/151973A1 |
In one embodiment, one or more non-transitory, machine-readable medium has instructions thereon, the instructions when executed by a processor being configured to perform operations comprising obtaining scanning electron microscopy (SEM)...
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WO/2023/154148A1 |
Embodiments of the present disclosure generally relate to methods for providing real-time characterization of photoresist properties. In some embodiments, a method of preparing a patterned photoresist on a substrate includes forming an u...
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WO/2023/153311A1 |
Provided is a colored photosensitive resin composition which exhibits high ink repelling ability and developing properties, and from which a partition wall that can suppress impregnation of ink to the partition wall can be formed even at...
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WO/2023/154365A1 |
A method of patterning a substrate by selective deprotection via dye diffusion. The method includes forming a photoresist pattern on the substrate from a layer of photoresist deposited on the substrate, depositing a first overcoat on the...
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WO/2023/153059A1 |
This radiation-sensitive resin composition contains a polymer which has a first structural unit represented by the following formula (1) and of which the solubility in a developer changes under the action of an acid, and a compound repre...
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WO/2023/151901A1 |
A support for supporting a partial or complete clamp during manufacture of the clamp, wherein the support comprises a raised flexible element located on a top surface, the flexible element being configured to deform as a result of a gas ...
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WO/2023/149669A1 |
The present application relates to a photoresist composition comprising: tin-oxygen clusters and an oxidizing agent, wherein, during UV irradiation, bonds of the clusters are broken to form cross-linking bonds between the clusters.
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WO/2023/148075A1 |
There is described an assembly for a lithographic apparatus, wherein the assembly is configured to heat a pellicle membrane by one of or a combination of: i) provision of heated gas, ii) radiative heating, iii) resistive heating, and iv)...
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WO/2023/149056A1 |
Provided are a lightweight optical member that can be manufactured at relatively low cost, the optical member having minimal distortion due to temperature increase and having excellent low dust generation and low outgassing properties. A...
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WO/2023/147925A1 |
The invention relates to an EUV lithography system comprising: a housing (25), in the interior (24) of which a residual gas (27) is contained; and at least one gas-binding component (29) which is arranged in the interior (24) and has a g...
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WO/2023/149553A1 |
[Problem] An objective of the present invention is to provide: a method for improving the hardness of a fired product that is to serve as a resist underlayer film for use in a lithography process for semiconductor device manufacturing us...
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WO/2023/149398A1 |
Provided is a laminate with which there is little wiring corrosion during storage under high-temperature and high-humidity conditions. Provided is a laminate in which metal wiring (M1) having a thickness of 0.1–5 μm, a relief pattern ...
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WO/2023/148996A1 |
Provided are a resin composition that enables fine pattern processing even on a rough-surfaced substrate made of a ceramic or the like, a resin composition film, and a semiconductor device in which these are used. A resin composition con...
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WO/2023/147951A1 |
A system includes an imaging system, a spatial filter, and a detector. The system is configured to receive a plurality of diffraction orders. The spatial filter is configured to block one or more undesired diffraction orders of the plura...
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WO/2023/149273A1 |
Disclosed are a coloring composition, a film, an optical filter, a solid-state imaging element and an image display device, the coloring composition comprising: a coloring agent comprising a pigment; at least one kind of a compound A sel...
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WO/2023/148326A1 |
A controller system is configured to control a plant and comprising a feedforward controller to provide, based on a reference state signal, a feedforward signal to the plant, and a feedback controller system to provide a feedback signal ...
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WO/2023/150196A1 |
An overlay metrology system may include a controller for receiving metrology data associated with a plurality of overlay targets on one or more samples; generating a reference metric for at least some of the plurality of overlay targets ...
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WO/2023/150160A1 |
In an embodiment, the present disclosure pertains to a method for forming a three-dimensional (3D) printing resin. In some embodiments, the method includes forming a mixture by combing a mesogen with a solvent and a stabilizer, heating t...
