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WO/2019/073763A1 |
The present invention provides a cured article that is formed from a cured material obtained by curing a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler and that has a polished surface, wh...
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WO/2019/070819A1 |
A curable composition includes a polyamide composition comprising a polyamide. The polyamide comprises a tertiary amide in the backbone thereof and is amine terminated. The curable composition also comprises an epoxy composition that inc...
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WO/2019/069870A1 |
This curable resin composition satisfies any of (1)-(3). (1) The curable resin composition contains a curable resin component, triphenylphosphine oxide, and a filler, and the triphenylphosphine oxide content is 0.3 mass% or more of the c...
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WO/2019/069866A1 |
Provided are: a curable composition of which a cured product after being cured has high strength, high rigidity and flexibility; and a cured product obtained by curing said composition. The present invention provides a multi-pack type cu...
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WO/2019/064545A1 |
This epoxy resin contains an epoxy compound having two or more mesogenic structures and one or more divalent biphenyl groups.
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WO/2019/065507A1 |
Provided is a thermoplastic polyester elastomer resin composition for foam molding, which contains 0.05-9.5 parts by mass of a crystal nucleating agent (B) and 0-4.5 parts by mass of a thickening agent (C) relative to 100 parts by mass o...
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WO/2019/064544A1 |
Provided is an epoxy resin comprising: an epoxy compound A that has two or more mesogenic structures and one or more phenylene groups; and an epoxy compound B that has two or more mesogenic structures and one or more divalent biphenyl gr...
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WO/2019/065470A1 |
Provided is a resin composition for fiber-reinforced composite materials, which forms a prepreg that has low tack properties and good handling properties, while achieving a good balance between fast curing properties and storage stabilit...
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WO/2019/065246A1 |
This resin composition comprises: a carboxyl group-containing resin; a polyfunctional vinyl ether compound; and a nitrogen-containing heterocyclic compound having three nitrogen atoms.
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WO/2019/065663A1 |
Provided is a curable resin composition suitable for use as a matrix resin for a fiber-reinforced composite material having excellent fatigue resistance, the curable resin composition having, low viscosity, minimal increase in viscosity ...
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WO/2019/065432A1 |
The purpose of the present invention is to provide: a thermosetting resin composition for a fiber-reinforced composite material, the thermosetting resin composition having an excellent balance of rapid curability and storage stability as...
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WO/2019/065552A1 |
Provided are: a phosphorus-containing phenoxy resin having excellent heat resistance, tracking resistance, safety, flame retardancy, processability and heat resistance; and a resin composition using the same. The phosphorus-containing ph...
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WO/2019/065455A1 |
The image display device sealing material according to the present invention contains a resin component and a curing agent. The resin component contains a bisphenol-skeleton-containing phenoxy resin having a weight-average molecular weig...
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WO/2019/064546A1 |
Provided are: (1) an epoxy resin comprising an epoxy compound having two aromatic rings that form a divalent biphenyl structure and mesogenic structures that are bonded to each of the two aromatic rings, at least one of the mesogenic str...
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WO/2019/060513A1 |
Disclosed is a tielayer composition having an epoxy-containing compound, a polythiol curing agent, a curing catalyst, and a solvent present in an amount of at least 25% by weight, based on the total weight of the tielayer composition. Al...
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WO/2019/059384A1 |
This thick copper circuit with attached protective material comprises: thick copper circuits; and a protective material disposed in spaces between the thick copper circuits and containing 55 vol% to 95 vol% of an inorganic filler.
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WO/2019/057601A1 |
The invention relates to an electric insulation material and/or impregnation resin for a wrapping tape insulation and to an insulation system, for example an insulation system for a rotating electric machine, in particular a medium- or h...
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WO/2019/060559A1 |
The present invention is directed toward an adhesive composition comprising: a first component; and a second component that chemically reacts with the first component, the second component comprising: a polythiol curing agent; and an alk...
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WO/2019/058970A1 |
Provided is an epoxy resin obtained by reacting epihalohydrin with a phenol-modified aromatic hydrocarbon-formaldehyde resin obtained by modifying an aromatic hydrocarbon formaldehyde resin with phenols, wherein the epoxy resin has a vis...
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WO/2019/058727A1 |
This conductive composition contains: metal nanoparticles which have an average particle diameter of from 30 nm to 600 nm; metal particles which have a larger average particle diameter than the metal nanoparticles; a thermosetting resin ...
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WO/2019/059183A1 |
Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition i...
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WO/2019/054412A1 |
Provided is a curable composition containing: a multifunctional (meth)acrylate monomer (A), which includes at least two monomers selected from the group consisting of trifunctional (meth)acrylate monomers, quadrafunctional (meth)acrylate...
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WO/2019/054391A1 |
Provided is an epoxy resin composition which exhibits excellent adhesion to copper and aluminum, and which also exhibits excellent flexibility in low-temperature environments. An epoxy resin composition which contains (A) an epoxy resin ...
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WO/2019/054392A1 |
Provided is an epoxy resin composition having excellent adhesiveness to copper and aluminum and, furthermore, having excellent adhesiveness in a low temperature environment. The epoxy resin composition comprises (A) an epoxy resin, and (...
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WO/2019/054187A1 |
Provided are: a liquid-crystalline resin composition for members with sliding/wear resistance which is for use in producing a member with sliding/wear resistance that has adhesive properties and impact resistance which are equal to those...
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WO/2019/055342A1 |
An epoxy oligomerization catalyst can be employed to prepare an epoxy resin employing a method including admixing a first epoxy resin having a first epoxy equivalent weight of from about 100 to about 600 with a diphenolic compound, and a...
