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WO/2023/147925A1 |
The invention relates to an EUV lithography system comprising: a housing (25), in the interior (24) of which a residual gas (27) is contained; and at least one gas-binding component (29) which is arranged in the interior (24) and has a g...
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WO/2023/149553A1 |
[Problem] An objective of the present invention is to provide: a method for improving the hardness of a fired product that is to serve as a resist underlayer film for use in a lithography process for semiconductor device manufacturing us...
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WO/2023/149398A1 |
Provided is a laminate with which there is little wiring corrosion during storage under high-temperature and high-humidity conditions. Provided is a laminate in which metal wiring (M1) having a thickness of 0.1–5 μm, a relief pattern ...
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WO/2023/148996A1 |
Provided are a resin composition that enables fine pattern processing even on a rough-surfaced substrate made of a ceramic or the like, a resin composition film, and a semiconductor device in which these are used. A resin composition con...
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WO/2023/147951A1 |
A system includes an imaging system, a spatial filter, and a detector. The system is configured to receive a plurality of diffraction orders. The spatial filter is configured to block one or more undesired diffraction orders of the plura...
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WO/2023/149273A1 |
Disclosed are a coloring composition, a film, an optical filter, a solid-state imaging element and an image display device, the coloring composition comprising: a coloring agent comprising a pigment; at least one kind of a compound A sel...
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WO/2023/148326A1 |
A controller system is configured to control a plant and comprising a feedforward controller to provide, based on a reference state signal, a feedforward signal to the plant, and a feedback controller system to provide a feedback signal ...
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WO/2023/150196A1 |
An overlay metrology system may include a controller for receiving metrology data associated with a plurality of overlay targets on one or more samples; generating a reference metric for at least some of the plurality of overlay targets ...
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WO/2023/150160A1 |
In an embodiment, the present disclosure pertains to a method for forming a three-dimensional (3D) printing resin. In some embodiments, the method includes forming a mixture by combing a mesogen with a solvent and a stabilizer, heating t...
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WO/2023/149406A1 |
The present invention relates to a curable resin composition which contains a multifunctional thiol compound. The multifunctional thiol compound is (1) a compound which does not have a CH structure next but one to an S atom, or (2) a com...
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WO/2023/149327A1 |
Provided is a protective film forming composition for forming a protective film that protects an inorganic film which is formed on a surface of a semiconductor substrate from wet etching, said protective film forming composition comprisi...
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WO/2023/147986A1 |
Disclosed is a method of determining a value for a parameter of interest from a target on a substrate. The method comprises obtaining metrology data comprising single-wavelength parameter of interest values which were obtained using a re...
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WO/2023/143094A1 |
Provided in the embodiments of the present application is a semiconductor processing apparatus. An air intake assembly of the semiconductor processing apparatus is arranged on the top end of a medium sleeve in a covering manner, and the ...
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WO/2023/145699A1 |
Provided are: an infrared absorbing composition that contains a squarylium dye expressed by formula (SQ1), a compound expressed by formula (1a), and a resin, wherein the compound expressed by formula (1a) is included in the amount of 0.0...
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WO/2023/144677A1 |
Methods incorporate variable side wall angle (VSA) into calculated patterns, using a mask 3D (M3D) effect. Embodiments include inputting a mask exposure information, calculating a mask 2D (M2D) effect from the mask exposure information, ...
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WO/2023/145971A1 |
Provided is an on-press-developing planographic printing plate original plate comprising a supporting body and an image-recording layer provided on the supporting body. The image-recording layer contains a polymerization initiator, an in...
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WO/2023/143909A1 |
A substrate table, for use in an immersion lithographic apparatus, having a support area defining a support plane to support a substrate to be patterned and an upper surface surrounding the support area, wherein: the upper surface compri...
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WO/2023/145691A1 |
The present invention addresses the problem of providing: a photosensitive composition which is capable of forming a pattern that has a low linear expansion coefficient and a high glass transition temperature; a transfer film; a cured fi...
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WO/2023/144099A1 |
A dioptric projection lens (PO) for imaging a pattern arranged in an object plane (OS) of the projection lens into an image plane (IS) of the projection lens by means of electromagnetic radiation from the ultraviolet range of longer than...
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WO/2023/146657A1 |
Metrology is performed on a semiconductor wafer using a system with an apodizer. A spot is formed on the semiconductor wafer with a diameter from 2 nm to 5 nm. The associated beam of light has a wavelength from 400 nm to 800 nm. Small ta...
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WO/2023/147212A1 |
This disclosure relates generally to a patterning structure (and methods and apparatus for forming such structures) including substrate having a partially fabricated semiconductor device film stack, a radiation-sensitive imaging layer ov...
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WO/2023/145700A1 |
Provided are: an infrared absorbing composition that contains a squarylium dye, a resin, water, and an organic solvent, wherein the water content of the infrared absorption composition is 0.1-3.0 mass%; a film; an optical filter; a solid...
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WO/2023/145974A1 |
[Problem] To provide a film laminate comprising a film and a resin composition layer provided on one surface of said film, wherein when a resin composition is applied to the film and dried, the repellency of the resin composition on the ...
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WO/2023/145972A1 |
Provided is an on-press development type lithographic printing plate precursor having an image recording layer on a support, wherein: the image recording layer contains an infrared absorber A, a borate compound B, an iodonium compound C,...
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WO/2023/145826A1 |
In one aspect, a method for detaching a resin mask is provided, in which the property of detaching a resin mask having a thickness of 100 μm or more is excellent. In one aspect, the present disclosure relates to a method for detaching...
