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WO/2019/146532A1 |
Provided is an alkali-soluble resin that is used to obtain an alkali-soluble radiation-sensitive resin composition having excellent alkali solubility and resolution, and developability with a close fit. The present invention pertains to ...
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WO/2019/145352A1 |
The present invention relates to a composition comprising a binder comprising one or more siloxane polymers, silicone resins, silicone based elastomers, and mixtures thereof, wherein said binder optionally comprises one or more cross- li...
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WO/2019/148084A1 |
A process of forming a composite structure by providing a plurality of layers having one or more of a fiber or a fabric; applying a tackifier to each of the layers, the tackifiers comprising sPEKK in amount selected to on provide tackifi...
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WO/2019/146693A1 |
Provided is an aromatic polycarbonate resin composition which comprises an aromatic polycarbonate resin (A), a polyether derivative (B), and a specific aromatic compound (C), wherein the polyether derivative (B) is contained in an amount...
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WO/2019/142646A1 |
According to the present invention, a curable resin composition for case type sealing under no pressure is in a solid state at 25°C and has a gel time of 10 minutes or more at 110°C.
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WO/2019/142752A1 |
Provided is a heat-curable resin composition which rarely undergoes dripping or bleeding even when used for the hole plugging in a printed wiring board which has holes, such as through-holes, each having a large opening size, and is part...
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WO/2019/138919A1 |
This liquid sealing resin composition contains an epoxy resin, an amine-based curing agent, and a cyclic carbodiimide.
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WO/2019/138953A1 |
This composition includes a pigment, a cationic polymer compound, and an acid-generating agent. It is preferred that the pigment includes a tetraaza porphyrin pigment, a triarylmethane pigment or a cyanine pigment. It is preferred that t...
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WO/2019/139354A1 |
The present invention relates to an epoxy resin composition for semiconductor molding, which has excellent heat resistance and mechanical properties and has a low thermal expansion coefficient and thus exhibits an improved bending proper...
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WO/2019/134821A1 |
The invention relates to an epoxy resin composition comprising at least one epoxy liquid resin, bis(aminomethyl)cyclohexane and a wax. The claimed composition can be processed in an excellent manner, cures very rapidly and virtually no y...
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WO/2019/127172A1 |
This invention relates to an epoxy based composition, comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one curing catalyst. The epoxy based composition according to the present inventio...
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WO/2019/133354A1 |
The present invention is directed to multifunctional surfacing films each comprising: (a) a single layer of curable polymer composition having opposing first and second surfaces: (b) a peelable porous sheet disposed at or beneath the sec...
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WO/2019/131095A1 |
An encapsulating epoxy resin composition for ball grid array (BGA) packages which comprises an epoxy resin, a phenolic hardener having a hydroxyl equivalent of 120 g/eq or less, and an inorganic filler comprising alumina particles and si...
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WO/2019/127391A1 |
The present invention relates to a maleimide resin composition and a prepreg, a laminate and a printed circuit board using same. The maleimide resin composition of the present invention comprises: a maleimide compound (A) with a structur...
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WO/2019/131379A1 |
This method for producing an electronic device comprises: a step for preparing a member that is provided with a copper circuit on the surface; a coating step for forming an OSP film on the copper circuit by applying a preflux agent onto ...
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WO/2019/132175A1 |
An epoxy resin composition for encapsulating a semiconductor device, of the present invention, comprises an epoxy resin, a curing agent, inorganic filler and an explosion preventer, wherein the inorganic filler comprises a first inorgani...
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WO/2019/126928A1 |
The present invention provides a thermosetting resin composition, a prepreg, a laminate, and a printed circuit board. The thermosetting resin composition comprises: a thermosetting resin, an inorganic filler, and a porous molybdenum comp...
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WO/2019/130587A1 |
This thermosetting resin composition comprises a thermosetting resin, and a curing agent containing a cationic species represented by general formula (I). In general formula (I), R1 and R2 each independently represent an alkyl group, eac...
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WO/2019/131671A1 |
An encapsulating composition which comprises an epoxy resin, a hardener, and an inorganic filler having a void content of 18 vol% or lower.
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WO/2019/131096A1 |
An encapsulating epoxy resin composition for ball grid array (BGA) packages which comprises an epoxy resin, a hardener, and an inorganic filler comprising alumina particles and silica particles, wherein the content of the inorganic fille...
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WO/2019/127992A1 |
Provided are a prepreg, a composite material prepared from the prepeg and preparation methods therefor and uses thereof. The preparation method for the prepreg comprises: weighing 40-60 parts of an epoxy resin, 2-8 parts of a compatibili...
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WO/2019/133482A1 |
An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein t...
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WO/2019/131332A1 |
The first problem addressed by the present invention is to provide a composition which can yield a cured product (a thermally conductive material) with excellent thermal conductivity. The second problem addressed by the present invention...
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WO/2019/127095A1 |
Provided are a phosphorous-containing silicon active ester and a preparation method therefor, a flame retardant resin composition, a prepreg and a metal foil-clad laminate. The phosphorous-containing silicon active ester of the present i...
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WO/2019/131669A1 |
This sealing composition contains an epoxy resin, a curing agent, and an inorganic filler material. The particle size distribution of the inorganic filler material has at least three peaks, and the inorganic filler material includes alum...