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WO/2019/051885A1 |
The present invention provides an epoxy resin material, a preparation method therefor and an application thereof. The present method for preparing an epoxy resin material comprises: heating a mixture of an epoxy resin main agent and a cu...
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WO/2019/054217A1 |
This epoxy resin composition contains an epoxy resin, a curing agent, an inorganic filler, and a silane compound which has a structure wherein a chain hydrocarbon group having 6 or more carbon atoms is bonded to a silicon atom.
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WO/2019/049951A1 |
Provided is an epoxy resin composition including a (meth)acrylic copolymer (A), an epoxy resin (B) and a curing agent (C), wherein the (meth)acrylic copolymer (A) has a constituent unit derived from a macromonomer (a) and a vinyl monomer...
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WO/2019/049797A1 |
Provided is a curable composition which forms a cured product that has excellent fireproof performance, while having excellent shape retainability even in cases where the expansion ratio of the cured product after firing is set to a high...
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WO/2019/041923A1 |
The present disclosure relates to the field of display, and in particular relates to a composition for a flat layer, a preparation method therefor, a flat layer material, and a display substrate comprising the flat layer material, and a ...
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WO/2019/044977A1 |
A resin composition which contains: (A) an epoxy resin that has a repeating unit represented by formula (1), while having a Z-average molecular weight of from 1,400 to 3,000 (inclusive); and (B) a cyanate ester compound. (In formula (1),...
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WO/2019/044813A1 |
[Problem] To provide a polybutylene terephthalate resin composition of superior alkaline solution resistance and hydrolysis resistance, and superior fluidity, as well as a molded article and composite using the same. [Solution] A polybut...
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WO/2019/044133A1 |
A molding composition for SiC and GaN element sealing containing (A) a maleimide resin, (B) a curing agent, (D) a curing accelerator, and (E) a filler, the (E) filler containing (e-1) a hollow structured filler.
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WO/2019/044803A1 |
The present invention addresses the problem of providing a composition which enables the production of a cured product that is capable of achieving a good balance between heat resistance and decrease of elastic modulus, while exhibiting ...
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WO/2019/038216A1 |
The invention relates to the use of a branched polyester having an average of at least 2.8 terminal groups as additive for a curable pre-polymer composition, wherein the branched polyester acts as de-foaming agent.
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WO/2019/033972A1 |
Disclosed in the present invention are a magnet assembly and a preparation method therefor. The magnet assembly is formed by overlapping and adhesively bonding a plurality of magnetic sheets which are made of a rare earth permanent magne...
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WO/2019/036636A1 |
Aspects of the present invention relate to polymers, and particularly to farnesene polymers functionalized with one or more oxirane groups and, optionally, one or more hydroxyl groups. According to one aspect of the invention, provided i...
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WO/2019/035431A1 |
This sealing resin composition satisfies at least any of conditions (1)-(3) below: condition (1) an epoxy resin and an inorganic filler material are included, and the specific surface area of the inorganic filler material is not more tha...
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WO/2019/035430A1 |
This sealing resin composition includes an epoxy resin and an inorganic filler material. The dielectric relaxation value of the sealing resin composition in a cured state is 20 or lower when measured at a frequency of 0.001 Hz.
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WO/2019/031065A1 |
[Problem] To provide an epoxy resin composition capable of forming a cured object which has sufficient flexibility and is inhibited from warping or cracking. [Solution] An epoxy resin composition which comprises a copolymer (A) and an ep...
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WO/2019/031513A1 |
A semiconductor device which comprises: a substrate; a semiconductor element which is arranged on the substrate; a wire which electrically connects the substrate and the semiconductor element with each other; a first sealing layer which ...
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WO/2019/031576A1 |
Provided are: a thermosetting resin composition which is a mixed resin composition containing a benzoxazine compound and an epoxy compound, and which enables the achievement of a cured product of the resin composition having improved hea...
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WO/2019/026784A1 |
Provided is an aromatic polycarbonate resin composition containing 0.01-0.1 part by mass of an alicyclic epoxy compound (B), 0.2-0.6 part by mass of a polyether compound (C) having a polyoxyalkylene structure, and 0.005-1 part by mass of...
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WO/2019/025465A1 |
The present invention relates to foamable heat-curable one-component epoxy resin compositions which contain aerogel particles, can be used in injection-molding processes, have a high stability during the foaming process and at the same t...
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WO/2019/024184A1 |
An epoxy resin curing agent, comprising: a fluorocarbon material and an amine curing agent, wherein the mass fraction of the fluorocarbon material is 0-20wt%, not including 0. The provided epoxy resin curing agent can effectively improve...
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WO/2019/021879A1 |
The purpose of the present invention is to provide an epoxy resin composition and a cured product, each of which has achieved excellent toughness, high bending modulus of elasticity and high bending strength without deteriorating heat re...
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WO/2019/021613A1 |
The present invention provides: a prepreg that yields a carbon-fiber-reinforced composite material having exceptional mode I interlayer toughness, mode II interlayer toughness, and tensile strength; and a carbon-fiber-reinforced composit...
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WO/2019/021944A1 |
Provided are a polymer compound, a composition including the same, a resin composition including these, and a molded body thereof that can sustainably impart a superior antistatic effect to a synthetic resin. This polymer compound is obt...
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WO/2019/017365A1 |
The present invention addresses the problem of providing: an epoxy resin composition which is excellent in terms of both quick curability and storage stability; a prepreg using the epoxy resin composition; and a fiber-reinforced composit...
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