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WO/2023/143887A1 |
A cleaning system for cleaning a component related to a lithographic process such as a pellicle, reticle, wafer or another lithographic component, comprising at least one radiation emitter configured to, in use, irradiate a region of the...
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WO/2023/145703A1 |
The present invention provides a composition for forming a resist underlayer film in which a desired resist pattern can be formed, a method for manufacturing a resist pattern using said composition for forming a resist underlayer film, a...
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WO/2023/144548A1 |
Broadly speaking, embodiments of the present techniques provide an optically- or machine-readable fiducial marker for use in nanoscale applications and a method for automatic detection of a marker. Advantageously, the fiducial marker of ...
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WO/2023/143896A1 |
The disclosure provides a system for holding an object in a semiconductor manufacturing process, the system comprising: at least one pad of dry adhesive material (100), the material having a structured surface, the surface having a struc...
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WO/2023/145535A1 |
This resist composition contains a resin component having a structural unit derived from a compound represented by general formula (a0-1) or a structural unit derived from a compound represented by general formula (a0-2). In the formulae...
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WO/2023/144100A1 |
A dioptric projection lens (PO) for imaging a pattern arranged in an object plane (OS) of the projection lens into an image plane (IS) of the projection lens by means of electromagnetic radiation at an operating wavelength in the ultravi...
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WO/2023/145488A1 |
The present invention provides: an active light sensitive or radiation sensitive resin composition which contains a resin (A) that contains a group which is decomposed by the action of an acid, thereby increasing the polarity, wherein th...
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WO/2023/145156A1 |
The present invention provides: a transfer film having a temporary support, a photosensitive composition layer, and a layer containing a metal salt, in that order; and a method for forming a conductor pattern using said transfer film.
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WO/2023/145537A1 |
The present invention provides a photosensitive resin composition set which is capable of producing an optical waveguide that has a low transmission loss. The present invention provides a photosensitive resin composition set which compri...
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WO/2023/145564A1 |
The present invention provides an active light–sensitive or radiation-sensitive resin composition that includes (A) a resin that is degraded and increases in polarity under the action of acid and (C) a compound that generates an acid a...
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WO/2023/146042A1 |
The present invention relates to a method for fabricating a reentrant structure and a surface having fine irregularities on the top thereof by a simple process using capillary force, the method comprising the steps of: forming a resin la...
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WO/2023/146830A1 |
A photo nanoimprint lithography (P-NIL) resin is disclosed. The P-NIL resin comprises: a cross-linkable organic binder; solvent based inorganic nanoparticles dispersed in the P-NIL resin; and a solvent configured to be evaporated; the P-...
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WO/2023/145178A1 |
The purpose of the present invention is to provide an irradiation unit and a lamp unit, for which lamp replacement work is simplified, and the risk of lamp breakage is reduced. The present invention comprises a lamp unit in which an ex...
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WO/2023/143042A1 |
An exposure apparatus (300), comprising: an exposure device (301) used for exposing a material (30); a feeding device (302) used for continuously conveying the material (30) to an exposure area (301a) of the exposure device (301) at a fi...
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WO/2023/145522A1 |
Provided is a substrate processing method for processing a substrate that has an obverse surface, which is a main surface that is exposed in order to form a pattern, and a reverse surface, which is a main surface on the opposite side fro...
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WO/2023/144993A1 |
This exposure system is able to expose a wafer conveyed from an application device that is able to apply a photosensitizer to the wafer, the exposure system comprising: a holding device that has a first holding unit that holds a first su...
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WO/2023/138251A1 |
The present invention provides a photolithography device, a gas bath apparatus and a gas bath generator thereof. The gas bath generator comprises a closed annular body. The closed annular body is arranged around a working area. An annula...
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WO/2023/140036A1 |
Provided is a silicone chain-containing polymer that functions as a leveling agent which is able to achieve high smoothness and suppress pin unevenness, with respect to a coating film. Specifically, provided is a silicone chain-containin...
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WO/2023/140048A1 |
The objective of the present invention is to provide a coloring composition having good filterability. The present invention relates to a coloring composition containing a coloring agent, a compound represented by formula (PI), a binder ...
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WO/2023/139851A1 |
The purpose of the present invention is to remove a resist film at a lower temperature. A method for processing a substrate comprises: a step for forming a liquid film (101A) of a processing liquid containing sulfuric acid on the upper...
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WO/2023/138851A1 |
A computer-implemented method of generating control actions for controlling a production system, such as by transmitting the control actions to a control system of the production system. The method comprises receiving, by a memory unit, ...
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WO/2023/138916A1 |
The described system comprises an inspection system and associated software. The inspection system comprises a body that is configured to be inserted into a lithography apparatus, engaged by a tool handler of the lithography apparatus, a...
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WO/2023/140087A1 |
Provided is a photosensitive colored resin composition comprising a colorant, an alkali-soluble resin, a photopolymerizable compound, a photoinitiator and a solvent, in which the colorant comprises a lake colorant comprising a triarylmet...
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WO/2023/141035A1 |
In an aspect, a thermosettable composition comprises an imide extended compound and a reactive monomer that is free-radically crosslinkable with the reactive end groups of the imide extended compound to produce a crosslinked network. A t...
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WO/2023/138892A1 |
Systems and methods provide the ability to mitigate linear and/or offset coma present in an objective of a metrology tool. A method of reducing an effect of offset coma in a metrology apparatus includes rotating an objective lens element...
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