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WO/2009/138670A2 |
Method of manufacturing a plate‑type heat exchanger of the type comprising a plurality of plates defining, with lateral bars positioned on the plates, circuits for the circulation of fluids, comprising at least the following successive...
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WO/2009/136079A2 |
The invention relates to a method of manufacturing a plate-type heat exchanger of the type comprising a plurality of plates defining, with lateral bars positioned on the plates, circuits for the circulation of fluids, comprising at least...
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WO/2009/132113A2 |
This invention relates to devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.
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WO/2009/127637A1 |
A reflow soldering furnace and a method for reflow soldering of components (3) disposed on a circuit board (1) in a reflow soldering furnace is described, in which the temperature of the solder points (5) of the individual components (3)...
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WO/2009/104693A1 |
Disclosed is a solder bonding structure that can maintain sufficiently high solder bonding strength and guarantee high bonding reliability even in a severe environment with significantly large temperature differences. Said solder bonding...
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WO/2009/102281A1 |
There is disclosed a solder ball filling apparatus. The apparatus includes a base plate capable of pivoting between a first pivot direction and a second pivot direction opposite to the first pivot direction. A ball grid array template is...
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WO/2009/092937A2 |
The invention relates to a supply device (20) for feeding a gas to a wave brazing or tinning machine, wherein said machine is capable of generating at least one soldering wave, comprising: a gas inlet channel (22), a set of N secondary c...
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WO/2009/078342A1 |
In supplying a flux to a member for heat exchangers which is to be brazed, a given amount of the flux is stably adhered to a brazing area without interposing any substance which becomes unnecessary for the brazing, such as a binder. In p...
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WO/2009/060068A1 |
A method is described for operation of a wave soldering system which has a solder bath (1) filled with a lead-free solder (3), and during operation generates a solder wave (7) with which assemblies (9) passed in sequence over the solder ...
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WO/2009/049573A1 |
The invention relates to a method for interconnecting solar cells for solar modules by means of connecting elements using a connecting device, comprising a transport device, and a feed and joining head (1) to which a holding device (2) a...
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WO/2009/051031A1 |
A method of repair which, when used for bonding a member to a slant part or curved surface with a brazing material, can cause the brazing material in a molten state to remain in the bonding area. The method, which is for repairing, by br...
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WO/2009/041401A1 |
A solder wire free of the problem of deterioration of the flux due to oxidation or water absorption and contrived so that the flux and solder are efficiently prevented from scattering because of abrupt heat application during soldering. ...
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WO/2009/027676A1 |
In a modular soldering apparatus a pump assembly (4) comprising a pump (67, 71) conduit 66 and solder nozzle (92) is removable as a unit and push contacts (42, 52') which are broken by lifting the assembly are provided for the electrical...
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WO/2009/027656A2 |
A fluxer comprises a spray head (15), a reservoir (3) for the flux (9) and a feed line (11) for feeding flux from the reservoir (3) to the spray head (15) by pressurising the reservoir with an air supply via a line (7). A return (12) lin...
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WO/2009/027659A1 |
An impeller type pump (7) in a selective soldering apparatus (1) is positioned so that the surface (S) level of molten solder in the bath adjacent the impeller axle (31) is just below the upper edge (53) of the impeller blades (41). This...
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WO/2009/027651A1 |
A manually operable soldering apparatus comprising a solder bath having a nozzle (92) which is raised to solder a lead or PCB track positioned above the nozzle. A movable frame (28) carries the PCB (30) to be soldered and is mounted to b...
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WO/2009/010029A1 |
The invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is introduced into the covering having a solder materi...
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WO/2009/005174A1 |
Welding equipment includes a torch for irradiating a laser beam (B), wire feeding means (2) for feeding a filler wire (F), and a tracking means (3) for controlling the moving tracks of the torch (1) and the wire feeding means (2) to make...
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WO/2008/156170A1 |
[PROBLEMS] The conventional flux-using reflow soldering has the problem that the substrate of motherboard, printed wiring board, etc. is soiled by the smoke, cinder, etc. generated from the flux, thereby necessitating cleaning operation ...
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WO/2008/155817A1 |
[PROBLEMS] Mixing of lead into a lead-free solder tank must be absolutely avoided. Even when the shape of lead-free stick solder is differentiated from that of lead-containing stick solder, in the event of disposing of a lead-containing ...
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WO/2008/154117A1 |
A wave soldering apparatus includes a solder supply and a first wave soldering nozzle in fluid communication with the solder supply. The first wave soldering nozzle includes a flat plate having a plurality of square-shaped openings forme...
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WO/2008/146815A1 |
[PROBLEMS] In a conventional hot air blowoff heater having hot air outlets being a plurality of holes, hot air blowoff boards provided with large and small holes suitable for heating a printed board are used while being changed properly ...
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WO/2008/148119A1 |
The present application discloses a fixture-free, hands-free soldering apparatus having a base support assembly and a solder assembly. The base support assembly has a base member supporting a power supply and an electronic temperature, t...
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WO/2008/142895A1 |
A device for separating a granular body in which the time required for separating a minute granular body can be significantly shortened. A device for taking out granular bodies B individually from a granular body group consisting of a la...
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WO/2008/139623A1 |
A temperature control device for handling solder comprises a body (10) of the temperature control device for handling solder (1), a rotating shaft (77) built into the body (10) and rotatable about its axis, a set temperature changing mea...