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WO/2023/149406A1 |
The present invention relates to a curable resin composition which contains a multifunctional thiol compound. The multifunctional thiol compound is (1) a compound which does not have a CH structure next but one to an S atom, or (2) a com...
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WO/2023/149327A1 |
Provided is a protective film forming composition for forming a protective film that protects an inorganic film which is formed on a surface of a semiconductor substrate from wet etching, said protective film forming composition comprisi...
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WO/2023/147986A1 |
Disclosed is a method of determining a value for a parameter of interest from a target on a substrate. The method comprises obtaining metrology data comprising single-wavelength parameter of interest values which were obtained using a re...
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WO/2023/143094A1 |
Provided in the embodiments of the present application is a semiconductor processing apparatus. An air intake assembly of the semiconductor processing apparatus is arranged on the top end of a medium sleeve in a covering manner, and the ...
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WO/2023/145699A1 |
Provided are: an infrared absorbing composition that contains a squarylium dye expressed by formula (SQ1), a compound expressed by formula (1a), and a resin, wherein the compound expressed by formula (1a) is included in the amount of 0.0...
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WO/2023/144677A1 |
Methods incorporate variable side wall angle (VSA) into calculated patterns, using a mask 3D (M3D) effect. Embodiments include inputting a mask exposure information, calculating a mask 2D (M2D) effect from the mask exposure information, ...
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WO/2023/145971A1 |
Provided is an on-press-developing planographic printing plate original plate comprising a supporting body and an image-recording layer provided on the supporting body. The image-recording layer contains a polymerization initiator, an in...
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WO/2023/143909A1 |
A substrate table, for use in an immersion lithographic apparatus, having a support area defining a support plane to support a substrate to be patterned and an upper surface surrounding the support area, wherein: the upper surface compri...
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WO/2023/145691A1 |
The present invention addresses the problem of providing: a photosensitive composition which is capable of forming a pattern that has a low linear expansion coefficient and a high glass transition temperature; a transfer film; a cured fi...
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WO/2023/144099A1 |
A dioptric projection lens (PO) for imaging a pattern arranged in an object plane (OS) of the projection lens into an image plane (IS) of the projection lens by means of electromagnetic radiation from the ultraviolet range of longer than...
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WO/2023/146657A1 |
Metrology is performed on a semiconductor wafer using a system with an apodizer. A spot is formed on the semiconductor wafer with a diameter from 2 nm to 5 nm. The associated beam of light has a wavelength from 400 nm to 800 nm. Small ta...
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WO/2023/147212A1 |
This disclosure relates generally to a patterning structure (and methods and apparatus for forming such structures) including substrate having a partially fabricated semiconductor device film stack, a radiation-sensitive imaging layer ov...
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WO/2023/145700A1 |
Provided are: an infrared absorbing composition that contains a squarylium dye, a resin, water, and an organic solvent, wherein the water content of the infrared absorption composition is 0.1-3.0 mass%; a film; an optical filter; a solid...
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WO/2023/145974A1 |
[Problem] To provide a film laminate comprising a film and a resin composition layer provided on one surface of said film, wherein when a resin composition is applied to the film and dried, the repellency of the resin composition on the ...
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WO/2023/145972A1 |
Provided is an on-press development type lithographic printing plate precursor having an image recording layer on a support, wherein: the image recording layer contains an infrared absorber A, a borate compound B, an iodonium compound C,...
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WO/2023/145826A1 |
In one aspect, a method for detaching a resin mask is provided, in which the property of detaching a resin mask having a thickness of 100 μm or more is excellent. In one aspect, the present disclosure relates to a method for detaching...
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WO/2023/143887A1 |
A cleaning system for cleaning a component related to a lithographic process such as a pellicle, reticle, wafer or another lithographic component, comprising at least one radiation emitter configured to, in use, irradiate a region of the...
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