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WO/2019/127389A1 |
The present invention relates to an epoxy resin composition, and a prepreg, a laminate and a printed circuit board using the same. The epoxy resin composition of the present invention comprises an epoxy resin (A), a maleimide compound (B...
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WO/2019/131097A1 |
An encapsulating epoxy resin composition for ball grid array (BGA) packages which comprises: one or more epoxy resins comprising a bisphenol F type epoxy resin; a hardener; an inorganic filler that comprises alumina particles but include...
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WO/2019/127093A1 |
Provided are a reactive phosphorous-containing silicon flame retardant, a preparation method therefor, a flame retardant resin composition, a prepreg and a metal foil-clad laminate. The reactive phosphorous-containing silicon flame retar...
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WO/2019/128257A1 |
Provided are a curable resin composition from which a cured article can be obtained with excellent resistance to welding and thermal performance and also excellent flexibility and warpage, a dry film, a cured article, and a printed circu...
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WO/2019/131574A1 |
A resin composition including at least an organic resin wherein the resin composition has physical property parameters specified by a storage modulus of a predetermined temperature and a glass transition temperature that satisfy predeter...
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WO/2019/127388A1 |
The present invention provides a resin composition. The prepreg, the laminate, and the metal foil-coated laminate prepared by using the resin composition have good heat resistance, heat and humidity resistance, and low coefficient of the...
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WO/2019/131670A1 |
This sealing composition comprises an epoxy resin, a curing agent, an alumina-containing inorganic filler, and a tertiary phosphine oxide or alumina fluidization agent.
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WO/2019/124256A1 |
This liquid crystalline polyester composition comprises: a liquid crystalline polyester; an olefin copolymer containing a repeating unit derived from an α-olefin, and a repeating unit derived from a glycidyl ester of an α,β-unsaturate...
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WO/2019/124192A1 |
The purpose of the present invention is to improve storage stability of a resin composition used for applications such as semiconductor sealing materials. Provided is a resin composition, comprising: (A) an epoxy resin; (B) a curing agen...
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WO/2019/124249A1 |
A liquid-crystal polyester composition including a liquid-crystal polyester and an olefin copolymer including repeating units from an α-olefin and repeating units from an α,β-unsaturated acid glycidyl ester; the content of liquid-crys...
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WO/2019/123934A1 |
Provided is an epoxy resin composition which has high adhesion strength and improved interfacial adhesiveness. The epoxy resin composition comprises an alkoxysilyl-modified polymer (A) containing at least two alkoxysilyl groups in the mo...
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WO/2019/124232A1 |
Provided are a photocurable resin composition that can be suitably used in an optical three-dimensional shaping method, a cured product obtained by photocuring the photocurable resin composition, and a three-dimensional object comprising...
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WO/2019/124476A1 |
The purpose of the present invention is to provide a curable epoxy resin composition capable of producing a cured product which is suitable for compression molding and has high light reflectivity, excellent heat resistance and light resi...
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WO/2019/123941A1 |
The present invention provides an epoxy compound A represented by formula (1). (In formula (1), each Ar independently represents a structure having an aromatic ring having an unsubstituted or substituted group, R1 and R2 each independent...
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WO/2019/122575A1 |
The invention relates to a rubber composition based on at least one elastomer and at least one phenolic compound, the aromatic ring of said phenolic compound being substituted with at least one substituent comprising an oxygen atom, the ...
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WO/2019/124391A1 |
This sealing composition contains an epoxy resin, a curing agent, and an inorganic filler that includes particles of an inorganic material having a Mohs hardness of 8 or higher and particles of an inorganic material having a Mohs hardnes...
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WO/2019/126073A1 |
A curable epoxy system useful in the production of composites capable of being used in various industries, including, for example, the aerospace industry. In particular, the present disclosure relates to a curable epoxy system comprising...
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WO/2019/122272A1 |
This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest c...
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WO/2019/125296A1 |
The present invention refers to a hybrid photopolymer composition for additive manufacturing, - comprising 50-95% by weight of a free radically curable- component, farther comprising at least one (meth)acrylate monomer or oligomer, 5-49%...
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WO/2019/113699A1 |
The present invention therefore relates to a composite comprising a matrix of a thermosetting or thermoplastic polymer, at least one insulating filler dispersed in the matrix and at least one filler with nonlinear conductivity dispersed ...
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WO/2019/117452A1 |
The present invention relates to an epoxy resin composition for sealing a semiconductor device and a semiconductor device sealed using the same, wherein the epoxy resin composition comprises: an epoxy resin; a curing agent; a filler; and...
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WO/2019/116787A1 |
Provided is a thermosetting conductive paste which is able to be processed at low temperatures (for example, at 250°C or less), and which enables the achievement of a conductive film that has low resistivity. A conductive paste which co...
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WO/2019/115912A1 |
The invention relates to an insulation product comprising mineral fibers and a binder obtained by curing a binding compound, comprising as components: a) compounds comprising at least one epoxy function, including at least one epoxy prec...
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WO/2019/117305A1 |
The polymerizable composition for optical materials of the present invention includes a polyester polyol (a), a compound (b) of which light absorption characteristics vary by sensing changes in environment; and a polymerization reactive ...
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WO/2019/116955A1 |
Provided are a resin composition for forming a varistor and a varistor capable of increasing freedom in the design of substrates, ICs, or electronics. The resin composition for forming a varistor includes (A) an epoxy resin, (B) a curing...
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