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WO/2008/120299A1 |
A manufacturing device (20) for an electronic device constituted by mounting an electronic part (92) on a substrate (94) comprises a nozzle (36) for containing the electronic part (92) to be processed, a hot air supply unit (38) for supp...
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WO/2008/116859A1 |
The invention relates to a device (11) for the removal of solder residue (17). Open-pored porous material (14) is used for this purpose according to the invention, wherein, for example, the solder residue (17) may be melted using a gas f...
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WO/2008/105443A1 |
Provided are a solder transfer sheet, by which aligning is eliminated and a solder bump is formed with a low-cost means, and a transfer method. The transfer sheet, which has an adhesive layer on a support base material and a solder paste...
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WO/2008/101565A1 |
The invention relates to a soldering tip (1) for a soldering device, which comprises a heat generating or heat conducting base body (4), and which on the outside thereof has a contact surface (11) that can be wetted by solder (12) at lea...
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WO/2008/091751A1 |
A soldering iron (20) includes a handle body (30) having a gripping section for gripping by a user during operation of the soldering iron (20); an electrical cord (28) supplying power to the handle body (30); a soldering tip assembly (90...
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WO/2008/090803A1 |
Provided is a feeding method for feeding conductive balls to the insides of through holes of a mask reliably and efficiently so as to match a fine pitch. In the feeding method, a head (300), which can move over the surface of a feeding m...
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WO/2008/089743A1 |
The invention relates to a method and to a device for contacting a solder ball formation, wherein a plurality of contact mouthpieces (22) arranged in a formation pick up a solder ball formation, which formation is composed according to a...
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WO/2008/086842A1 |
The invention relates to a first device for selective soldering, comprising a container (10) for liquid solder, with a so-called soldering bath (9), with a soldering channel (2) and at least one nozzle (4) mounted on the soldering channe...
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WO/2008/083676A1 |
The invention relates to a method for joining aligned discrete optical elements. The object of the invention is to provide a method by means of which the optical elements can be joined in the aligned state, wherein a thermal connection h...
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WO/2008/076433A1 |
A reflow oven for processing printed boards includes at least one lateral end support chain configured to support a printed circuit board along one of its lateral ends and a board support chain. The lateral end support chain and the boar...
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WO/2008/072330A1 |
An apparatus for precipitating/separating excess copper which has dissolved in a lead-free solder comprising tin as the main ingredient. With the apparatus, the tin is safely and efficiently recovered. The apparatus (1) enables copper wh...
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WO/2008/073723A2 |
An exothermic mini torch includes a torch holder assembly for holding a consumable thermal torch. The torch holder assembly includes a body defining a recess into which the consumable thermal torch is inserted. A passage is defined in th...
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WO/2008/068397A1 |
The present invention relates to a method of brazing two materials (1, 2) together using a filler metal (3), which comprises the following steps: the filler metal is placed between the two contacting materials in a brazing zone where the...
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WO/2008/053899A1 |
Contacts (10, 20) are formed of a metal thin plate including base sections (11, 21), elastic deformation sections (12, 22) and contact sections (13, 23). Recessed sections (15, 25) are formed on the bottom surface of the base section, an...
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WO/2008/036922A2 |
The present invention relates to a soldering device for joining two work pieces and more specifically, a soldering device with two cooperating spring biased jaws adapted to grip a work piece to be joined to a second work piece to uniform...
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WO/2008/034744A1 |
The invention relates to a method and a device for wetting the bumps of a semiconductor chip with a soldering flux, in which a container (4) that receives the soldering flux and is open towards the bottom and a baseplate (2) containing a...
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WO/2008/025764A1 |
A device for wetting the bumps of a semiconductor chip with soldering flux comprises a carrier plate (14) having a front and a back. A steel sheet (15) comprising at least one cavity (3) is detachably connected to the front of the carrie...
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WO/2008/023461A1 |
A soldering iron which prevents scattering of flux and is not likely to clog, and a process of soldering an electronic apparatus in which the amount of solder fed at a time for soldering is made constant and soldering is performed well. ...
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WO/2008/022342A2 |
Methods and devices are provided for improved large-scale solar installations. In one embodiment, a junction-box free photovoltaic module is used comprising of a plurality of photovoltaic cells and a module support layer providing a moun...
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WO/2008/020640A1 |
The present invention may be applied to a drive device, a travel device, and a drive device control method which can be appropriately used, for example, for a robot arm and a twin cycle. By eliminating (reducing) the use of changes excee...
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WO/2008/017367A1 |
The invention relates to a device for the controlled displacement of an upwardly directed (5) spray nozzle to individual spray points which are arranged at a distance from one another, in particular for spraying flux in wave soldering un...
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WO/2008/014900A1 |
The invention relates to a method for fitting a connecting conductor to a photovoltaic solar cell, in which a solder, in particular soft solder, is applied to the solar cell by means of ultrasonic soldering and the connecting conductor i...
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WO/2008/012663A2 |
The above mentioned objects are all achieved by the present air soldering unit (1), comprising a base stand for supporting at least one heating and injection device (4) for heating and injecting at least one air flow over an area to be s...
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WO/2008/006700A1 |
In known wave soldering systems, the liquid solder is usually covered, in order to avoid or at least reduce the drawbacks associated with the oxidation of the solder. For typical tin-lead solder, a simple oil is used as the covering, or ...
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WO/2008/006239A1 |
A photothermic desoldering unit comprises: a unit container(1); an upper cover plate(2), which covers the opening of the unit container, and fixes multiple fans (211,222) under hollow-out parts; a heating cover(4), in which an intake por...
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